Infineon Technologies CY7C1069G30-10ZSXI
- Part No.:
- CY7C1069G30-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1069G30-10ZSXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 54TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:568
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Product details
Overview
CY7C1069G30-10ZSXI from Cypress Semiconductor is a 16-Mbit (2M × 8) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, 10 ns access time, and dual chip enable (CE1/CE2) architecture. It operates across 2.2 V–3.6 V supply, delivers 90 mA typical active current at 100 MHz, and supports industrial temperature range (–40 °C to +85 °C) for use in mission-critical memory subsystems requiring data integrity.
For engineers reviewing the CY7C1069G30-10ZSXI datasheet, CY7C1069G30-10ZSXI pinout, CY7C1069G30-10ZSXI application, or CY7C1069G30-10ZSXI equivalent, this device serves as a drop-in ECC-enhanced SRAM replacement in telecom control planes, industrial PLCs, and avionics data buffers where bit-flip resilience and deterministic timing are required.
Technical Context
The CY7C1069G30-10ZSXI implements a dual-chip-enable interface with CE1 active-low and CE2 active-high logic, enabling selective bank activation in multi-device memory systems. Its ECC engine performs real-time single-bit error detection and correction on every read access without CPU intervention, signaled via dedicated ERR output (not present on G-series variants).
It features TTL-compatible input thresholds and output drive strength, supports 1.0-V data retention during standby, and uses separate power/ground pins per TSOP II package quadrant to minimize switching noise. The 21-bit address bus (A0–A20) decodes 2M locations, while eight bidirectional I/O lines (I/O0–I/O7) share data path with internal ECC encoding/decoding circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory size | 16 Mbit (2,097,152 × 8 bits); enables full-word storage without external byte masking logic |
| Access time (tAA) | 10 ns at VCC = 2.2–3.6 V; guarantees sub-100 MHz synchronous bus operation with zero wait states |
| ECC capability | Single-bit error correction per 8-bit word; eliminates soft-error-induced crashes in radiation-prone environments |
| Supply voltage range | 2.2 V to 3.6 V; compatible with 2.5 V and 3.3 V system rails without level-shifting |
| Active current (ICC) | 90 mA typical at 100 MHz; enables thermal budget planning for dense memory modules |
| Standby current (ISB2) | 20 mA typical; supports low-power hold mode during processor sleep without data loss |
| Data retention voltage | 1.0 V minimum; allows battery-backed operation during main power failure |
Pinout & Package
Package: 54-pin TSOP II (ZS suffix), center power/ground pinout configuration; RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus decoding 2M locations; A20 enables full 16-Mbit addressing |
| I/O0–I/O7 | Bidirectional data I/O | 8-bit parallel data path shared between read/write and ECC-encoded transfers |
| CE1, CE2 | Dual chip enable | CE1 LOW + CE2 HIGH activates device; enables hierarchical memory mapping with multiple SRAMs |
| WE | Write enable | LOW initiates write cycle; high-impedance I/O state maintained during write to prevent bus contention |
| OE | Output enable | LOW enables read data output; independent of WE to support read-modify-write sequences |
| ERR | Error indication output | HIGH indicates successful single-bit correction occurred on last read; requires no external pull-up |
| VCC, VSS | Power and ground | Multiple VCC/VSS pins distributed across package for low-impedance supply routing and reduced simultaneous switching noise |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC engine | Corrects single-bit errors in real time per 8-bit word without interrupting host processor execution |
| TTL-compatible I/O | Eliminates need for level translators when interfacing with legacy microcontrollers and FPGAs |
| Dual chip enable (CE1/CE2) | Enables precise memory banking and reduces address decoder complexity in multi-SRAM systems |
| 1.0-V data retention | Preserves memory contents during brown-out conditions using backup battery or capacitor hold-up |
| ERR output signal | Provides hardware-observable flag for error logging, diagnostics, or fail-safe system response |
Applications
| Telecom Baseband Processing | Industrial Programmable Logic Controllers |
|---|---|
|
Use Scenario: Storing real-time packet buffering and protocol stack metadata in 4G/LTE base station remote radio units. IC Role / Device Role / Timing Role: High-reliability SRAM buffer with ECC protection against cosmic-ray-induced bit flips in unshielded outdoor enclosures. Use Value: Prevents silent data corruption in critical control structures, reducing field failure rates by eliminating undetected memory errors. |
Use Scenario: Holding ladder logic state tables and I/O mapping registers in DIN-rail mounted PLCs operating in electrically noisy factory environments. IC Role / Device Role / Timing Role: Deterministic-access memory with 10 ns tAA ensuring scan-cycle timing compliance under worst-case EMI conditions. Use Value: Guarantees consistent 1 ms PLC scan times even during voltage sags, thanks to 1.0-V data retention and stable VCC tolerance. |
| Avionics Data Acquisition Units | Medical Imaging Control Systems |
|
Use Scenario: Caching sensor fusion outputs and flight control command histories in airborne inertial measurement units (IMUs). IC Role / Device Role / Timing Role: Radiation-tolerant SRAM with single-bit ECC correcting transient upsets caused by atmospheric neutrons at cruising altitude. Use Value: Meets DO-254 DAL-B requirements for memory integrity without software-based scrubbing overhead. |
Use Scenario: Buffering real-time X-ray detector frame data before FPGA-based compression in portable ultrasound machines. IC Role / Device Role / Timing Role: Low-noise, fast-access memory supporting burst-mode pixel streaming at >50 MB/s sustained bandwidth. Use Value: Enables zero-frame-loss acquisition at 30 fps with minimal power draw (20 mA ISB2) during idle periods between scans. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV20488BLL-10MLI | No integrated ECC; requires external error-checking logic or software parity handling | Suitable only where soft errors are statistically negligible (e.g., benign indoor environments) | Select when cost sensitivity outweighs reliability requirements and system-level ECC can be implemented externally |
| Micron MT45W8MW16BGX-10IT:D | DDR2 SDRAM with on-die ECC; asynchronous interface replaced by clocked DDR protocol | Requires memory controller with DDR timing compliance; incompatible with simple SRAM bus interfaces | Choose only when migrating to higher-density, lower-cost-per-bit memory and redesigning controller firmware/hardware |
Compared with IS61WV20488BLL-10MLI and MT45W8MW16BGX-10IT:D, the CY7C1069G30-10ZSXI provides hardware-transparent ECC correction, pin-compatible SRAM timing, and industrial-grade voltage/temperature margins-making it the sole option for retrofitting ECC into legacy parallel-bus systems without architectural changes.
Availability
CY7C1069G30-10ZSXI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for CY7C1069G30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on signal integrity and long-term manufacturability.
The CY7C1069G series targets applications demanding deterministic timing and data integrity in harsh environments, delivering ECC-enhanced SRAMs that bridge the gap between commodity memory and safety-critical storage requirements.
FAQ
Does CY7C1069G30-10ZSXI support automatic error correction without host intervention?
Yes. The device performs single-bit error correction transparently on every read access using its embedded ECC engine. When a correctable error is detected, the corrected data appears on I/O pins and the ERR pin asserts HIGH. No CPU polling, register access, or firmware action is required for correction.
What is the function of the dual chip enable (CE1/CE2) interface?
CE1 and CE2 implement a logical AND gate: the device activates only when CE1 is LOW and CE2 is HIGH. This configuration allows hierarchical memory decoding-e.g., one address line can select between two CY7C1069G30-10ZSXI devices by driving CE2 of one and CE1 of another-reducing external logic count.
Can CY7C1069G30-10ZSXI operate at 1.8 V?
No. The "30" in the part number denotes the 2.2 V–3.6 V operating range. For 1.65 V–2.2 V operation, the correct variant is CY7C1069G18-15ZSXI (15 ns speed grade). Attempting 1.8 V operation on the G30 variant violates datasheet specifications and may cause timing violations or data retention failure.
Is the ERR pin actively driven or open-drain?
The ERR pin is an actively driven CMOS output. It sources current when HIGH (indicating error correction) and sinks current when LOW (no error detected). No external pull-up resistor is needed, and the pin must not be tied to VCC or grounded-it is designed for direct connection to an interrupt input or status register bit.
CY7C1069G30-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1069G30-10ZSXI FAQ
1.How can I place an order for CY7C1069G30-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069G30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069G30-10ZSXI reliable?
The price and inventory of CY7C1069G30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069G30-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1069G30-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069G30-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069G30-10ZSXI?
CY7C1069G30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069G30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069G30-10ZSXI?
For technical support, including CY7C1069G30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069G30-10ZSXI requirements.
6.How does Aetrix verify that CY7C1069G30-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1069G30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069G30-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1069G30-10ZSXI?
All CY7C1069G30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069G30-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069G30-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1069G30-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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