Infineon Technologies CY7C1062GE30-10BGXIT
- Part No.:
- CY7C1062GE30-10BGXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
CY7C1062GE30-10BGXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1062GE30-10BGXIT from Cypress Semiconductor is a 16-Mbit (512 K × 32) static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time at 2.2–3.6 V, and dedicated ERR output pin for real-time error indication in mission-critical memory subsystems.
For engineers reviewing the CY7C1062GE30-10BGXIT datasheet, CY7C1062GE30-10BGXIT pinout, CY7C1062GE30-10BGXIT application, or CY7C1062GE30-10BGXIT equivalent, this device supports high-reliability embedded computing where data integrity, fast random access, and deterministic ECC reporting are required - especially in industrial control, avionics data buffers, and telecom baseband memory.
Technical Context
This SRAM implements a full 32-bit parallel interface with four independent byte-enable inputs (BA–BD) enabling selective 8-bit writes across the 32-bit data bus, and uses three chip enables (CE1–CE3) to support flexible memory expansion without external logic. Its ECC engine operates transparently during read cycles, detecting and correcting single-bit errors in real time.
The ERR pin asserts HIGH only upon successful single-bit correction - not detection alone - providing unambiguous host notification. It does not support automatic write-back, requiring software acknowledgment. Power management includes dual standby modes: ISB1 (TTL input threshold) and ISB2 (CMOS threshold), with 20 mA typical ISB2 current at VCC = 3.0 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (512 K words × 32 bits) - supports 2 MB of byte-addressable, non-volatile-retained memory space |
| Access Time (tAA) | 10 ns at 2.2–3.6 V - enables direct interfacing with 100 MHz synchronous controllers without wait states |
| ECC Function | Embedded single-bit error correction with ERR output assertion - eliminates need for external ECC logic or software polling |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with standard 3.3 V I/O domains and mixed-voltage SoC interfaces |
| Active Current (ICC) | 90 mA typical at f = 100 MHz - defines thermal budget for continuous burst reads/writes in compact enclosures |
| Data Retention Voltage | 1.0 V - allows low-power hold mode during brown-out or controlled power-down without data loss |
| Package | 119-ball PBGA (14 mm × 20 mm, 1.0 mm pitch) - provides high I/O count and thermal performance for dense PCB layouts |
Pinout & Package
Package: 119-ball plastic ball grid array (PBGA), 14 mm × 20 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting 512 K word locations; A0–A18 fully decoded internally |
| I/O0–I/O31 | Bidirectional Data Bus | 32-bit parallel interface segmented into four 8-bit bytes (BA–BD controlled); high-impedance when deselected or during write |
| BA–BD | Byte Enable Inputs | Four independent active-LOW enables for granular 8-bit writes - avoids full-word overwrites and reduces bus contention |
| CE1, CE2, CE3 | Chip Enable Inputs | Three active-LOW enables allow hierarchical decoding for multi-chip memory banks up to 8 devices without glue logic |
| WE | Write Enable Input | Active-LOW control for write cycles; combined with CE and OE to define full read/write timing window per JEDEC standards |
| OE | Output Enable Input | Active-LOW control for output drivers; disables I/O pins when HIGH, enabling bus sharing with other peripherals |
| ERR | Error Report Output | Open-drain, active-HIGH signal asserted only after successful single-bit correction - requires external pull-up for host interrupt signaling |
| VDD / VSS | Power / Ground | Multiple VDD/VSS balls distributed across package for low-impedance supply routing and reduced simultaneous switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC with ERR pin | Hardware-accelerated single-bit error correction with dedicated output - removes software overhead and guarantees deterministic latency |
| Four-byte write enable (BA–BD) | Enables true 8-bit granularity on 32-bit bus - critical for protocol stack buffers and register-mapped peripherals |
| Dual voltage operation (2.2–3.6 V) | Supports both 2.5 V and 3.3 V system domains - simplifies integration with FPGA I/O banks and legacy microcontrollers |
| Automatic CE power-down | Reduces standby current to 20 mA typical (ISB2) when all CEs inactive - extends battery life in always-on edge nodes |
| 1.0 V data retention | Maintains stored data at ultra-low voltage - enables seamless suspend-to-RAM during power fail events without backup capacitors |
Applications
| Avionics Data Buffering | Industrial PLC Memory Module |
|---|---|
Use Scenario: Real-time acquisition and buffering of flight sensor telemetry in DO-254-certified systems where bit-flip immunity is mandated. IC Role / Device Role / Timing Role: Primary volatile memory buffer with hardware ECC enforcement and ERR-driven fault logging. Use Value: Eliminates need for redundant memory mirroring or periodic scrubbing, reducing BOM cost and firmware complexity while meeting ASIL-D traceability requirements. |
Use Scenario: Storing ladder logic state tables and I/O image maps in programmable logic controllers operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: High-speed, error-resilient working memory interfaced directly to ARM Cortex-M7 MCU via 32-bit parallel bus. Use Value: Prevents spurious controller resets caused by alpha-particle-induced soft errors in long-running automation sequences. |
| Telecom Baseband Processing | Medical Imaging Frame Store |
Use Scenario: Temporary storage of OFDM symbol buffers in LTE/5G small cell baseband units exposed to temperature cycling and EMI. IC Role / Device Role / Timing Role: Low-latency, ECC-protected scratchpad memory synchronized to DSP DMA engines. Use Value: Ensures bit-perfect frame reconstruction under thermal stress, avoiding packet retransmission and throughput degradation. |
Use Scenario: Holding uncompressed DICOM image frames during CT/MRI scan acquisition where data corruption could impact diagnosis. IC Role / Device Role / Timing Role: High-bandwidth, error-corrected frame buffer between ADC front-end and JPEG2000 compression engine. Use Value: Guarantees pixel-level fidelity across multi-second acquisitions, satisfying FDA 21 CFR Part 11 audit requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-10MLI | No dedicated ERR pin; ECC status reported via status register read; 10 ns access at 3.3 V only | Requires polling or interrupt-driven register access to detect correction events - adds software latency and complexity | Preferred when board space permits SPI/I²C status interface and deterministic ERR signaling is not required |
| Microchip 23LC1024-I/P | Serial SPI interface (not parallel); 1 M × 8 organization; no built-in ECC - requires external error handling | Limited bandwidth (~40 MB/s max) and no hardware ECC - unsuitable for real-time, high-integrity parallel bus systems | Only viable for low-pin-count, cost-sensitive designs where ECC is implemented in firmware and throughput < 20 MB/s is acceptable |
Compared with IS61WV102432BLL-10MLI and 23LC1024-I/P, CY7C1062GE30-10BGXIT uniquely delivers deterministic, pin-level ECC reporting with zero software overhead and full 32-bit parallel bandwidth - essential for safety-critical, latency-constrained systems.
Availability
CY7C1062GE30-10BGXIT is available at Aetrix Electronics and suitable for industrial PLC memory modules, avionics data buffering, and medical imaging frame stores requiring stable component supply, long-term lifecycle assurance, and guaranteed Pb-free compliance.
Supply support for CY7C1062GE30-10BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for automotive, industrial, and communications markets, with emphasis on functional safety and long-lifecycle support.
CY7C1062GE30-10BGXIT belongs to Cypress's high-performance ECC SRAM product line, engineered specifically for systems demanding hardware-enforced data integrity in harsh electromagnetic and thermal environments.
FAQ
Does CY7C1062GE30-10BGXIT support automatic write-back after ECC correction?
No. The device detects and corrects single-bit errors during read operations but does not perform automatic write-back to memory. The corrected data appears on the I/O bus, and the host processor must initiate a separate write cycle if persistent correction is required. This design avoids unintended bus traffic and maintains deterministic timing behavior.
What is the function of the ERR pin, and how should it be interfaced?
The ERR pin is an open-drain output that asserts HIGH only after successful single-bit error correction - not mere detection. It must be externally pulled up to VDD (typically 3.3 V) and connected to a GPIO interrupt input on the host processor. No internal pull-up exists, and leaving it floating is acceptable if unused, per datasheet Note 3.
Can CY7C1062GE30-10BGXIT operate reliably at 1.8 V?
No. This variant (GE30 suffix) is specified only for 2.2 V to 3.6 V operation. For 1.65–2.2 V operation, the CY7C1062GE18 variant must be used. Attempting 1.8 V operation on the GE30 part violates its absolute maximum ratings and may result in undefined behavior or data corruption.
How many chip enable signals does CY7C1062GE30-10BGXIT have, and what is their logical behavior?
It has three independent chip enable inputs: CE1, CE2, and CE3. All three must be LOW for the device to be selected. If any one is HIGH, the device enters automatic power-down mode. This triple-CE architecture enables hierarchical memory decoding - for example, using CE1 for bank selection, CE2 for row decode, and CE3 for column decode in large memory arrays.
CY7C1062GE30-10BGXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 512K x 32
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
CY7C1062GE30-10BGXIT FAQ
1.How can I place an order for CY7C1062GE30-10BGXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1062GE30-10BGXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1062GE30-10BGXIT reliable?
The price and inventory of CY7C1062GE30-10BGXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062GE30-10BGXIT is usually 5 days.
3.What payment methods are accepted for CY7C1062GE30-10BGXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062GE30-10BGXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1062GE30-10BGXIT?
CY7C1062GE30-10BGXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1062GE30-10BGXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1062GE30-10BGXIT?
For technical support, including CY7C1062GE30-10BGXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062GE30-10BGXIT requirements.
6.How does Aetrix verify that CY7C1062GE30-10BGXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1062GE30-10BGXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062GE30-10BGXIT meets industry standards.
7.What is the process for return or replacement of CY7C1062GE30-10BGXIT?
All CY7C1062GE30-10BGXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062GE30-10BGXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1062GE30-10BGXIT part is unused and in its original packaging.
Return procedure for CY7C1062GE30-10BGXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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