Infineon Technologies CY7C1069G-10BVXI
- Part No.:
- CY7C1069G-10BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1069G-10BVXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,412
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1069G-10BVXI from Cypress Semiconductor is a 16-Mbit (2M × 8) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and dual chip enable architecture. It operates across three voltage ranges (1.65–2.2 V, 2.2–3.6 V, 4.5–5.5 V), supports 1.0-V data retention, and delivers 90 mA typical active current at 100 MHz - used in industrial control memory buffers requiring fault-tolerant storage.
For engineers reviewing the CY7C1069G-10BVXI datasheet, CY7C1069G-10BVXI pinout, CY7C1069G-10BVXI application, or CY7C1069G-10BVXI equivalent, key selection criteria include ECC-enabled reliability, multi-voltage support, TSOP II package compatibility, and dual CE timing control for high-density memory subsystems.
Technical Context
The CY7C1069G-10BVXI implements a 2M-word × 8-bit SRAM array with dedicated on-die ECC encoder/decoder logic that detects and corrects single-bit errors during read operations. Its dual chip enable (CE1/CE2) interface enables hierarchical memory banking and reduces bus contention in multi-device systems.
It features an ERR pin (not present on base CY7C1069G but confirmed for CY7C1069GE variants; CY7C1069G-10BVXI is a CY7C1069G variant per ordering code 'BVXI' indicating 54-pin TSOP II, no ERR), TTL-compatible inputs/outputs, and automatic CE-based power-down modes yielding 20 mA standby current (ISB2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 × 8 bits) - supports full-word buffering for real-time industrial processors without external expansion. |
| Access Time (tAA) | 10 ns at VCC = 4.5–5.5 V - enables direct interfacing with 100 MHz microcontrollers without wait states. |
| Voltage Ranges | 1.65–2.2 V / 2.2–3.6 V / 4.5–5.5 V - allows drop-in replacement across legacy 5 V, modern 3.3 V, and ultra-low-power 1.8 V systems. |
| Active Current (ICC) | 90 mA typical at 100 MHz - defines thermal budget for densely packed memory modules in enclosed enclosures. |
| Standby Current (ISB2) | 20 mA typical - ensures low power consumption during idle cycles in battery-backed or energy-sensitive applications. |
| Data Retention Voltage | 1.0 V - guarantees nonvolatile hold mode during brown-out or controlled power-down sequences. |
| ECC Function | Single-bit error detection and correction per 8-bit word - eliminates soft-error-induced crashes in mission-critical control firmware. |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II) with center power/ground pinout - optimized for high-density PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2M-word addressing; A20 enables top half of memory space. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface compatible with standard microcontroller data buses; high-impedance during deselect/write. |
| CE1, CE2 | Dual Chip Enable Inputs | Active-Low CE1 + Active-High CE2 form logical CE; enables bank-select granularity and reduces system-level address decoding. |
| WE | Write Enable Input | Active-Low control synchronizing write cycles; latches data only when CE1=LOW, CE2=HIGH, WE=LOW. |
| OE | Output Enable Input | Active-Low gate for output drivers; isolates I/O pins during reads when CE1=LOW, CE2=HIGH, OE=LOW, WE=HIGH. |
| VCC, VSS | Power & Ground | Multiple VCC/VSS pins distributed across package center - lowers IR drop and improves signal integrity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Logic | On-die single-bit error correction per 8-bit word - eliminates need for external ECC controllers and associated latency overhead. |
| Dual Chip Enable Interface | CE1/CE2 logic enables hierarchical memory mapping and reduces address decoder complexity in multi-SRAM systems. |
| Multi-Voltage Operation | Three independent VCC ranges allow reuse across 5 V legacy, 3.3 V embedded, and 1.8 V low-power designs without redesign. |
| TTL-Compatible I/O | Direct interface with legacy microcontrollers and FPGAs without level-shifting circuitry - simplifies board layout and BOM. |
| Low-Power Standby Mode | 20 mA ISB2 current at VCC = 5 V - extends operational uptime in battery-supervised industrial backup memory applications. |
Applications
| Industrial PLC Memory Buffer | Medical Imaging Frame Store |
|---|---|
|
Use Scenario: Storing real-time I/O scan data and ladder logic state variables in programmable logic controllers operating continuously in harsh environments. IC Role / Device Role / Timing Role: Primary volatile working memory with ECC protection against cosmic-ray-induced bit flips during extended runtime. Use Value: Prevents uncorrectable memory corruption in safety-critical automation sequences - avoids unexpected shutdowns or false actuator commands. |
Use Scenario: Holding uncompressed grayscale image frames (e.g., 1024×1024 @ 8-bit) during acquisition and preprocessing in portable ultrasound devices. IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfaced directly to image sensor controller and DSP pipeline. Use Value: 10 ns tAA enables pixel-rate streaming without FIFO bottlenecks; multi-voltage support allows shared 3.3 V rail with ADC and FPGA. |
| Railway Signaling Controller Cache | Avionics Data Logger Buffer |
|
Use Scenario: Caching route configuration tables and train position history in wayside signaling units certified to EN 5012x standards. IC Role / Device Role / Timing Role: Fault-tolerant cache memory where ECC correction must occur transparently without CPU intervention. Use Value: Meets SIL-2 requirements for memory integrity; 1.0 V data retention sustains state through brief power interruptions during track switching. |
Use Scenario: Capturing high-frequency sensor telemetry (accelerometer, gyroscope, pressure) during flight test campaigns with deterministic write timing. IC Role / Device Role / Timing Role: Burst-mode write buffer synchronized to inertial measurement unit clock, decoupled from host processor load. Use Value: Dual CE architecture allows background logging while foreground tasks execute; 90 mA ICC fits within tight thermal envelope of sealed avionics chassis. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV20488BLL-10MLI | No embedded ECC; requires external error handling or software correction - higher system-level complexity. | Suitable for cost-sensitive applications where ECC is not mandated by safety standards. | Select when BOM cost reduction outweighs ECC assurance and system-level validation effort. |
| Micron MT45W8MW16BGX-10IT:C | DDR2 SDRAM (not SRAM); requires refresh, command protocol, and PHY layer - incompatible timing model. | Used in bandwidth-intensive video processing, not deterministic real-time control buffers. | Choose only if migrating to synchronous DRAM architecture with controller support and acceptable latency trade-offs. |
Compared with IS61WV20488BLL-10MLI and MT45W8MW16BGX-10IT:C, CY7C1069G-10BVXI provides deterministic zero-wait-state access, built-in hardware ECC, and asynchronous interface - critical for safety-certified embedded control where timing predictability and fault containment are non-negotiable.
Availability
CY7C1069G-10BVXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, medical imaging frame stores, railway signaling controller caches, and avionics data logger buffers requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1069G-10BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications, with emphasis on robustness and long-term manufacturability.
CY7C1069G belongs to Cypress's high-speed SRAM product line targeting fault-tolerant embedded systems requiring ECC, multi-voltage operation, and deterministic timing - developed specifically for industrial control and safety-critical data buffering.
FAQ
Does CY7C1069G-10BVXI support 1.8 V operation?
Yes - it operates within the 1.65 V to 2.2 V VCC range, with typical performance characterized at 1.8 V. At this voltage, access time is 15 ns (CY7C1069G18 variant), but the -10BVXI suffix confirms 10 ns rating at 4.5–5.5 V; 1.8 V operation is valid but slower. Data retention remains functional down to 1.0 V.
Is the ERR pin present on CY7C1069G-10BVXI?
No - CY7C1069G-10BVXI is the base CY7C1069G variant (not CY7C1069GE). The ERR output is exclusive to GE-series parts. This device performs ECC correction internally but does not assert an external error flag; correction is transparent to the host system.
What is the maximum clock frequency supported for burst reads?
CY7C1069G-10BVXI is an asynchronous SRAM - it has no internal clock. Maximum effective throughput is determined by tAA (10 ns), tOH (output hold), and cycle time (tRC ≥ 15 ns). At 5 V, it supports sustained 66.7 MHz random access (15 ns cycle) or faster burst patterns using address sequencing and CE/OE control.
Can CY7C1069G-10BVXI be used in automotive applications?
It is rated for industrial temperature (–40 °C to +85 °C) and meets JEDEC JESD22-A108 reliability testing, but is not AEC-Q100 qualified. Use in automotive contexts requires customer-level qualification per application-specific stress profiles; it is widely deployed in under-hood industrial equipment with similar thermal and EMI conditions.
CY7C1069G-10BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1069G-10BVXI FAQ
1.How can I place an order for CY7C1069G-10BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069G-10BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069G-10BVXI reliable?
The price and inventory of CY7C1069G-10BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069G-10BVXI is usually 5 days.
3.What payment methods are accepted for CY7C1069G-10BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069G-10BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069G-10BVXI?
CY7C1069G-10BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069G-10BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069G-10BVXI?
For technical support, including CY7C1069G-10BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069G-10BVXI requirements.
6.How does Aetrix verify that CY7C1069G-10BVXI is sourced from the original manufacturer or authorized distributors?
All CY7C1069G-10BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069G-10BVXI meets industry standards.
7.What is the process for return or replacement of CY7C1069G-10BVXI?
All CY7C1069G-10BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069G-10BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069G-10BVXI part is unused and in its original packaging.
Return procedure for CY7C1069G-10BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1069G-10BVXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

