Infineon Technologies CY7C1061GN30-10ZXIT
- Part No.:
- CY7C1061GN30-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY7C1061GN30-10ZXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:1,230
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1061GN30-10ZXIT from Cypress Semiconductor is a 16-Mbit (1,048,576 × 16) asynchronous CMOS static RAM with 10 ns access time, 2.2–3.6 V supply operation, TTL-compatible I/O, and dual chip enable (CE1/CE2) for flexible memory expansion. It supports byte-wide writes via BHE/BLE controls and automatic power-down when deselected, deployed in industrial embedded controllers requiring deterministic low-latency data storage.
For engineers reviewing the CY7C1061GN30-10ZXIT datasheet, CY7C1061GN30-10ZXIT pinout, CY7C1061GN30-10ZXIT application, or CY7C1061GN30-10ZXIT equivalent, key selection criteria include tAA = 10 ns access timing, ISB2 = 20 µA typical standby current, VCC range of 2.2–3.6 V, dual CE architecture, and 48-ball VFBGA (8 × 9.5 × 1 mm) package compatibility with high-density PCB layouts.
Technical Context
This SRAM implements a full asynchronous interface with independent byte write enables (BHE/BLE) enabling 8-bit sub-word writes without read-modify-write cycles. Its dual chip enable logic (CE1 LOW + CE2 HIGH = active) allows hierarchical memory banking and seamless expansion beyond 16 Mbit using address mirroring.
The device uses standard CMOS six-transistor memory cells with 1.0 V data retention capability and automatic CE-driven power-down mode that reduces ICC to 20 µA (typ) when deselected-critical for battery-backed systems and low-power industrial monitoring nodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1,048,576 words × 16 bits - delivers 2 MB total capacity with parallel 16-bit data bus interface |
| Access Time (tAA) | 10 ns - guarantees deterministic read latency under worst-case industrial temperature and voltage conditions |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails without level-shifting |
| Standby Current (ISB2) | 20 µA (typ) - enables ultra-low-power hold mode during processor sleep states |
| Data Retention Voltage | 1.0 V - maintains stored data during brown-out or backup battery operation |
| I/O Compatibility | TTL input thresholds and output drive - interoperable with legacy microcontrollers and FPGAs without interface logic |
| Package | 48-ball VFBGA (8 × 9.5 × 1 mm, BVXI grade) - surface-mount footprint optimized for compact industrial PCBs |
Pinout & Package
48-ball VFBGA (8 × 9.5 × 1 mm, Package Grade ID: BVXI) with 0.5 mm ball pitch; RoHS-compliant, lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A19 | Address Inputs | 20-bit address bus supporting full 1M-word addressing; no internal latching - requires stable address during CE/OE assertion |
| I/O0–I/O7 | Lower Byte Data I/O | Bi-directional 8-bit data path enabled only when BLE = LOW; high-impedance when deselected or during write |
| I/O8–I/O15 | Upper Byte Data I/O | Bi-directional 8-bit data path enabled only when BHE = LOW; isolated from lower byte for independent 8-bit operations |
| CE1, CE2 | Dual Chip Enable Inputs | Active-Low CE1 and Active-High CE2 form logical CE = CE1 AND NOT(CE2); enables hierarchical decode and multi-SRAM bank selection |
| WE | Write Enable | Active-Low control initiating write cycle; forces I/O pins to input mode and gates write drivers |
| OE | Output Enable | Active-Low control enabling read data onto I/O pins; does not affect write path or byte enables |
| BLE, BHE | Byte Low/High Enable | Independent active-Low controls for lower/upper 8-bit data lanes; allow partial writes without disturbing adjacent bytes |
| VCC, VSS | Power Supply | Separate 2.2–3.6 V core supply (VCC) and ground (VSS); decoupling required per JEDEC VFBGA layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Architecture | Enables scalable memory mapping across multiple SRAM devices using shared address/data buses and discrete CE decoding |
| Byte-Wide Write Control (BHE/BLE) | Eliminates need for external byte masking logic and avoids destructive read-modify-write sequences during 8-bit updates |
| 10 ns Access Time at Full Voltage Range | Meets real-time deterministic timing requirements for industrial PLC scan cycles and motion controller buffer access |
| 20 µA Typical Standby Current (ISB2) | Reduces system-level quiescent power by >95% versus standard CMOS SRAMs, extending battery life in portable HMI units |
| 1.0 V Data Retention | Preserves configuration and state data during extended power loss events without supplemental backup capacitors or batteries |
Applications
| Industrial PLC Data Buffer | Medical Imaging Frame Store |
|---|---|
Use Scenario: Stores real-time I/O scan data and ladder logic variables in programmable logic controllers operating at –40 °C to +85 °C. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state read/write access to volatile process data with deterministic 10 ns latency. Use Value: Enables sub-millisecond PLC scan cycles without DMA arbitration delays or cache coherency overhead. | Use Scenario: Holds uncompressed 16-bit grayscale image frames (e.g., ultrasound or endoscopy) during acquisition and preprocessing in portable diagnostic devices. IC Role / Device Role / Timing Role: High-bandwidth parallel memory buffer interfacing directly to image sensor controllers and FPGA-based pixel pipelines. Use Value: Sustains 100 MHz burst reads/writes to support real-time frame buffering at >30 fps with minimal external logic. |
| Avionics Display Memory | Test Equipment Pattern Generator |
Use Scenario: Stores display list instructions and pixel attribute tables in ruggedized cockpit multifunction displays subject to EMI and thermal cycling. IC Role / Device Role / Timing Role: Radiation-tolerant (non-FLASH) volatile memory holding critical UI rendering data with guaranteed 10 ns access under voltage droop. Use Value: Prevents display corruption during transient power sags by maintaining valid data at VCC ≥ 2.2 V and retaining state down to 1.0 V. | Use Scenario: Generates precise digital stimulus patterns for semiconductor ATE systems requiring repeatable, glitch-free waveform output. IC Role / Device Role / Timing Role: Static pattern store accessed synchronously by high-speed pattern sequencers with strict setup/hold timing margins. Use Value: Delivers jitter-free 10 ns address-to-data propagation, eliminating pattern skew across 16-bit parallel outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102416BLL-10MLI | Same 1M × 16 organization, 10 ns access, but single CE input and no BHE/BLE; 48-pin TSOP I package | Lacks byte-write granularity; requires external logic for 8-bit updates; better suited for cost-sensitive consumer designs | Select when board space permits TSOP I and byte masking is handled in FPGA or MCU firmware |
| ON Semiconductor MC14LC5517FN | 512K × 16, 15 ns access, 4.5–5.5 V operation; obsolete industrial-grade part with limited availability | Higher voltage, lower density, slower timing; incompatible with 3.3 V systems without level translation | Only consider for legacy repair or drop-in replacement in existing 5 V designs with verified timing margin |
Compared with IS61WV102416BLL-10MLI and MC14LC5517FN, CY7C1061GN30-10ZXIT provides superior byte-select flexibility, lower operating voltage, and modern VFBGA packaging-making it optimal for new industrial and medical designs demanding compact size, low power, and deterministic timing.
Availability
CY7C1061GN30-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, medical imaging frame stores, and avionics display memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1061GN30-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and IoT applications.
CY7C1061GN30-10ZXIT belongs to Cypress's high-speed asynchronous SRAM product line, engineered for deterministic low-latency data storage in real-time embedded systems where predictability and reliability outweigh density or cost optimization.
FAQ
What is the maximum clock frequency supported by CY7C1061GN30-10ZXIT?
This is an asynchronous SRAM and does not use a clock signal. Its performance is defined by access time (tAA = 10 ns), cycle time (tRC = 10 ns), and setup/hold timing for address, CE, WE, and OE. System timing is governed by these parameters-not a clock frequency-enabling direct interfacing with microcontrollers and FPGAs without synchronization logic.
Does CY7C1061GN30-10ZXIT support independent 8-bit writes without read-modify-write?
Yes. The device features dedicated Byte Low Enable (BLE) and Byte High Enable (BHE) inputs. Asserting BLE = LOW writes only I/O0–I/O7; asserting BHE = LOW writes only I/O8–I/O15. Both can be asserted simultaneously for full 16-bit writes, eliminating the need for external masking or destructive read-modify-write sequences.
Can CY7C1061GN30-10ZXIT operate at 1.8 V?
No. The specified minimum VCC is 2.2 V per the datasheet's Operating Range table. While some units may function at 1.8 V, it violates the guaranteed specification and risks timing violations, increased standby current, or data retention failure. Use only within the validated 2.2–3.6 V range for industrial applications.
Is the 48-ball VFBGA package (BVXI) lead-free and RoHS compliant?
Yes. The "X" suffix in BVXI denotes lead-free (Pb-free) construction, and the device complies with RoHS Directive 2011/65/EU. The package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) handling requirements.
CY7C1061GN30-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 1M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSOP I
CY7C1061GN30-10ZXIT FAQ
1.How can I place an order for CY7C1061GN30-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1061GN30-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1061GN30-10ZXIT reliable?
The price and inventory of CY7C1061GN30-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1061GN30-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1061GN30-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1061GN30-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1061GN30-10ZXIT?
CY7C1061GN30-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1061GN30-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1061GN30-10ZXIT?
For technical support, including CY7C1061GN30-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1061GN30-10ZXIT requirements.
6.How does Aetrix verify that CY7C1061GN30-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1061GN30-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1061GN30-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1061GN30-10ZXIT?
All CY7C1061GN30-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1061GN30-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1061GN30-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C1061GN30-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1061GN30-10ZXIT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

