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Infineon Technologies CY7C1062G30-10BGXIT

Part No.:
CY7C1062G30-10BGXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
119-BGA
Datasheet:
AetrixCY7C1062G30-10BGXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,418

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Product details

Overview

CY7C1062G30-10BGXIT from Cypress Semiconductor is a 16-Mbit (512 K × 32) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring TTL-compatible I/O, ERR pin for error indication, and automatic CE power-down mode. It serves as high-reliability on-board memory in industrial controllers requiring data integrity under radiation-prone or long-life operation.

For engineers reviewing the CY7C1062G30-10BGXIT datasheet, CY7C1062G30-10BGXIT pinout, CY7C1062G30-10BGXIT application, or CY7C1062G30-10BGXIT equivalent, key selection criteria include ECC-enabled data path integrity, 119-ball PBGA footprint compatibility, 10 ns timing at 3.0 V, and err-flag signaling for host-level fault logging in safety-critical embedded systems.

Technical Context

This SRAM integrates dedicated ECC encoder/decoder logic adjacent to the 512K × 32 memory array, enabling real-time single-bit error detection and correction without external logic. Its three independent chip enables (CE1/CE2/CE3) support hierarchical memory mapping, while byte-enable pins (BA–BD) allow granular 8-bit writes across four I/O groups.

The device implements automatic power-down when any CE is deasserted, reducing standby current to 20 mA typical. The ERR output asserts high only during active correction events-no auto-write-back occurs, preserving deterministic latency and simplifying host software handling of corrected reads.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (512 K words × 32 bits); supports full-word parallel access without address multiplexing.
Access Time (tAA) 10 ns at VCC = 3.0 V; guarantees sub-10 ns read latency for real-time control loop buffering.
VCC Operating Range 2.2 V to 3.6 V; compatible with 3.3 V system rails and tolerant of ±10% supply variation.
ECC Function Embedded single-bit error correction with ERR flag output; corrects bit flips in stored data without CPU intervention.
Standby Current (ISB2) 20 mA typical; enables low-power retention mode during processor sleep in battery-backed industrial nodes.
Package 119-ball PBGA (14 mm × 20 mm, 1.0 mm ball pitch); RoHS-compliant, thermal resistance θJA = 20.92 °C/W.
Data Retention Voltage 1.0 V minimum; maintains stored data during brown-out or backup-battery operation.

Pinout & Package

Package: 119-ball plastic ball grid array (PBGA), 14 mm × 20 mm body, 1.0 mm ball pitch, bottom-side thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; no multiplexing required.
I/O0–I/O31 Bidirectional Data Bus 32-bit parallel interface segmented into four 8-bit groups controlled by BA–BD.
BA–BD Byte Enable Inputs Independent write enable per 8-bit byte; enables partial-word writes without read-modify-write cycles.
CE1, CE2, CE3 Chip Enable Inputs Three-level decode for memory banking; any HIGH disables all outputs and triggers auto power-down.
WE Write Enable Input Active-low synchronous write control; latches data on falling edge when CE and byte enables are asserted.
OE Output Enable Input Active-low read control; places I/O pins in high-Z state when deasserted to prevent bus contention.
ERR Error Flag Output Open-drain output asserting HIGH during single-bit correction; requires external pull-up for host interrupt generation.
VDD / VSS Power / Ground Multiple VDD/VSS balls distributed for low-impedance supply routing and noise suppression.

Key Features

Feature Design Value
Embedded ECC Engine On-die encoder/decoder corrects single-bit errors in real time without CPU overhead or external logic.
TTL-Compatible I/O Input thresholds and drive strength match legacy 3.3 V TTL systems, eliminating level-shifter requirements.
Four Independent Byte Enables BA–BD allow concurrent or selective 8-bit writes to any byte lane, optimizing burst write efficiency.
Automatic Power-Down Enters low-current ISB2 mode (<30 mA max) within nanoseconds of CE deassertion-no software command needed.
1.0-V Data Retention Maintains valid data at 1.0 V supply, enabling seamless transition to backup power during main rail failure.

Applications

Industrial PLC Memory Buffer Railway Signaling Data Cache

Use Scenario: Storing real-time sensor fusion results and control state vectors in programmable logic controllers deployed in factory automation lines.

IC Role / Device Role / Timing Role: Primary working memory with ECC-protected read/write path; 10 ns tAA ensures deterministic response within 100 µs control cycles.

Use Value: Prevents silent data corruption in mission-critical motion control sequences where undetected bit errors could cause mechanical misalignment or safety shutdowns.

Use Scenario: Caching track occupancy status and interlocking logic tables in EN 5012x-certified railway signaling cabinets exposed to EMI and temperature cycling.

IC Role / Device Role / Timing Role: Fault-tolerant storage node interfacing directly with FPGA-based safety processors via parallel 32-bit bus.

Use Value: ERR flag integration enables immediate logging of memory events for SIL-2 diagnostic coverage reporting without adding external monitoring circuitry.

Medical Imaging Frame Store Avionics Health Monitor RAM

Use Scenario: Temporary frame buffering between CT/MRI acquisition front-end and reconstruction engine in Class II medical devices.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency scratchpad memory supporting sustained 32-bit burst transfers at >80 MB/s.

Use Value: 119-ball PBGA package provides stable thermal performance under continuous operation, while ECC prevents corrupted pixel data from propagating into diagnostic output.

Use Scenario: Storing flight-critical health telemetry and configuration snapshots in DO-254-compliant avionics modules operating at –40 °C to +85 °C.

IC Role / Device Role / Timing Role: Radiation-tolerant non-volatile-adjacent memory used for last-known-good state preservation during power transitions.

Use Value: 1.0 V data retention allows continued memory integrity during dual-supply brown-out events common in aircraft electrical systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102432BLL-10BLI No integrated ECC; requires external Hamming logic or FPGA-based correction; 10 ns access, same 32-bit bus width. Lacks ERR flag and on-die correction-increases BOM count and firmware complexity for error handling. Select when cost sensitivity outweighs reliability requirements and external ECC implementation is acceptable.
Microchip 23LC1024-I/P Serial SPI interface (not parallel); 1 Mbit density; no ECC; operates at 3.3 V with 20 MHz clock. Lower bandwidth, higher latency, and no hardware error correction-unsuitable for real-time parallel data paths. Consider only for space-constrained designs where serial interface and lower density are acceptable trade-offs.

Compared with IS61WV102432BLL-10BLI and 23LC1024-I/P, CY7C1062G30-10BGXIT uniquely delivers integrated ECC with deterministic 10 ns timing and parallel 32-bit throughput-enabling simpler, safer, and faster memory subsystems in industrial and transportation safety applications.

Availability

CY7C1062G30-10BGXIT is available at Aetrix Electronics and suitable for industrial PLCs, railway signaling systems, and medical imaging equipment requiring stable component supply, long-term lifecycle assurance, and guaranteed ECC functionality.

Supply support for CY7C1062G30-10BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and microcontroller solutions for industrial, automotive, and aerospace applications, emphasizing signal integrity and functional safety.

CY7C1062G30-10BGXIT belongs to Cypress's high-speed ECC SRAM product line, engineered specifically for systems where data integrity must be enforced at the memory layer-not just in software or external logic.

FAQ

Does CY7C1062G30-10BGXIT support automatic error correction during read operations?

Yes-during every read access, the internal ECC decoder checks the retrieved 32-bit word plus associated parity bits. If a single-bit error is detected, it is corrected in real time before data reaches the I/O pins, and the ERR pin asserts high for one clock cycle. No external logic or CPU involvement is required for correction.

What is the function of the ERR pin, and how should it be interfaced?

The ERR pin is an open-drain output that pulses high for one access cycle whenever a single-bit error is corrected. It must be externally pulled up to VCC via a 4.7 kΩ resistor. Host processors can monitor ERR with an interrupt-capable GPIO to log correction events or trigger diagnostics-no debouncing or filtering is needed due to its synchronous assertion.

Can CY7C1062G30-10BGXIT operate at 1.8 V?

No-CY7C1062G30-10BGXIT is rated only for 2.2 V to 3.6 V operation. For 1.65 V–2.2 V operation, the CY7C1062G18 or CY7C1062GE18 variants are specified, both with 15 ns access time. Attempting 1.8 V operation on the G30 variant violates absolute maximum ratings and may result in data corruption or functional failure.

How does the automatic power-down mode interact with the ERR pin and ECC functionality?

When any CE pin is deasserted, the device enters ISB2 standby mode (20 mA typical), disabling all I/O drivers and halting internal array access-but the ECC logic remains inactive and ERR cannot assert. ECC and ERR operation resume only after CE reassertion, WE/OE setup, and a valid access cycle; no state is lost during power-down.

CY7C1062G30-10BGXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

CY7C1062G30-10BGXIT FAQ

1.How can I place an order for CY7C1062G30-10BGXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1062G30-10BGXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1062G30-10BGXIT reliable?

The price and inventory of CY7C1062G30-10BGXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062G30-10BGXIT is usually 5 days.

3.What payment methods are accepted for CY7C1062G30-10BGXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062G30-10BGXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1062G30-10BGXIT?

CY7C1062G30-10BGXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1062G30-10BGXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1062G30-10BGXIT?

For technical support, including CY7C1062G30-10BGXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062G30-10BGXIT requirements.

6.How does Aetrix verify that CY7C1062G30-10BGXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1062G30-10BGXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062G30-10BGXIT meets industry standards.

7.What is the process for return or replacement of CY7C1062G30-10BGXIT?

All CY7C1062G30-10BGXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062G30-10BGXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1062G30-10BGXIT part is unused and in its original packaging.

Return procedure for CY7C1062G30-10BGXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1062G30-10BGXIT Tags

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