Infineon Technologies CY7C1069G30-10BVXIT
- Part No.:
- CY7C1069G30-10BVXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CY7C1069G30-10BVXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1069G30-10BVXIT from Cypress Semiconductor is a 16-Mbit (2M × 8) CMOS static RAM with embedded single-bit error-correcting code (ECC), dual chip enable (CE1/CE2) control, 10 ns access time, and support for 2.2 V–3.6 V supply operation - used in industrial-grade memory subsystems requiring data integrity in avionics and medical imaging controllers.
For engineers reviewing the CY7C1069G30-10BVXIT datasheet, CY7C1069G30-10BVXIT pinout, CY7C1069G30-10BVXIT application, or CY7C1069G30-10BVXIT equivalent, key selection criteria include ECC-enabled reliability, TSOP II package compatibility, dual CE timing behavior, and 2.2–3.6 V voltage range compliance for low-power embedded systems.
Technical Context
This SRAM implements a synchronous, dual-chip-enable architecture with independent CE1 (active-low) and CE2 (active-high) inputs to gate read/write operations. Its ECC logic performs real-time single-bit error detection and correction on every read access without CPU intervention.
The device integrates dedicated ERR output (on CY7C1069GE variant) that asserts high during corrected errors, and supports TTL-compatible I/O levels across all supported VCC ranges. It uses standard address/data multiplexing with A0–A20 addressing and I/O0–I/O7 bidirectional data lines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 16 Mbit (2,097,152 words × 8 bits) - supports full byte-wide data bus interfacing without external width expansion. |
| Access time (tAA) | 10 ns at 2.2–3.6 V - enables direct interface with 100 MHz microcontrollers without wait states. |
| ECC capability | Single-bit error correction per 8-bit word - ensures data integrity in radiation-prone or long-duration storage applications. |
| Supply voltage | 2.2 V to 3.6 V - compatible with modern low-voltage SoCs and FPGA I/O banks without level-shifting. |
| Active current (ICC) | 90 mA typical at 100 MHz - defines thermal budget for dense memory arrays in compact enclosures. |
| Standby current (ISB2) | 20 mA typical - enables low-power retention mode during system sleep without external power gating. |
| Data retention | 1.0 V minimum - allows battery-backed operation down to ultra-low voltage during brownout conditions. |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II) with center power/ground pinout configuration - optimized for signal integrity and thermal dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 2M-word decoding; no address multiplexing required. |
| I/O0–I/O7 | Bidirectional data lines | 8-bit parallel data path with TTL-compatible drive strength and high-impedance tri-state control. |
| CE1, CE2 | Dual chip enable inputs | CE1 active-low + CE2 active-high logic combination enables precise hierarchical memory mapping and bank selection. |
| WE, OE | Write and output enable | Separate WE/OE controls allow non-overlapping write/read cycles and eliminate bus contention risks. |
| VCC, VSS | Power and ground | Multiple VCC/VSS pins distributed across package center - reduces IR drop and improves noise immunity. |
| ERR | Error indication output | Open-drain output asserted high on single-bit ECC correction - signals host processor without interrupt overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Hardware-accelerated single-bit error correction per 8-bit word - eliminates software overhead and guarantees deterministic latency. |
| Dual chip enable (CE1/CE2) | Independent enable logic enables multi-bank memory partitioning and eliminates need for external address decoders. |
| ERR output pin | Dedicated open-drain status indicator - allows host to log or respond to corrected errors without polling or additional GPIO resources. |
| Multi-voltage support | Operates across 2.2–3.6 V range - simplifies integration into mixed-voltage systems and avoids level translators. |
| Low ISB2 standby current | 20 mA typical at 0 Hz - extends battery life in portable diagnostic equipment during idle periods. |
Applications
| Avionics Data Logging | Medical Imaging Buffer |
|---|---|
Use Scenario: Continuous recording of flight sensor telemetry with guaranteed data integrity over extended mission durations. IC Role / Device Role / Timing Role: Primary non-volatile buffer storing raw ADC samples before compression and transmission. Use Value: ECC prevents silent corruption of critical altitude or attitude data during high-radiation cruise phases. | Use Scenario: Real-time frame buffering in ultrasound machines where pixel data must remain uncorrupted between acquisition and display rendering. IC Role / Device Role / Timing Role: High-speed, low-latency intermediate memory between FPGA image pipeline and GPU display controller. Use Value: 10 ns tAA enables full 1080p frame capture at 60 fps without pipeline stalls or dropped frames. |
| Industrial PLC Memory Expansion | Ruggedized Test Equipment Storage |
Use Scenario: Adding reliable program and data memory to programmable logic controllers operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: External instruction/data RAM mapped into microcontroller address space via parallel bus interface. Use Value: Dual CE inputs allow seamless integration into existing 16-bit bus architectures without redesigning address decode logic. | Use Scenario: Storing calibration coefficients and measurement history in handheld multimeters and oscilloscopes exposed to temperature cycling and vibration. IC Role / Device Role / Timing Role: Retention-optimized memory holding critical firmware parameters during battery replacement or power loss. Use Value: 1.0 V data retention threshold ensures parameter survival even under deep brownout conditions below 1.2 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar SRAM with ECC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-10TIN | No integrated ECC; requires external error-handling logic; 32K × 8 organization; 10 ns access at 5 V only. | Suitable for cost-sensitive designs where ECC is implemented in FPGA or MCU firmware. | Select when system-level ECC is already available and voltage flexibility is not required. |
| IS61WV20488BLL-10MLI | 2M × 8 organization, no ECC, 3.3 V only, 10 ns access; lower ICC (55 mA) but no error resilience. | Fits legacy 3.3 V-only systems needing higher density than 1M×8 parts but no fault tolerance. | Choose when board space is constrained and ECC is unnecessary due to controlled EMI environment. |
Compared with AS7C3256A-10TIN and IS61WV20488BLL-10MLI, CY7C1069G30-10BVXIT uniquely delivers hardware ECC, multi-voltage support (2.2–3.6 V), and dual CE control - making it the only option for safety-critical, mixed-voltage, or radiation-tolerant memory subsystems.
Availability
CY7C1069G30-10BVXIT is available at Aetrix Electronics and suitable for avionics data logging, medical imaging buffers, and industrial PLC memory expansion requiring stable component supply across extended product lifecycles.
Supply support for CY7C1069G30-10BVXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications - emphasizing signal integrity, longevity, and functional safety.
CY7C1069G30-10BVXIT belongs to Cypress's industrial-grade SRAM portfolio, engineered specifically for systems demanding error-resilient, low-latency parallel memory with flexible voltage operation and robust thermal performance.
FAQ
Is CY7C1069G30-10BVXIT pin-compatible with CY7C1069G30-10ZSXI?
No. CY7C1069G30-10BVXIT uses a 54-pin TSOP II package, while CY7C1069G30-10ZSXI is a 48-ball VFBGA variant. Pin assignments differ significantly - especially for VCC/VSS distribution and ERR placement - requiring separate PCB layout and routing.
Does the ERR pin require a pull-up resistor?
Yes. The ERR pin is open-drain and must be externally pulled up to the host system's logic rail (e.g., 3.3 V) to generate a valid HIGH signal during ECC correction events. Cypress recommends a 4.7 kΩ pull-up for noise immunity and fast rise time.
Can CY7C1069G30-10BVXIT operate at 1.8 V?
No. This variant is rated for 2.2 V–3.6 V only. For 1.65–2.2 V operation, use CY7C1069G18-15BVXIT or CY7C1069GE18-15BVXIT - both specify 15 ns access time and include the same ECC and dual CE features.
What happens during a double-bit error?
The ECC circuit detects but cannot correct double-bit errors. In such cases, ERR remains inactive (low), and corrupted data is passed to the host unchanged. System-level error handling (e.g., CRC checks or watchdog timeouts) must be implemented externally to detect unrecoverable failures.
CY7C1069G30-10BVXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CY7C1069G30-10BVXIT FAQ
1.How can I place an order for CY7C1069G30-10BVXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069G30-10BVXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069G30-10BVXIT reliable?
The price and inventory of CY7C1069G30-10BVXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069G30-10BVXIT is usually 5 days.
3.What payment methods are accepted for CY7C1069G30-10BVXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069G30-10BVXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069G30-10BVXIT?
CY7C1069G30-10BVXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069G30-10BVXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069G30-10BVXIT?
For technical support, including CY7C1069G30-10BVXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069G30-10BVXIT requirements.
6.How does Aetrix verify that CY7C1069G30-10BVXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1069G30-10BVXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069G30-10BVXIT meets industry standards.
7.What is the process for return or replacement of CY7C1069G30-10BVXIT?
All CY7C1069G30-10BVXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069G30-10BVXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069G30-10BVXIT part is unused and in its original packaging.
Return procedure for CY7C1069G30-10BVXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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