Infineon Technologies CY7C1062DV33-10BGXIT

Overview

CY7C1062DV33-10BGXIT from Cypress Semiconductor is a 16-Mbit (512K × 32) high-speed CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, and automatic CE power-down mode. It supports byte-selectable 32-bit I/O via four independent byte enables (BA–BD), operates across –40°C to +85°C, and retains data at 2.0 V - deployed in industrial embedded controllers requiring deterministic low-latency memory access.

For engineers reviewing the CY7C1062DV33-10BGXIT datasheet, CY7C1062DV33-10BGXIT pinout, CY7C1062DV33-10BGXIT application, or CY7C1062DV33-10BGXIT equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 25 mA standby current, 119-ball PBGA package compatibility, and multi-chip enable (CE1/CE2/CE3) support for scalable memory expansion.

Technical Context

This SRAM implements a synchronous, non-volatile-retentive 524,288 × 32-bit array with TTL-compatible inputs/outputs and full CMOS-level signaling. Its control logic decodes three independent chip enables (CE1, CE2, CE3) and four byte enables (BA–BD) to gate 32-bit I/O lanes independently, enabling partial-word writes without bus contention.

Power management is handled via automatic CE-driven power-down: when any CE goes HIGH, ICC drops to ISB2 = 25 mA (CMOS mode) or ISB1 = 30 mA (TTL mode); data retention persists down to VCC = 2.0 V with no clock or refresh required.

Key Specifications

Pinout & Package

Package: 119-ball plastic ball grid array (PBGA), 14 mm × 20 mm body, 1.27 mm ball pitch, RoHS-compliant Pb-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed parallel SRAM applications.

Compared with IS61WV51232ALL-10BLI and W9825G6JH-10, the CY7C1062DV33-10BGXIT delivers true zero-refresh, deterministic 10 ns access in a thermally optimized PBGA - critical for hard real-time systems where predictability outweighs raw bandwidth.

Availability

CY7C1062DV33-10BGXIT is available at Aetrix Electronics and suitable for industrial PLC data buffers, medical imaging frame stores, and avionics sensor fusion modules requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1062DV33-10BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor, now part of Infineon Technologies, designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications.

The CY7C1062DV33 belongs to Cypress's parallel SRAM product line, engineered for deterministic low-latency operation in mission-critical embedded systems where refresh-free reliability and precise timing control are mandatory.

FAQ

What is the minimum VCC required for reliable read/write operation?

The device requires VCC ≥ 3.0 V for normal operation, as specified in the AC Test Loads section. Below 3.0 V, valid SRAM operation is not guaranteed - though data retention remains functional down to 2.0 V with CE HIGH and no active cycles.

Can CE1, CE2, and CE3 be used independently to select different memory banks?

Yes - CE1, CE2, and CE3 are fully independent inputs. The device activates only when all three are LOW; any one HIGH places the device in high-Z standby. This enables hierarchical decoding with external logic to partition the address space across multiple CY7C1062DV33 devices.

Does the 10 ns tAA apply under all temperature and voltage conditions?

Yes - the 10 ns tAA is guaranteed over the full industrial range (–40°C to +85°C) and at VCC = 3.3 V ±0.3 V, per the AC Switching Characteristics table on page 6 of Rev. *J datasheet.

Are NC pins on the 119-ball PBGA required to be left unconnected on the PCB?

Yes - NC (No Connect) pins are not bonded to the die and must remain unconnected on the PCB layout. Solder mask should fully cover these balls to prevent accidental shorts or solder bridging during reflow.