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Infineon Technologies CY7C1062AV33-10BGI
- Part No.:
- CY7C1062AV33-10BGI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1062AV33-10BGI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,302
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Product details
Overview
CY7C1062AV33-10BGI from Cypress Semiconductor is a 524,288 × 32-bit (16-Mbit) high-speed CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, and automatic CE power-down mode. It supports byte-selectable read/write via four independent byte enables (BA–BD), operates across –40°C to +85°C industrial temperature range, and is packaged in a 119-ball PBGA for embedded controller memory buffering and FPGA configuration storage.
For engineers reviewing the CY7C1062AV33-10BGI datasheet, CY7C1062AV33-10BGI pinout, CY7C1062AV33-10BGI application, or CY7C1062AV33-10BGI equivalent, key selection criteria include tAA = 10 ns timing, 4-byte parallel I/O architecture, industrial-grade temperature support, low standby current (50 mA), and PBGA thermal/mechanical compatibility with high-density PCB layouts.
Technical Context
The CY7C1062AV33-10BGI implements a full 32-bit parallel SRAM interface with independent byte enable control (BA–BD), enabling selective 8-bit writes without disturbing adjacent bytes. Its triple chip enable (CE1/CE2/CE3) logic allows hierarchical memory banking and seamless expansion in multi-chip systems.
It features TTL-compatible input thresholds (VIH = 2.0 V min, VIL = 0.8 V max), 5 pF output capacitance, and automatic power-down when any CE is deasserted - reducing ICC to 50 mA while retaining data at 2.0 V VCCDR. The internal voltage regulator ensures stable core operation during VDD transitions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 524,288 words × 32 bits (16 Mbit total); enables full-word or byte-granular access without external masking logic. |
| Access Time (tAA) | 10 ns max; guarantees deterministic read latency for real-time DSP and microcontroller cache applications. |
| Supply Voltage | 3.3 V ±0.3 V; compatible with standard LVTTL and 3.3 V FPGA I/O banks without level-shifting. |
| Operating Temperature | –40°C to +85°C; qualified for industrial control, motor drives, and outdoor communications equipment. |
| Standby Current (ISB2) | 50 mA max (CMOS inputs); enables low-power sleep modes in battery-backed or energy-constrained systems. |
| Data Retention Voltage | 2.0 V minimum; preserves stored contents during brown-out or controlled power-down sequences. |
| I/O Capacitance | 10 pF max per I/O pin; minimizes signal integrity degradation and timing skew on high-speed 32-bit buses. |
Pinout & Package
Package: 119-ball PBGA (14 mm × 22 mm × 2.4 mm, pitch 1.0 mm), RoHS-compliant with exposed thermal pad (VSS-connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 524K-word addressing; no external address latching required. |
| I/O0–I/O31 | Bi-directional Data Bus | 32-bit parallel interface with true high-impedance tri-state control per byte group via BA–BD. |
| BA–BD | Byte Enable Inputs | Four independent active-low enables for selective 8-bit write/read; eliminates need for external byte demux. |
| CE1, CE2, CE3 | Chip Enable Inputs | Three-level hierarchical enable logic enabling bank selection, memory mapping, and power-gating granularity. |
| WE | Write Enable Input | Active-low synchronous write strobe; combined with CE asserts initiates write cycle with tPWE ≥ 7 ns minimum. |
| OE | Output Enable Input | Active-low control for output buffer enable; decouples read timing from chip select for pipelined bus architectures. |
Key Features
| Feature | Design Value |
|---|---|
| Byte-selectable 32-bit I/O | Four independent byte enables (BA–BD) allow concurrent access to four 8-bit subwords without bus contention or extra logic. |
| Triple chip enable architecture | CE1/CE2/CE3 support daisy-chained or decoded memory maps, enabling up to 8 banks in a single address space. |
| Automatic CE power-down | Reduces ICC to 50 mA when any CE is HIGH; eliminates need for external power management circuitry. |
| TTL-compatible interface | VIH/VIL thresholds match legacy 3.3 V logic families, ensuring interoperability with microcontrollers and FPGAs without level shifters. |
| 2.0 V data retention | Maintains valid memory contents during brown-out or backup battery operation, critical for nonvolatile state preservation. |
Applications
| Industrial PLC Memory Buffer | FPGA Configuration Storage |
|---|---|
Use Scenario: Real-time I/O scanning and tag database caching in programmable logic controllers with deterministic scan cycles. IC Role / Device Role / Timing Role: High-bandwidth, low-latency scratchpad memory interfaced directly to ARM Cortex-M7 or RISC-V MCU bus. Use Value: 10 ns tAA ensures sub-microsecond register updates; byte enables reduce bus turnaround overhead during partial tag writes. |
Use Scenario: Storing bitstream configuration data for Xilinx Artix-7 or Intel Cyclone V FPGAs during cold boot or dynamic reconfiguration. IC Role / Device Role / Timing Role: Parallel SRAM acting as configuration ROM with fast random-access read capability for bitstream streaming. Use Value: 32-bit wide interface matches FPGA configuration bus width; PBGA package supports fine-pitch routing near FPGA BGA pads. |
| Telecom Line Card Packet Buffer | Automotive ADAS Sensor Fusion Cache |
Use Scenario: Temporary packet buffering in Ethernet switch line cards handling 1 Gbps+ traffic with bursty ingress/egress patterns. IC Role / Device Role / Timing Role: Dual-port-capable SRAM used as first-in-first-out (FIFO) buffer between MAC and PHY layers. Use Value: Automatic CE power-down cuts idle power by >90% during low-traffic intervals; 119-ball PBGA provides thermal stability under sustained load. |
Use Scenario: Intermediate data staging between radar, camera, and IMU sensors prior to fusion algorithm execution in autonomous driving ECUs. IC Role / Device Role / Timing Role: Low-latency shared memory accessed concurrently by multiple sensor interface controllers (e.g., MIPI CSI-2, CAN FD, SPI). Use Value: Industrial temperature rating (–40°C to +85°C) ensures reliability in engine bay-mounted modules; byte enables isolate sensor-specific data lanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-10MLI | Same 1024K × 32 organization, 10 ns access, but uses 100-pin TQFP; lacks triple CE and byte-enable flexibility. | Preferred for cost-sensitive, lower-density designs where board space permits larger footprint and simpler enable logic. | Select when footprint constraints favor TQFP and hierarchical memory mapping is unnecessary. |
| Microchip 23LC1024-I/P | Serial SPI interface (not parallel); 1 Mbit density; 20 MHz max clock; no byte enables or CE hierarchy. | Suitable only for low-bandwidth, space-constrained applications where serial interface suffices and latency <100 ns is acceptable. | Choose only if system bus is SPI-based and bandwidth requirements are ≤10 MB/s - not a functional replacement. |
Compared with IS61WV102432BLL-10MLI, the CY7C1062AV33-10BGI offers superior memory expansion control via CE1/CE2/CE3 and finer-grained write granularity via BA–BD; versus 23LC1024-I/P, it delivers 16× higher bandwidth and deterministic sub-10 ns latency essential for real-time embedded systems.
Availability
CY7C1062AV33-10BGI is available at Aetrix Electronics and suitable for industrial PLCs, FPGA configuration systems, telecom line cards, and automotive ADAS modules requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1062AV33-10BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable logic solutions for industrial, automotive, and communications markets.
The CY7C1062AV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic latency, low-power standby, and robust thermal performance in mission-critical embedded memory subsystems.
FAQ
What is the maximum operating current for CY7C1062AV33-10BGI at 10 ns speed?
The maximum operating current (ICC) is 275 mA under industrial conditions (–40°C to +85°C) at fMAX = 1/tRC = 100 MHz, measured with VCC = 3.6 V and all I/Os loaded per AC test conditions. This value reflects worst-case dynamic power during continuous read/write cycling.
Can CY7C1062AV33-10BGI operate with only CE1 asserted while CE2 and CE3 are HIGH?
No - the device requires CE1, CE2, and CE3 all LOW to enable memory access. If any of CE1, CE2, or CE3 is HIGH, the chip enters automatic power-down mode regardless of OE or WE state, placing all I/Os in high-impedance.
Is the 119-ball PBGA package lead-free?
No - the "BGI" suffix denotes industrial temperature grade with standard SnPb (lead-based) solder balls. Cypress offered Pb-free variants under "BGIT" or "BGL" suffixes; CY7C1062AV33-10BGI is explicitly non-Pb-free per ordering information and package diagram notes.
How does data retention work when VCC drops below 3.0 V?
When VCC falls below 3.0 V but remains ≥2.0 V, the device enters data retention mode: internal circuitry powers down except for memory cell biasing, maintaining stored data indefinitely. Below 2.0 V, data retention is not guaranteed per specification.
CY7C1062AV33-10BGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1062AV33-10BGI FAQ
1.How can I place an order for CY7C1062AV33-10BGI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1062AV33-10BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1062AV33-10BGI reliable?
The price and inventory of CY7C1062AV33-10BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062AV33-10BGI is usually 5 days.
3.What payment methods are accepted for CY7C1062AV33-10BGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062AV33-10BGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1062AV33-10BGI?
CY7C1062AV33-10BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1062AV33-10BGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1062AV33-10BGI?
For technical support, including CY7C1062AV33-10BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062AV33-10BGI requirements.
6.How does Aetrix verify that CY7C1062AV33-10BGI is sourced from the original manufacturer or authorized distributors?
All CY7C1062AV33-10BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062AV33-10BGI meets industry standards.
7.What is the process for return or replacement of CY7C1062AV33-10BGI?
All CY7C1062AV33-10BGI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062AV33-10BGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1062AV33-10BGI part is unused and in its original packaging.
Return procedure for CY7C1062AV33-10BGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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