My Inquiry
My Account
Infineon Technologies CY7C1062DV33-10BGIT
- Part No.:
- CY7C1062DV33-10BGIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1062DV33-10BGIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,981
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1062DV33-10BGIT from Cypress Semiconductor is a 16-Mbit (512K × 32) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V supply, TTL-compatible I/O, and automatic CE power-down. It supports byte-wide writes via four independent byte enables (BA–BD) and operates across –40°C to +85°C for industrial embedded memory buffering.
For engineers reviewing the CY7C1062DV33-10BGIT datasheet, CY7C1062DV33-10BGIT pinout, CY7C1062DV33-10BGIT application, or CY7C1062DV33-10BGIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 25 mA standby current, 119-ball PBGA package compatibility, and 512K × 32 word organization for high-bandwidth data caching in legacy controller interfaces.
Technical Context
The device implements a full asynchronous SRAM architecture with three independent chip enables (CE1/CE2/CE3) enabling hierarchical memory mapping and seamless expansion. Read and write operations are controlled by OE and WE, respectively, with output enable priority over write enable during bus contention.
Four byte-enable inputs (BA–BD) gate access to each 8-bit segment of the 32-bit I/O bus, allowing partial-word writes without read-modify-write cycles. Data retention at 2.0 V is supported with automatic transition into low-power mode when all CE signals are deasserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 32 bits - provides 2 MB total capacity with native 32-bit parallel interface |
| Access Time (tAA) | 10 ns - enables direct interfacing with 100 MHz microcontrollers without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and 3.3 V logic families |
| Standby Current (ISB2) | 25 mA - ensures low-power hold mode during processor sleep in battery-backed systems |
| Data Retention Voltage | 2.0 V - maintains stored contents during brown-out or backup-battery operation |
| Operating Temperature | –40°C to +85°C - qualified for industrial control and automotive under-hood auxiliary modules |
| I/O Compatibility | TTL input thresholds and output drive - eliminates level-shifter requirements in mixed-voltage designs |
Pinout & Package
Package: 119-ball plastic ball grid array (PBGA), RoHS-compliant, 15 mm × 15 mm footprint with 1.0 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 524,288 word locations (219) |
| I/O0–I/O31 | Bidirectional Data Bus | 32-bit parallel interface segmented into four 8-bit bytes controlled by BA–BD |
| CE1, CE2, CE3 | Chip Enable Inputs | Three independent enables allow bank selection and hierarchical decoding without external logic |
| WE | Write Enable | Active-low signal initiating write cycle; overrides OE during simultaneous assertion |
| OE | Output Enable | Active-low signal enabling read data onto I/O bus; high-Z when deasserted |
| BA–BD | Byte Enable Inputs | Four independent controls for selective 8-bit writes to I/O0–7, I/O8–15, I/O16–23, I/O24–31 |
| VDD, VSS | Power and Ground | Dual VDD (3.3 V) and multiple VSS balls ensure stable core and I/O rail decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Automatic CE Power-Down | Reduces ICC to 25 mA when any CE is HIGH - eliminates need for external power-gating logic |
| Byte-Selectable Write Architecture | BA–BD enable true 8-bit granularity writes without read-modify-write overhead |
| TTL-Compatible I/O | Supports direct connection to legacy 5 V-tolerant microcontrollers and FPGAs without level shifters |
| 10 ns Access Time | Meets timing closure for 100 MHz bus interfaces with zero wait-state operation |
| 2.0 V Data Retention | Maintains memory state during brown-out or backup power transitions - critical for nonvolatile logging |
Applications
| Industrial PLC Data Buffering | Legacy Embedded Controller Cache |
|---|---|
Use Scenario: Real-time I/O scan buffers in programmable logic controllers require fast, reliable temporary storage for sensor/actuator data between scan cycles. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state 32-bit parallel access to support deterministic 10 µs scan intervals. Use Value: 10 ns tAA and 512K × 32 organization deliver sufficient bandwidth and depth to buffer full I/O image without DMA bottlenecks. | Use Scenario: Microcontroller-based test equipment uses external memory to store waveform capture buffers and calibration tables. IC Role / Device Role / Timing Role: High-speed static RAM interfaced directly to 8051 or ColdFire derivatives via 32-bit data bus and discrete address lines. Use Value: TTL-compatible I/O and 3.3 V operation eliminate level translation, reducing BOM count and layout complexity. |
| Avionics Health Monitoring Log | Medical Imaging Frame Store |
Use Scenario: Flight data recorders log sensor telemetry during power interruptions; memory must retain data at reduced voltage. IC Role / Device Role / Timing Role: Nonvolatile-capable SRAM operating in data retention mode at 2.0 V during main power loss. Use Value: Guaranteed 2.0 V data retention with automatic CE power-down ensures integrity of last 512K samples without backup capacitor oversizing. | Use Scenario: Ultrasound machines acquire real-time RF echo data requiring burst-mode frame storage before DSP processing. IC Role / Device Role / Timing Role: High-bandwidth buffer staging raw 12-bit pixel data from ADCs prior to compression and display rendering. Use Value: 32-bit bus width and 10 ns access enable 320 MB/s peak throughput - sufficient for 1080p@60fps raw video ingestion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-10TIN | 512K × 32, 10 ns, 3.3 V, 100-ball TQFP - lacks triple CE and byte-enable granularity | Requires external address decoding logic for bank selection; no native support for partial-byte writes | Select when board space constraints favor TQFP and simplified enable logic suffices |
| IS61LV51232-10ML | 512K × 32, 10 ns, 3.3 V, 119-ball PBGA - single CE, no BC/BD byte enables | Supports only full-word writes; requires software-managed read-modify-write for byte updates | Choose for cost-sensitive designs where byte-select functionality is unused |
Compared with AS7C3256A-10TIN and IS61LV51232-10ML, CY7C1062DV33-10BGIT uniquely delivers triple CE decoding and four independent byte enables in the same 119-ball PBGA footprint - essential for memory-mapped peripherals and multi-master bus arbitration.
Availability
CY7C1062DV33-10BGIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy embedded controller cache, avionics health monitoring log, and medical imaging frame store applications requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1062DV33-10BGIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and programmable system-on-chip solutions for industrial, automotive, and consumer markets.
This device belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for legacy bus interfaces requiring pin-compatible drop-in replacements with guaranteed timing and industrial temperature support.
FAQ
Is CY7C1062DV33-10BGIT still in production?
No - Cypress discontinued this part in 2018. However, Aetrix Electronics maintains verified, traceable inventory of original-packaged units with full lot traceability and extended lifecycle support documentation. All units undergo electrical verification per Rev. *J specification before shipment.
Can CY7C1062DV33-10BGIT operate with 2.5 V supply?
No - the device is specified only for 3.3 V ±0.3 V operation (3.0 V to 3.6 V). Operation below 3.0 V violates the minimum VCC requirement and may result in data corruption or failure to meet tAA = 10 ns timing. Data retention at 2.0 V applies only during powered-down hold mode, not active operation.
What is the function of CE1, CE2, and CE3 together?
All three CE signals must be LOW to enable memory access. They serve as hierarchical chip select inputs: CE1 typically connects to CPU address decode, CE2 to peripheral select, and CE3 to board-level enable - allowing flexible memory mapping without external AND gates. Any CE HIGH forces automatic power-down.
Does this SRAM support synchronous burst reads?
No - CY7C1062DV33-10BGIT is strictly asynchronous. It has no clock input, no burst counter, and no internal address increment logic. All reads and writes are initiated by edge-triggered CE/OE/WE transitions with address held stable for tAA and tAW durations as defined in the AC switching table.
CY7C1062DV33-10BGIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1062DV33-10BGIT FAQ
1.How can I place an order for CY7C1062DV33-10BGIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1062DV33-10BGIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1062DV33-10BGIT reliable?
The price and inventory of CY7C1062DV33-10BGIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062DV33-10BGIT is usually 5 days.
3.What payment methods are accepted for CY7C1062DV33-10BGIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062DV33-10BGIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1062DV33-10BGIT?
CY7C1062DV33-10BGIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1062DV33-10BGIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1062DV33-10BGIT?
For technical support, including CY7C1062DV33-10BGIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062DV33-10BGIT requirements.
6.How does Aetrix verify that CY7C1062DV33-10BGIT is sourced from the original manufacturer or authorized distributors?
All CY7C1062DV33-10BGIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062DV33-10BGIT meets industry standards.
7.What is the process for return or replacement of CY7C1062DV33-10BGIT?
All CY7C1062DV33-10BGIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062DV33-10BGIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1062DV33-10BGIT part is unused and in its original packaging.
Return procedure for CY7C1062DV33-10BGIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1062DV33-10BGIT Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
