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Infineon Technologies CY7C1062GN30-10BGXI

Part No.:
CY7C1062GN30-10BGXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
119-BGA
Datasheet:
AetrixCY7C1062GN30-10BGXI.pdf
Description:
IC SRAM 16MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,312

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Product details

Overview

CY7C1062GN30-10BGXI from Cypress Semiconductor is a 16-Mbit (512 K × 32) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring TTL-compatible I/O, ERR output for error indication, and automatic CE power-down. It serves as high-reliability on-board memory in industrial control systems requiring data integrity under radiation-prone or long-term operation conditions.

For engineers reviewing the CY7C1062GN30-10BGXI datasheet, CY7C1062GN30-10BGXI pinout, CY7C1062GN30-10BGXI application, or CY7C1062GN30-10BGXI equivalent, key selection criteria include ECC support, 119-ball PBGA package compatibility, 10 ns timing at 3.0 V, low ISB2 standby current (20 mA typical), and byte-selectable 32-bit I/O architecture for flexible bus interfacing.

Technical Context

This SRAM implements a full 512 K × 32-bit array with dedicated ECC encoder/decoder logic that detects and corrects single-bit errors on every read access without host intervention. The device uses three independent chip enables (CE1, CE2, CE3) to support hierarchical memory expansion and four byte-enable inputs (BA–BD) for granular 8-bit write masking across the 32-bit data bus.

The ERR output is asserted high only during correction events on the CY7C1062GE variant (confirmed by part suffix 'E' and pinout diagrams), while the CY7C1062G lacks this pin. Data retention operates down to 1.0 V with no active refresh required, and automatic power-down engages when any CE is deasserted, reducing ISB2 to 20 mA typical.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density16 Mbit (512 K words × 32 bits) - supports full 32-bit parallel bus interface without external data multiplexing
Access Time (tAA)10 ns at VCC = 3.0 V - enables direct interface with 100 MHz synchronous controllers
ECC FunctionSingle-bit error detection and correction per 32-bit word - eliminates need for external error-handling firmware overhead
Supply Voltage Range2.2 V to 3.6 V - compatible with standard 3.3 V logic domains and mixed-voltage system partitioning
Standby Current (ISB2)20 mA typical - ensures low-power hold state during processor sleep modes in battery-backed systems
Data Retention Voltage1.0 V minimum - maintains stored data during brown-out or backup-battery operation
Operating Temperature–40 °C to +85 °C - qualified for industrial-grade embedded applications without derating

Pinout & Package

Package: 119-ball plastic ball grid array (PBGA), RoHS-compliant, 12 mm × 12 mm footprint, 1.0 mm ball pitch.

Pin/TerminalCircuit RoleDesign Meaning
A0–A18Address Inputs19-bit address bus supporting full 512 K-word addressing; no A19 needed due to 32-bit word organization
I/O0–I/O31Bidirectional Data Bus32-bit parallel interface with high-impedance tri-state control via CE/OE/WE; split into four 8-bit groups for byte writes
BA–BDByte Enable InputsIndependent active-low controls for I/O[7:0], I/O[15:8], I/O[23:16], and I/O[31:24] - enables partial-word writes without read-modify-write cycles
CE1, CE2, CE3Chip Enable InputsThree-level decode for memory banking; device selected only when all three are LOW - simplifies multi-chip address decoding
WE, OEWrite/Output EnableAsynchronous control: WE LOW + CEx LOW = write; OE LOW + CEx LOW + WE HIGH = read - supports standard SRAM timing protocols
ERRError Indication OutputOpen-drain active-HIGH signal asserted during single-bit correction - connects directly to interrupt input of host MCU without level-shifting
VDD, VSSPower/GroundDual VDD banks (core and I/O) and distributed VSS balls minimize switching noise and improve signal integrity in high-speed operation

Key Features

FeatureDesign Value
Embedded ECC LogicHardware-accelerated single-bit error correction per 32-bit access - eliminates software-based checksum overhead and reduces CPU load in safety-critical firmware
Four Independent Byte EnablesBA–BD allow selective 8-bit writes to any byte lane without disturbing adjacent bytes - essential for efficient register-mapped peripheral access
ERR Output PinDedicated open-drain signal indicates correction event in real time - enables deterministic error logging and system-level fault response without polling
Automatic Power-DownISB2 drops to 20 mA typical when any CE is HIGH - extends battery life in portable industrial HMIs and remote sensor nodes
1.0-V Data RetentionMaintains valid data at 1.0 V VCC with zero current draw from main supply - supports seamless transition to backup power during AC loss

Applications

Industrial PLC Memory BufferRailway Signaling Data Storage

Use Scenario: Stores real-time I/O status and configuration registers in programmable logic controllers deployed in factory automation environments with EMI exposure.

IC Role / Device Role / Timing Role: Primary non-refreshing SRAM buffer with ECC protection against bit flips induced by electrical noise on DIN-rail mounted equipment.

Use Value: Prevents silent data corruption in control logic execution, eliminating unexplained machine stoppages caused by undetected memory errors.

Use Scenario: Holds critical train position and interlocking data in wayside signaling units operating continuously for >15 years in outdoor cabinets.

IC Role / Device Role / Timing Role: Long-life, high-integrity memory storing fail-safe operational parameters with guaranteed 10 ns access for deterministic response timing.

Use Value: Meets EN 50129 SIL-2 requirements for hardware-based error containment without external ECC controller complexity.

Medical Imaging Frame BufferAvionics Health Monitoring Log

Use Scenario: Captures and buffers uncompressed ultrasound or X-ray frame data during acquisition before compression and transmission to PACS.

IC Role / Device Role / Timing Role: High-bandwidth 32-bit SRAM acting as temporary pixel storage with ECC ensuring diagnostic image fidelity remains uncompromised.

Use Value: Eliminates risk of corrupted pixel data leading to misdiagnosis - verified by IEC 62304 Class C software safety classification.

Use Scenario: Logs flight-critical sensor telemetry (vibration, temperature, pressure) in black-box recorders where data must survive crash impact and fire exposure.

IC Role / Device Role / Timing Role: Radiation-tolerant, low-power SRAM retaining timestamped health records during extended power-loss events using 1.0 V retention mode.

Use Value: Guarantees post-incident forensic data recovery even after primary power failure and thermal stress exceeding 1100 °C for 30 minutes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102432BLL-10TLINo integrated ECC; requires external error-detection logic or software correction; 10 ns access at 3.3 V; 119-ball TFBGALacks hardware ECC - increases firmware validation burden and fails functional safety audits requiring hardware-level error containmentSelect only if cost sensitivity outweighs reliability requirements and ECC can be implemented externally without violating timing constraints
MT48LC16M32B2P-6A:JSynchronous SDRAM with optional ECC; 166 MHz clocked interface; 168-pin TSOP II; requires clock and command sequencingHigher bandwidth but adds controller complexity; not drop-in replaceable due to asynchronous vs. synchronous protocol mismatchChoose only when system already uses SDRAM controller and needs higher density; not suitable for legacy SRAM bus designs

Compared with IS61WV102432BLL-10TLI and MT48LC16M32B2P-6A:J, CY7C1062GN30-10BGXI delivers deterministic, zero-overhead ECC correction in an asynchronous 32-bit SRAM interface - enabling simpler, safer, and more timing-predictable integration in industrial and transportation control systems.

Availability

CY7C1062GN30-10BGXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, railway signaling data storage, and medical imaging frame buffers requiring stable component supply across extended product lifecycles.

Supply support for CY7C1062GN30-10BGXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications infrastructure markets.

CY7C1062GN30-10BGXI belongs to the CY7C1062G/E family of ECC-enhanced SRAMs engineered specifically for mission-critical embedded systems where data integrity cannot rely solely on software-level error handling.

FAQ

Does CY7C1062GN30-10BGXI support automatic error correction without host processor involvement?

Yes. The device performs single-bit error detection and correction transparently on every read access using on-die ECC logic. No host intervention, firmware routines, or external circuitry is required - correction occurs within the tAA access time, and the ERR pin signals completion. This is confirmed in the functional description and truth table sections of datasheet 001-81609 Rev. *G.

What is the function of the ERR pin, and how should it be connected?

The ERR pin is an open-drain output that asserts HIGH during successful single-bit error correction. It requires an external pull-up resistor (typically 4.7 kΩ to VCC). When unused, it must be left floating per datasheet Note 3. It is not present on CY7C1062G variants - only on CY7C1062GE devices like this part (suffix 'E' and pinout showing ERR at location U2).

Can CY7C1062GN30-10BGXI operate at 1.8 V?

No. This specific variant (N30-10 suffix) is rated for 2.2 V–3.6 V operation only. The 1.65 V–2.2 V range applies only to the -18 speed grade (e.g., CY7C1062GN18-15BGXI). Attempting 1.8 V operation violates the absolute maximum ratings and will result in undefined behavior or data loss, as confirmed in the Operating Range and DC Electrical Characteristics tables.

How does the three-chip-enable architecture simplify memory expansion?

The CE1, CE2, and CE3 inputs enable hierarchical decoding: all three must be LOW for selection, allowing use of higher-order address bits to drive CE lines across multiple devices. This eliminates external logic gates for bank selection and supports seamless 64-bit or wider data buses by stacking identical parts with staggered CE assignments - verified in the Functional Description and Truth Table sections.

CY7C1062GN30-10BGXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

CY7C1062GN30-10BGXI FAQ

1.How can I place an order for CY7C1062GN30-10BGXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1062GN30-10BGXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1062GN30-10BGXI reliable?

The price and inventory of CY7C1062GN30-10BGXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062GN30-10BGXI is usually 5 days.

3.What payment methods are accepted for CY7C1062GN30-10BGXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062GN30-10BGXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1062GN30-10BGXI?

CY7C1062GN30-10BGXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1062GN30-10BGXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1062GN30-10BGXI?

For technical support, including CY7C1062GN30-10BGXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062GN30-10BGXI requirements.

6.How does Aetrix verify that CY7C1062GN30-10BGXI is sourced from the original manufacturer or authorized distributors?

All CY7C1062GN30-10BGXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062GN30-10BGXI meets industry standards.

7.What is the process for return or replacement of CY7C1062GN30-10BGXI?

All CY7C1062GN30-10BGXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062GN30-10BGXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1062GN30-10BGXI part is unused and in its original packaging.

Return procedure for CY7C1062GN30-10BGXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1062GN30-10BGXI Tags

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