Infineon Technologies CY7C1062G30-10BGXI
- Part No.:
- CY7C1062G30-10BGXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1062G30-10BGXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:159
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Product details
Overview
CY7C1062G30-10BGXI from Cypress Semiconductor is a 16-Mbit (512 K × 32) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring TTL-compatible I/O, ERR pin for error indication, and automatic CE power-down. It serves in high-reliability industrial memory subsystems requiring data integrity assurance.
For engineers reviewing the CY7C1062G30-10BGXI datasheet, CY7C1062G30-10BGXI pinout, CY7C1062G30-10BGXI application, or CY7C1062G30-10BGXI equivalent, key selection criteria include ECC-enabled read/write latency, 119-ball PBGA thermal performance, byte-selectable 32-bit I/O architecture, and industrial-grade data retention at 1.0 V.
Technical Context
This SRAM integrates dedicated ECC encoder/decoder logic adjacent to the 512K × 32 memory array, enabling real-time single-bit error detection and correction on every read cycle without host intervention. The ERR output asserts high only when a correctable error is found - no automatic write-back occurs.
It employs three independent chip enables (CE1, CE2, CE3) and four byte enables (BA–BD) to support flexible memory expansion and partial-word access across 32-bit data bus segments. All I/O pins enter high-impedance state during deselect, OE high, byte disable, or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512 K words × 32 bits) - supports full 32-bit parallel data transfers per address cycle |
| Access Time (tAA) | 10 ns at VCC = 2.2–3.6 V - defines minimum clock-to-data valid delay in high-speed synchronous systems |
| ECC Function | Single-bit error correction with ERR flag - detects and corrects bit flips in stored data without CPU overhead |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V system rails; excludes 1.8 V operation |
| Active Current (ICC) | 90 mA typical at f = 100 MHz - determines dynamic power budget for memory-intensive embedded controllers |
| Standby Current (ISB2) | 20 mA typical - enables low-power retention mode during processor sleep states |
| Data Retention Voltage | 1.0 V - allows memory contents to persist during brown-out or controlled power-down sequences |
Pinout & Package
Package: 119-ball plastic ball grid array (PBGA), RoHS-compliant, 14 mm × 20 mm footprint, 1.27 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512K word addressing; A0 least significant |
| I/O0–I/O31 | Bidirectional Data I/O | 32-bit parallel data path; segmented into four 8-bit bytes via BA–BD |
| BA–BD | Byte Enable Inputs | Select individual 8-bit byte lanes for partial writes; enable concurrent multi-byte access |
| CE1–CE3 | Chip Enable Inputs | Three independent enables allow hierarchical memory mapping and bank selection |
| WE | Write Enable Input | Active-low control for write operations; latches data on falling edge when CE active |
| OE | Output Enable Input | Active-low control for read data output; disables I/O drivers when high |
| ERR | Error Flag Output | Open-drain output asserted high upon detection/correction of single-bit error; requires external pull-up |
| VDD / VSS | Power / Ground | Multiple VDD/VSS balls distributed for low-impedance supply routing and noise reduction |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Dedicated hardware encoder/decoder performs full error correction transparently on each read - no firmware overhead or latency penalty |
| Multi-Chip Enable Architecture | Three independent CE inputs simplify memory expansion across multiple devices without additional decode logic |
| Four-Byte Select Control | BA–BD enable simultaneous or selective access to any 8-bit subset of the 32-bit bus - critical for mixed-width peripheral interfacing |
| Automatic Power-Down | Enters ISB2 standby mode (20 mA) when all CE inputs are deasserted - eliminates need for external power gating |
| TTL-Compatible Signaling | Meets standard TTL voltage thresholds at 2.2–3.6 V - ensures interoperability with legacy microcontrollers and FPGAs |
Applications
| Industrial PLC Memory Buffer | Military Avionics Data Logging |
|---|---|
Use Scenario: Storing real-time sensor fusion outputs and control command history in programmable logic controllers operating in harsh EMI environments. IC Role / Device Role / Timing Role: Primary working memory with ECC-protected storage for deterministic scan-cycle execution and fault-tolerant diagnostics. Use Value: Prevents silent data corruption in long-duration runtime logs; 10 ns access sustains 100 MHz bus throughput under worst-case temperature. | Use Scenario: Capturing flight telemetry and navigation state vectors in airborne mission computers where radiation-induced soft errors must be mitigated. IC Role / Device Role / Timing Role: High-integrity scratchpad memory for time-critical guidance algorithms requiring guaranteed data validity between checkpoints. Use Value: ERR pin provides immediate notification of corrected errors for system-level health monitoring; 1.0 V retention preserves last-known state during transient power loss. |
| Railway Signaling Controller Cache | Medical Imaging System Frame Buffer |
Use Scenario: Holding interlocking logic tables and track occupancy status in EN 5012x-certified signaling hardware deployed in outdoor cabinets. IC Role / Device Role / Timing Role: Nonvolatile cache for safety-critical decision matrices accessed by dual-lockstep processors. Use Value: Industrial temperature range (–40 °C to +85 °C) and Pb-free PBGA ensure reliability across thermal cycling; ECC prevents false signal assertions. | Use Scenario: Temporary storage of DICOM image tiles during CT/MRI reconstruction pipelines where pixel accuracy is non-negotiable. IC Role / Device Role / Timing Role: Low-latency frame buffer interfaced to FPGA-based image processors performing real-time filtering and compression. Use Value: 32-bit bus width matches common imaging data paths; 10 ns tAA enables sub-microsecond pixel fetch latency for 4K-resolution rendering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102432BLL-10MLI | No integrated ECC; external error handling required; 10 ns access, 3.3 V only | Lacks hardware error correction - increases host CPU load and software complexity for safety-critical use | Select only if ECC is implemented externally and board space permits additional logic |
| AS7C31025B-10TIN | 10 ns access, 3.3 V, no ERR pin; supports parity but not correction | Provides basic parity detection only - cannot recover corrupted data autonomously | Choose when cost sensitivity outweighs need for self-healing memory behavior |
Compared with IS61WV102432BLL-10MLI and AS7C31025B-10TIN, CY7C1062G30-10BGXI uniquely delivers autonomous single-bit correction with visible ERR feedback - eliminating software intervention while maintaining identical timing and packaging for drop-in replacement in ECC-aware designs.
Availability
CY7C1062G30-10BGXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, military avionics data logging, and railway signaling controller cache requiring stable component supply across extended product lifecycles.
Supply support for CY7C1062G30-10BGXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure markets.
The CY7C1062G series targets mission-critical embedded systems needing deterministic memory response and built-in data integrity - specifically engineered for applications where uncorrected bit errors risk functional failure.
FAQ
Does CY7C1062G30-10BGXI support automatic write-back after ECC correction?
No. The device detects and corrects single-bit errors during read operations and asserts the ERR pin, but it does not perform automatic write-back to the memory array. Host firmware must initiate a write cycle if persistent correction is required. This design avoids unintended bus contention and maintains strict timing predictability.
What is the function of the ERR pin, and how should it be terminated?
The ERR pin is an open-drain output that goes HIGH when a single-bit error is detected and corrected. It must be externally pulled up to VCC via a 4.7 kΩ resistor. Leaving it floating is acceptable per datasheet Note 3, but active monitoring requires proper pull-up to generate a clean logic-high signal for host interrupt handling.
Can CY7C1062G30-10BGXI operate at 1.8 V?
No. This variant is rated only for 2.2 V to 3.6 V operation. The CY7C1062G18-15BGXI or CY7C1062GE18-15BGXI variants support 1.65 V–2.2 V operation. Attempting 1.8 V supply on the -30 suffix part violates its specified VCC range and may result in undefined timing or ECC functionality.
How many address lines does CY7C1062G30-10BGXI require?
It requires 19 address lines (A0–A18) to access its full 512 K-word depth. Each word is 32 bits wide, so no multiplexing or external address latching is needed for standard parallel interface implementations. The 119-ball PBGA package allocates dedicated pins for all address bits without sharing.
CY7C1062G30-10BGXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1062G30-10BGXI FAQ
1.How can I place an order for CY7C1062G30-10BGXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1062G30-10BGXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1062G30-10BGXI reliable?
The price and inventory of CY7C1062G30-10BGXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062G30-10BGXI is usually 5 days.
3.What payment methods are accepted for CY7C1062G30-10BGXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062G30-10BGXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1062G30-10BGXI?
CY7C1062G30-10BGXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1062G30-10BGXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1062G30-10BGXI?
For technical support, including CY7C1062G30-10BGXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062G30-10BGXI requirements.
6.How does Aetrix verify that CY7C1062G30-10BGXI is sourced from the original manufacturer or authorized distributors?
All CY7C1062G30-10BGXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062G30-10BGXI meets industry standards.
7.What is the process for return or replacement of CY7C1062G30-10BGXI?
All CY7C1062G30-10BGXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062G30-10BGXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1062G30-10BGXI part is unused and in its original packaging.
Return procedure for CY7C1062G30-10BGXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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