My Inquiry
My Account
Infineon Technologies CY7C1069AV33-12ZXC
- Part No.:
- CY7C1069AV33-12ZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1069AV33-12ZXC.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 54TSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,077
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1069AV33-12ZXC from Cypress Semiconductor is a 2,097,152 × 8-bit (16 Mbit) asynchronous CMOS static RAM with 12 ns access time, 3.3 V ±0.3 V supply, TTL-compatible I/O, and automatic CE-based power-down. It operates in commercial temperature range (0°C to +70°C) and supports high-speed data buffering in embedded controllers and network interface cards.
For engineers reviewing the CY7C1069AV33-12ZXC datasheet, CY7C1069AV33-12ZXC pinout, CY7C1069AV33-12ZXC application, or CY7C1069AV33-12ZXC equivalent, key selection criteria include tAA = 12 ns read timing, dual chip enable (CE1/CE2) for bank selection, 2.0 V data retention voltage, TSOP II Pb-free package compatibility, and I/O capacitance of 8 pF.
Technical Context
The CY7C1069AV33-12ZXC implements a full asynchronous SRAM architecture with independent address decoding, sense amplifiers, and data-in drivers. Its dual CE control (CE1 LOW + CE2 HIGH) enables selective activation while OE and WE jointly govern read/write directionality without bus contention.
It features automatic power-down when CE1 is HIGH or CE2 is LOW, reducing standby current to 50 mA (ISB2), and supports data retention at 2.0 V VCC. The device uses center-power/ground pinout in 54-pin TSOP II and includes NC and DNU pins requiring strict floating or VSS tie-down per datasheet guidance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| tAA | 12 ns maximum - defines worst-case delay from valid address to stable output data during read |
| VCC | 3.3 V ±0.3 V - requires tightly regulated supply; operation invalid below 3.0 V |
| Memory Organization | 2,097,152 × 8 bits - provides 16 Mbit capacity with byte-wide data interface |
| ISB2 | 50 mA max - CMOS-input power-down current with CE2 < 0.3 V and CE1 > VCC – 0.3 V |
| Data Retention Voltage | 2.0 V - minimum VCC sustaining stored data without refresh during low-power sleep |
| I/O Capacitance | 8 pF (TSOP II) - directly impacts signal integrity and trace termination design on PCB |
| Operating Temperature | 0°C to +70°C - commercial-grade thermal envelope suitable for non-industrial board-level use |
Pinout & Package
Package: 54-pin TSOP II (Pb-free), 0.8 mm pitch, center power/ground pinout (Rev. *F, Page 2). Pin functions validated per official Cypress logic block diagram and truth table.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2M-word decode; A20 enables 16 Mbit addressing |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface; high-impedance when deselected, OE HIGH, or during write |
| CE1, CE2 | Chip Enable Controls | Active-low dual enable: CE1 LOW + CE2 HIGH required for read/write; enables memory banking |
| OE | Output Enable | Controls output driver state only; does not affect internal memory access timing |
| WE | Write Enable | Active-low write strobe; initiates write when CE1/CE2 active and WE LOW |
| VCC, VSS | Power & Ground | Multiple VCC/VSS pins distributed across center rows for low-noise power delivery |
| NC, DNU | No Connect / Do Not Use | NC pins unconnected internally; DNU pins must float or tie to VSS-violation risks malfunction |
Key Features
| Feature | Design Value |
|---|---|
| 12 ns access time | Enables integration into 83 MHz CPU bus systems without wait states |
| Dual CE architecture (CE1/CE2) | Allows seamless expansion to multi-Mbyte memory maps using simple logic gating |
| Automatic CE power-down | Reduces system idle power by disabling core logic when CE1 HIGH or CE2 LOW |
| TTL-compatible I/O | Eliminates level-shifting requirements when interfacing with legacy 5 V logic families |
| 2.0 V data retention | Permits deep-sleep modes in battery-backed systems without data loss |
Applications
| Industrial PLC Data Buffering | Network Interface Card (NIC) Packet Memory |
|---|---|
|
Use Scenario: Storing transient Ethernet frame payloads during DMA transfer between MAC and host processor. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM acting as zero-wait-state packet buffer with CE-controlled bank arbitration. Use Value: 12 ns tAA ensures full 100 Mbps line-rate buffering without pipeline stalls; 8-bit width matches standard NIC data path granularity. |
Use Scenario: Holding configuration registers and status flags in modular switch fabric management units. IC Role / Device Role / Timing Role: Non-volatile shadow memory holding boot-time initialization values during FPGA reconfiguration cycles. Use Value: 2.0 V data retention allows safe power-gating during hot-swap events without losing critical state. |
| Medical Imaging Front-End Controller | Automotive Infotainment Display Cache |
|
Use Scenario: Temporarily storing digitized ultrasound scan-line segments before GPU-accelerated rendering. IC Role / Device Role / Timing Role: High-reliability SRAM providing deterministic latency for real-time image streaming pipelines. Use Value: Dual CE inputs allow interleaved access between acquisition and display engines, preventing bus contention. |
Use Scenario: Caching GUI assets (icons, fonts, bitmaps) in head-unit displays to reduce eMMC read frequency. IC Role / Device Role / Timing Role: Low-power SRAM serving as fast-access L1 cache layer between ARM Cortex-A application processor and flash storage. Use Value: 50 mA ISB2 standby current minimizes quiescent draw during screen-off periods in always-on vehicle systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar asynchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61LV25616AL-12TQLI | 256K × 16 organization (vs. 2M × 8); 12 ns tAA; 3.3 V; 54-pin TSOP II | Wider data bus (16-bit) reduces address cycles but increases PCB routing complexity | Select when system bus width is 16-bit and memory density ≤ 4 Mbit suffices |
| ON Semiconductor MC14LC5480DW | 256K × 8 organization; 15 ns tAA; 5 V tolerant; 28-pin SOIC | Slower speed and lower density; compatible with legacy 5 V microcontrollers | Choose only for brownfield designs requiring 5 V I/O and minimal board redesign |
Compared with IS61LV25616AL-12TQLI and MC14LC5480DW, the CY7C1069AV33-12ZXC delivers higher density (16 Mbit vs. 4/2 Mbit) and faster access within the same 54-pin TSOP II footprint, making it optimal for new designs prioritizing bandwidth and compactness over legacy voltage compatibility.
Availability
CY7C1069AV33-12ZXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, network interface card packet memory, and medical imaging front-end controllers requiring stable component supply and Pb-free compliance.
Supply support for CY7C1069AV33-12ZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, PSoC, USB, and clock solutions for embedded systems.
The CY7C1069AV33 belongs to Cypress's high-speed asynchronous SRAM product line, designed specifically for low-latency, byte-accessible data storage in real-time control and communications infrastructure.
FAQ
What is the minimum VCC required before initiating a read or write cycle?
The device requires VCC to reach at least 3.0 V before any valid SRAM operation. A 1 ms stabilization period (tpower) must elapse after VCC crosses 3.0 V before issuing the first address or control signal. This is enforced by an internal voltage regulator stepping down to 2.0 V for core logic.
Can CE1 and CE2 be tied together for simplified control?
No. CE1 and CE2 serve distinct logical roles: CE1 is active-low enable, CE2 is active-high enable. Tying them violates the required CE1 LOW + CE2 HIGH condition and forces the device into power-down mode. They must be driven independently per the truth table.
How should DNU pins be handled in PCB layout?
DNU (Do Not Use) pins-specifically pin 54 (DNU) in the TSOP II package-must either be left electrically floating or tied to VSS. Connecting them to VCC or driving them actively may cause undefined behavior or increased leakage, as confirmed in the datasheet note on Page 2.
Is the CY7C1069AV33-12ZXC pin-compatible with the -10 speed grade?
Yes. The CY7C1069AV33-12ZXC and -10ZXC share identical 54-pin TSOP II mechanical footprint, pinout, and DC electrical characteristics. Only AC timing parameters differ (tAA = 12 ns vs. 10 ns); no layout change is needed when upgrading from -10 to -12 for timing-margin relaxation.
CY7C1069AV33-12ZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1069AV33-12ZXC FAQ
1.How can I place an order for CY7C1069AV33-12ZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069AV33-12ZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069AV33-12ZXC reliable?
The price and inventory of CY7C1069AV33-12ZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069AV33-12ZXC is usually 5 days.
3.What payment methods are accepted for CY7C1069AV33-12ZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069AV33-12ZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069AV33-12ZXC?
CY7C1069AV33-12ZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069AV33-12ZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069AV33-12ZXC?
For technical support, including CY7C1069AV33-12ZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069AV33-12ZXC requirements.
6.How does Aetrix verify that CY7C1069AV33-12ZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1069AV33-12ZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069AV33-12ZXC meets industry standards.
7.What is the process for return or replacement of CY7C1069AV33-12ZXC?
All CY7C1069AV33-12ZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069AV33-12ZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069AV33-12ZXC part is unused and in its original packaging.
Return procedure for CY7C1069AV33-12ZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1069AV33-12ZXC Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
