Infineon Technologies CY7C1069AV33-10ZXIT
- Part No.:
- CY7C1069AV33-10ZXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1069AV33-10ZXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 54TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,190
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Product details
Overview
CY7C1069AV33-10ZXIT from Cypress Semiconductor is a 2,097,152 × 8-bit (2 M × 8) asynchronous CMOS static RAM with 10 ns access time, 3.3 V ±0.3 V operation, TTL-compatible I/O, and dual chip enable (CE1/CE2) for flexible memory expansion. It supports automatic power-down when deselected and retains data at 2.0 V, making it suitable for industrial embedded systems requiring fast, low-power, non-volatile SRAM buffering.
For engineers reviewing the CY7C1069AV33-10ZXIT datasheet, CY7C1069AV33-10ZXIT pinout, CY7C1069AV33-10ZXIT application, or CY7C1069AV33-10ZXIT equivalent, key selection criteria include tAA ≤ 10 ns read timing, ISB2 ≤ 50 mA standby current, CE1/CE2 decode logic compatibility, and TSOP II package pinout validation for PCB layout and signal integrity.
Technical Context
The CY7C1069AV33-10ZXIT implements a fully decoded 21-bit address space (A0–A20) driving a 2 M × 8 memory array with separate row/column decoders and sense amplifiers. Its dual CE architecture allows hierarchical memory mapping: CE1 active-low and CE2 active-high must both be asserted for read/write access, enabling bank selection in multi-chip systems.
Read operations require OE LOW and WE HIGH while CE1/CE2 are enabled; write operations require WE LOW and valid input data stable before tSD (5.5 ns min). Outputs enter high-impedance state during deselect (CE1 HIGH or CE2 LOW), OE HIGH, or write cycles-ensuring clean bus sharing without external tri-state logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2,097,152 words × 8 bits - supports byte-wide data buses without width conversion logic |
| Access Time (tAA) | 10 ns max - enables direct interface with 80–100 MHz microcontrollers without wait states |
| Supply Voltage | 3.3 V ± 0.3 V - compatible with standard LVTTL and LVCMOS I/O domains |
| Data Retention Voltage | 2.0 V - allows battery-backed hold mode during main supply brownout or shutdown |
| Standby Current (ISB2) | 50 µA max - ensures ultra-low power in sleep modes for portable or energy-constrained systems |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade environmental reliability |
| Output Drive | TTL-compatible (VOH ≥ 2.4 V, VOL ≤ 0.4 V @ IOL = 8 mA) - eliminates level-shifter requirements on legacy buses |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II) with center power/ground pinout (Revolutionary pinout per datasheet), Pb-free, industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2 M × 8 decoding; A16–A20 used only in extended addressing configurations |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface with high-impedance control via CE/OE/WE; no external transceivers needed |
| CE1, CE2 | Chip Enable Inputs | Complementary enable pair (CE1 active-low, CE2 active-high) for hierarchical memory banking and reduced address decoder complexity |
| OE | Output Enable | Controls output buffer only; does not affect internal memory state - enables shared-bus arbitration |
| WE | Write Enable | Active-low write strobe; latches data on falling edge when CE1/CE2 are asserted |
| VCC, VSS | Power/Ground | Multiple VCC (pins 15, 35, 44, 46, 51, 53) and VSS (pins 14, 31, 47, 49, 52, 54) pins reduce IR drop and improve noise immunity |
| NC, DNU | No Connect / Do Not Use | NC pins unconnected internally; DNU pins must be tied to VSS or left floating per datasheet to avoid functional disruption |
Key Features
| Feature | Design Value |
|---|---|
| Dual CE architecture (CE1/CE2) | Enables seamless integration into multi-bank memory maps without external logic gates or complex address decoding |
| Automatic CE power-down | Reduces ICC to ≤50 µA when CE1 HIGH or CE2 LOW - eliminates need for external power-gating circuitry |
| 2.0 V data retention | Permits use of backup coin-cell or supercapacitor circuits to preserve RAM contents during main supply loss |
| TTL-compatible I/O | Direct connection to legacy 3.3 V microcontrollers and FPGAs without voltage translation components |
| Center VCC/VSS pinout (TSOP II) | Improves power delivery uniformity and reduces simultaneous switching noise across the 54-pin footprint |
Applications
| Industrial PLC Data Buffering | Medical Imaging Frame Store |
|---|---|
Use Scenario: Real-time acquisition and temporary storage of sensor data streams in programmable logic controllers with deterministic scan-cycle timing. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ADC interface and CPU bus, absorbing burst writes and supporting sub-10 ns read latency for control loop execution. Use Value: 10 ns tAA and 50 µA ISB2 ensure deterministic response under interrupt-driven I/O and zero-latency recovery from low-power sleep states. | Use Scenario: Storing uncompressed grayscale image frames (e.g., ultrasound or endoscopy) prior to compression or display rendering in portable diagnostic devices. IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfacing directly to image sensor controller and ARM-based application processor over 8-bit parallel bus. Use Value: TTL-compatible drive strength and 2.0 V data retention allow safe frame preservation during battery-swapping or brief AC power interruption. |
| Avionics Sensor Log Memory | Test Equipment Pattern Memory |
Use Scenario: Recording flight-critical sensor telemetry (accelerometer, gyroscope, pressure) in ruggedized black-box recorders operating across –40°C to +85°C. IC Role / Device Role / Timing Role: Non-volatile SRAM node in fault-tolerant logging subsystem, powered by isolated DC-DC converter with backup capacitor hold-up. Use Value: Industrial temperature rating and guaranteed 2.0 V data retention meet DO-160 Section 22 environmental compliance for airborne equipment. | Use Scenario: Storing digital stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing and functional verification. IC Role / Device Role / Timing Role: High-speed pattern memory accessed synchronously by FPGA-based pattern generator at >80 MHz effective throughput. Use Value: 10 ns tAA and tRC enable single-cycle random-access reads, eliminating pipeline stalls during vector playback. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV204816AL-10MLI | 2 M × 16 organization, 10 ns access, 3.3 V, 48-pin TSOP I - wider data bus, different pinout, no CE2 | Requires data bus width adaptation (16-bit vs. 8-bit); lacks dual CE for fine-grained bank control | Select if system uses 16-bit data path and prioritizes density over pin compatibility |
| ON Semiconductor MC14LC5480DWR2 | 256 K × 8, 12 ns access, 5 V operation, SOIC-28 - smaller capacity, higher voltage, slower timing | Not suitable for 2 Mbyte buffering or 3.3 V-only designs; requires level shifting for mixed-voltage systems | Consider only for legacy 5 V systems where capacity and speed are secondary to footprint or cost |
Compared with IS61LV204816AL-10MLI and MC14LC5480DWR2, the CY7C1069AV33-10ZXIT uniquely delivers 2 M × 8 organization with dual CE decode, 10 ns timing, and 2.0 V data retention in an industrial-grade TSOP II package - optimizing for deterministic real-time buffering in space-constrained 3.3 V embedded systems.
Availability
CY7C1069AV33-10ZXIT is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame store, and avionics sensor log memory requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1069AV33-10ZXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, PSoC, USB, and clock solutions for industrial, automotive, and communications markets.
The CY7C1069AV33 belongs to Cypress's high-speed asynchronous SRAM product line, engineered for deterministic, low-latency data buffering in real-time embedded systems where power efficiency and industrial reliability are critical.
FAQ
What is the maximum operating current for CY7C1069AV33-10ZXIT under full-speed read conditions?
The maximum VCC operating supply current (ICC) is 275 mA at VCC = 3.6 V and f = 1/tRC (100 MHz), measured with all inputs driven and outputs loaded per AC test conditions. This value reflects worst-case dynamic power during continuous read cycling and excludes transient startup current.
Can CY7C1069AV33-10ZXIT operate with only CE1 asserted and CE2 floating?
No. CE2 must be actively driven HIGH for device selection; floating CE2 violates the truth table requirement for valid read/write operation. The datasheet specifies CE2 < VIL for power-down and CE2 > VIH for enable - undefined behavior occurs if CE2 is left unconnected.
Does the 2.0 V data retention specification require external circuitry?
Yes. To maintain data at 2.0 V, the VCC supply must be actively regulated or backed up (e.g., via supercapacitor or coin cell) to sustain ≥2.0 V during main power loss. The device draws ≤50 µA in retention mode, but no internal charge pump or backup regulator is integrated.
Is the 54-pin TSOP II package of CY7C1069AV33-10ZXIT pin-compatible with CY7C1069DV33-10ZI?
Yes - both share identical 54-pin TSOP II mechanical footprint and pinout (51-85160), including center VCC/VSS arrangement. However, the DV33 variant uses different internal timing and may exhibit distinct tHZOE/tLZWE values; electrical substitution requires validation against system timing margins.
CY7C1069AV33-10ZXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1069AV33-10ZXIT FAQ
1.How can I place an order for CY7C1069AV33-10ZXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069AV33-10ZXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069AV33-10ZXIT reliable?
The price and inventory of CY7C1069AV33-10ZXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069AV33-10ZXIT is usually 5 days.
3.What payment methods are accepted for CY7C1069AV33-10ZXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069AV33-10ZXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069AV33-10ZXIT?
CY7C1069AV33-10ZXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069AV33-10ZXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069AV33-10ZXIT?
For technical support, including CY7C1069AV33-10ZXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069AV33-10ZXIT requirements.
6.How does Aetrix verify that CY7C1069AV33-10ZXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1069AV33-10ZXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069AV33-10ZXIT meets industry standards.
7.What is the process for return or replacement of CY7C1069AV33-10ZXIT?
All CY7C1069AV33-10ZXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069AV33-10ZXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069AV33-10ZXIT part is unused and in its original packaging.
Return procedure for CY7C1069AV33-10ZXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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