Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C1062GN30-10BGXIT

Part No.:
CY7C1062GN30-10BGXIT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
119-BGA
Datasheet:
AetrixCY7C1062GN30-10BGXIT.pdf
Description:
IC SRAM 16MBIT PARALLEL 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,328

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C1062GN30-10BGXIT from Cypress Semiconductor is a 16-Mbit (512 K × 32) CMOS static RAM with embedded single-bit error-correcting code (ECC), operating at 10 ns access time over 2.2 V–3.6 V supply, featuring ERR output for error indication, TTL-compatible I/O, and automatic CE power-down. It serves in high-reliability industrial memory subsystems requiring data integrity assurance.

For engineers reviewing the CY7C1062GN30-10BGXIT datasheet, CY7C1062GN30-10BGXIT pinout, CY7C1062GN30-10BGXIT application, or CY7C1062GN30-10BGXIT equivalent, this page delivers verified specifications, validated PBGA-119 pin mapping, ECC functional context, and real-world use cases in safety-critical embedded systems.

Technical Context

The device implements full-cycle ECC encoding/decoding within the memory array, detecting and correcting single-bit errors on every read access without host intervention. Its triple chip enable (CE1/CE2/CE3) architecture enables seamless bank expansion while maintaining independent byte-write control via BA–BD signals.

ERR pin assertion (high) directly reflects real-time single-bit correction events, enabling system-level fault logging or recovery triggers. The 119-ball PBGA package supports high-density PCB layouts with defined thermal resistance (θJA = 20.92 °C/W) and low-impedance I/O drive under both 1.8 V and 3.0 V test conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 16 Mbit (512 K words × 32 bits) - supports 2 MiB of wide-data storage per device
Access Time (tAA) 10 ns at 2.2–3.6 V - enables direct interface with 100 MHz bus systems
ECC Function Embedded single-bit error detection and correction - eliminates need for external ECC logic
Supply Voltage Range 2.2 V to 3.6 V - compatible with standard 3.3 V logic domains and mixed-voltage designs
Active Current (ICC) 90 mA typical at f = 100 MHz - defines dynamic power budget for memory-intensive operations
Standby Current (ISB2) 20 mA typical - enables low-power retention mode during processor idle cycles
Data Retention Voltage 1.0 V - allows extended hold time during brown-out or controlled power-down sequences

Pinout & Package

Package: 119-ball plastic ball grid array (PBGA), RoHS-compliant, footprint per Cypress Package Diagram #001-81609 Rev. *G.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512 K-word addressing
I/O0–I/O31 Bidirectional Data Bus 32-bit parallel interface with byte-selectable write capability (BA–BD)
CE1, CE2, CE3 Chip Enable Inputs Three independent enables allow hierarchical memory banking and low-latency deselect
WE Write Enable Input Active-low control for synchronous write operations with byte granularity
OE Output Enable Input Active-low control for read data gating; high-Z when deasserted
BA–BD Byte Enable Inputs Four independent 8-bit write masks enabling partial-word writes without read-modify-write
ERR Error Indication Output Open-drain active-high signal pulsed during single-bit correction event
VDD / VSS Power / Ground Multiple distributed VDD/VSS balls ensure stable core and I/O rail decoupling

Key Features

Feature Design Value
Embedded ECC engine On-die Hamming-code encoder/decoder corrects single-bit errors transparently on every read
TTL-compatible I/O Meets VIH/VIL thresholds across 2.2–3.6 V range - interoperable with legacy 3.3 V microcontrollers
Automatic power-down Enters ISB2 standby (20 mA) when any CE is HIGH - no external control required
1.0 V data retention Maintains stored contents down to 1.0 V VCC - supports graceful shutdown during voltage sag
119-ball PBGA 0.8 mm pitch, 13 × 13 mm body - optimized for thermal dissipation and routing density

Applications

Industrial PLC Memory Buffer Medical Imaging Frame Store

Use Scenario: Real-time buffering of sensor-acquired process data in programmable logic controllers with deterministic cycle timing.

IC Role / Device Role / Timing Role: Primary working memory with ECC-protected read/write path synchronized to 100 MHz backplane clock.

Use Value: Prevents silent data corruption in long-duration control loops where uncorrected bit flips could cause unsafe actuator behavior.

Use Scenario: Temporary storage of uncompressed DICOM image frames during acquisition in portable ultrasound systems.

IC Role / Device Role / Timing Role: High-bandwidth 32-bit data path between ADC pipeline and JPEG compression engine.

Use Value: Enables error-resilient frame capture at 40 MB/s sustained rate without external parity checking overhead.

Railway Signaling Controller Avionics Data Logger

Use Scenario: Storing critical interlocking logic state tables in EN 5012x-certified signaling hardware with periodic self-test.

IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding fail-safe configuration maps accessed during boot and runtime validation.

Use Value: ERR pin feeds watchdog circuitry to trigger diagnostic reboot upon detected memory corruption.

Use Scenario: Recording flight parameter telemetry (GPS, IMU, engine metrics) in DO-160 qualified black box recorders.

IC Role / Device Role / Timing Role: Cyclic buffer with ECC-verified writes ensuring integrity of crash-sequence data.

Use Value: Guarantees recoverability of last 30 seconds of pre-impact data even after ESD-induced soft errors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ECC SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
ISSI IS61WV102432BLL-10BLI No ERR pin; 10 ns access at 3.3 V only; 1.8 V operation not supported Lacks real-time error reporting - requires software polling or external monitoring Choose when cost sensitivity outweighs need for hardware-level error visibility
Microchip 23LC1024-I/P Serial SPI interface (not parallel); 1 Mbit density; no integrated ECC Requires external ECC implementation and slower sequential access vs. 32-bit burst Prefer for space-constrained designs where serial interface and lower pin count justify bandwidth trade-off

Compared with IS61WV102432BLL-10BLI and 23LC1024-I/P, CY7C1062GN30-10BGXIT uniquely delivers parallel 32-bit ECC with hardware ERR signaling and dual-voltage support - essential for deterministic, high-integrity memory subsystems.

Availability

CY7C1062GN30-10BGXIT is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, railway signaling controllers, and avionics data loggers requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1062GN30-10BGXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications.

CY7C1062GN30-10BGXIT belongs to Cypress's ECC SRAM product line, engineered specifically for mission-critical systems where data integrity must be enforced at the silicon level without software overhead.

FAQ

Does CY7C1062GN30-10BGXIT support automatic error correction without host processor involvement?

Yes. The device performs full ECC encoding on write and decoding/correction on read autonomously. When a single-bit error is detected and corrected, the ERR pin asserts high for one clock cycle - no firmware or external logic is needed to initiate correction.

What is the function of the BA–BD pins, and how do they differ from standard byte enables?

BA–BD are four independent byte enable inputs controlling write access to each 8-bit segment of the 32-bit I/O bus (I/O0–7, I/O8–15, etc.). Unlike generic byte enables, they operate concurrently and support simultaneous multi-byte writes without read-modify-write cycles.

Can CY7C1062GN30-10BGXIT operate reliably at 1.8 V?

No. This variant (N30-10 suffix) is rated for 2.2 V–3.6 V only. For 1.65 V–2.2 V operation, select CY7C1062GN18-15BGXIT (15 ns speed grade). Mixing voltage ranges risks undefined behavior and violates absolute maximum ratings.

Is the ERR pin actively driven or open-drain, and what pull-up is required if used?

The ERR pin is open-drain. When used, it requires an external pull-up resistor to VCC (typically 4.7 kΩ). If unused, Cypress specifies it must be left floating - no termination or tie-off is permitted per datasheet Note 3.

CY7C1062GN30-10BGXIT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
119-BGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Mbit
Memory Organization:
512K x 32
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
2.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

CY7C1062GN30-10BGXIT FAQ

1.How can I place an order for CY7C1062GN30-10BGXIT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1062GN30-10BGXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1062GN30-10BGXIT reliable?

The price and inventory of CY7C1062GN30-10BGXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1062GN30-10BGXIT is usually 5 days.

3.What payment methods are accepted for CY7C1062GN30-10BGXIT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1062GN30-10BGXIT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1062GN30-10BGXIT?

CY7C1062GN30-10BGXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1062GN30-10BGXIT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1062GN30-10BGXIT?

For technical support, including CY7C1062GN30-10BGXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1062GN30-10BGXIT requirements.

6.How does Aetrix verify that CY7C1062GN30-10BGXIT is sourced from the original manufacturer or authorized distributors?

All CY7C1062GN30-10BGXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1062GN30-10BGXIT meets industry standards.

7.What is the process for return or replacement of CY7C1062GN30-10BGXIT?

All CY7C1062GN30-10BGXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1062GN30-10BGXIT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1062GN30-10BGXIT part is unused and in its original packaging.

Return procedure for CY7C1062GN30-10BGXIT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1062GN30-10BGXIT Tags

  • CY7C1062GN30-10BGXIT
  • CY7C1062GN30-10BGXIT PDF
  • CY7C1062GN30-10BGXIT Datasheet
  • CY7C1062GN30-10BGXIT Specifications
  • CY7C1062GN30-10BGXIT Images
  • Infineon Technologies
  • Infineon Technologies CY7C1062GN30-10BGXIT
  • Buy CY7C1062GN30-10BGXIT
  • CY7C1062GN30-10BGXIT Price
  • CY7C1062GN30-10BGXIT Distributor
  • CY7C1062GN30-10BGXIT Supplier
  • CY7C1062GN30-10BGXIT Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER