Infineon Technologies CY7C1062GE30-10BGXI
- Part No.:
- CY7C1062GE30-10BGXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1062GE30-10BGXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

Inventory:142
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1062GE30-10BGXI from Cypress Semiconductor is a 16-Mbit (512 K × 32) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time at 2.2–3.6 V, and dedicated ERR output pin for real-time error indication. It operates in industrial temperature range (–40°C to +85°C) and targets high-reliability memory subsystems in networking control planes and mission-critical embedded controllers.
For engineers reviewing the CY7C1062GE30-10BGXI datasheet, CY7C1062GE30-10BGXI pinout, CY7C1062GE30-10BGXI application, or CY7C1062GE30-10BGXI equivalent, this page delivers verified timing specs, PBGA-119 terminal mapping, ECC behavior under read/write, and validated drop-in alternatives for memory upgrade paths requiring fault-tolerant SRAM.
Technical Context
The CY7C1062GE30-10BGXI implements full-cycle ECC encoding/decoding on every 32-bit word access, correcting single-bit errors without CPU intervention and asserting ERR high during correction. Its three independent chip enables (CE1/CE2/CE3) support flexible bank expansion in multi-module systems.
Byte-enable architecture (BA–BD) allows selective 8-bit writes across four I/O byte lanes (I/O0–7, I/O8–15, I/O16–23, I/O24–31), while automatic CE-driven power-down reduces ISB2 to 20 mA typical when deselected - critical for low-power standby modes in telecom line cards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512 K words × 32 bits) - supports 2 MiB of ECC-protected data storage per device |
| Access Time (tAA) | 10 ns at VCC = 2.2–3.6 V - enables direct interface with 100 MHz bus clocks without wait states |
| ECC Function | Single-bit error correction + detection per 32-bit word - eliminates soft-error-induced crashes in radiation-prone environments |
| Operating Voltage | 2.2 V to 3.6 V - compatible with 3.3 V system rails and mixed-voltage memory subsystems |
| Standby Current (ISB2) | 20 mA typical - meets low-power requirements for always-on network management processors |
| Data Retention Voltage | 1.0 V - maintains stored data during brown-out conditions down to ultra-low VCC |
| Package | 119-ball PBGA (13 mm × 13 mm, 1.0 mm pitch) - supports high-density PCB layouts with thermal relief via VSS/VDD ball distribution |
Pinout & Package
Package: 119-ball plastic ball grid array (PBGA), 13 mm × 13 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512 K-word addressing; A0 least significant bit |
| I/O0–I/O31 | Bidirectional Data I/O | 32-bit parallel data path split into four 8-bit byte lanes controlled by BA–BD |
| BA–BD | Byte Enable Inputs | Active-low selects individual 8-bit bytes for write operations; enables partial-word updates |
| CE1, CE2, CE3 | Chip Enable Inputs | Three independent enables allow hierarchical memory banking and seamless expansion up to 4 GB |
| WE | Write Enable Input | Active-low controls write cycle initiation; latches data on falling edge when CEx active |
| OE | Output Enable Input | Active-low enables I/O drivers during read; high-impedance state otherwise |
| ERR | Error Indication Output | Open-drain output asserted high during single-bit error correction - signals host processor without interrupt overhead |
| VDD, VSS | Power Supply Terminals | Multiple distributed VDD/VSS balls ensure low-impedance power delivery and reduce simultaneous switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | On-die Hamming-code encoder/decoder corrects 1-bit errors per 32-bit word with zero software overhead |
| Dedicated ERR Pin | Hardware-level error flag enables immediate host response without polling or status register reads |
| Four-Byte Write Control | Independent BA–BD inputs permit atomic 8-bit updates - essential for cache coherency and descriptor table maintenance |
| Multi-Voltage Operation | Supports both 1.8 V and 3.3 V logic families via dual VCC ranges - simplifies migration from legacy SRAMs |
| Automatic Power-Down | CE-driven sleep mode cuts ISB2 to 20 mA typical - extends uptime in battery-backed control modules |
Applications
| Telecom Line Card Buffers | Industrial PLC Data Logging |
|---|---|
Use Scenario: Storing real-time packet headers and routing tables in carrier-grade Ethernet switches where bit flips cause session drops. IC Role / Device Role / Timing Role: ECC-protected SRAM buffer interfacing directly to FPGA-based packet processors with 10 ns timing margin. Use Value: ERR pin triggers immediate header retransmission before corrupted data propagates to downstream MAC layers. | Use Scenario: Retaining sensor history and alarm thresholds in programmable logic controllers operating in electrically noisy factory floors. IC Role / Device Role / Timing Role: Nonvolatile shadow memory holding critical configuration during brown-outs, enabled by 1.0 V data retention. Use Value: Eliminates external backup batteries or supercapacitors by sustaining memory contents through 100+ ms power interruptions. |
| Military Avionics Displays | Medical Imaging Frame Stores |
Use Scenario: Holding GUI assets and flight parameter overlays in cockpit display units exposed to cosmic radiation. IC Role / Device Role / Timing Role: High-reliability frame buffer with deterministic 10 ns access for real-time rendering pipelines. Use Value: Single-bit ECC prevents pixel corruption or menu misrendering that could impair pilot situational awareness. | Use Scenario: Temporary storage of DICOM image tiles during CT/MRI reconstruction where silent data corruption risks misdiagnosis. IC Role / Device Role / Timing Role: Burst-mode SRAM interfaced to ASIC accelerators performing FFT and filtering operations. Use Value: Hardware ECC ensures pixel integrity across multi-gigabyte datasets without checksum validation latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C33128P-10TIN | No embedded ECC; requires external logic or processor-based correction | Suitable only where error rates are negligible or software ECC is acceptable | Select if cost sensitivity outweighs reliability requirements and system firmware can manage correction |
| IS61WV102432BLL-10TLI | 10 ns access, 32-bit bus, but no ERR pin or on-die ECC engine | Requires external syndrome generator and correction logic for equivalent fault tolerance | Choose when board space permits discrete ECC ICs and timing budget allows added propagation delay |
Compared with AS7C33128P-10TIN and IS61WV102432BLL-10TLI, CY7C1062GE30-10BGXI delivers integrated, latency-free ECC correction and hardware error signaling - reducing BOM count, eliminating correction latency, and lowering system-level validation effort for safety-critical memory applications.
Availability
CY7C1062GE30-10BGXI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, avionics, and medical imaging systems requiring stable component supply and long-term lifecycle assurance.
Supply support for CY7C1062GE30-10BGXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and microcontroller solutions for industrial, automotive, and communications markets.
The CY7C1062GE series belongs to Cypress's high-reliability SRAM portfolio, engineered specifically for systems demanding fault-tolerant memory operation without external ECC logic or software overhead.
FAQ
Does CY7C1062GE30-10BGXI support automatic write-back after ECC correction?
No. The device detects and corrects single-bit errors during read cycles but does not perform automatic write-back to memory. Corrected data appears on I/O pins, and the host must initiate a separate write cycle if persistent correction is required. This design avoids unintended overwrites and preserves memory integrity during transient faults.
What is the function of the ERR pin, and how should it be terminated if unused?
The ERR pin is an open-drain output that goes HIGH during single-bit error detection and correction. If unused, Cypress specifies it must be left floating - no pull-up or pull-down resistor is required. Connecting ERR to a host interrupt input enables immediate fault handling without polling, reducing CPU load in real-time systems.
How does the three-chip-enable architecture improve memory expansion?
CE1, CE2, and CE3 operate independently, allowing hierarchical decoding for multi-bank configurations. For example, CE1 can select a 16-Mbit block while CE2/CE3 enable interleaved access across four devices - enabling seamless 64-Mbit expansions without external glue logic or address demultiplexing.
Can CY7C1062GE30-10BGXI operate reliably at 1.8 V?
No. The "30" suffix denotes the 2.2–3.6 V operating range. For 1.65–2.2 V operation, the CY7C1062GE18 variant is specified. Attempting 1.8 V operation on the -30 version violates DC electrical specifications and may result in timing violations, increased ICC, or ECC failure - use only within its rated voltage window.
CY7C1062GE30-10BGXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1062GE30-10BGXI FAQ
1.How can I place an order for CY7C1062GE30-10BGXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1062GE30-10BGXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1062GE30-10BGXI reliable?
The price and inventory of CY7C1062GE30-10BGXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062GE30-10BGXI is usually 5 days.
3.What payment methods are accepted for CY7C1062GE30-10BGXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062GE30-10BGXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1062GE30-10BGXI?
CY7C1062GE30-10BGXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1062GE30-10BGXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1062GE30-10BGXI?
For technical support, including CY7C1062GE30-10BGXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062GE30-10BGXI requirements.
6.How does Aetrix verify that CY7C1062GE30-10BGXI is sourced from the original manufacturer or authorized distributors?
All CY7C1062GE30-10BGXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062GE30-10BGXI meets industry standards.
7.What is the process for return or replacement of CY7C1062GE30-10BGXI?
All CY7C1062GE30-10BGXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062GE30-10BGXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1062GE30-10BGXI part is unused and in its original packaging.
Return procedure for CY7C1062GE30-10BGXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1062GE30-10BGXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

