Infineon Technologies CY7C1069GE30-10ZSXI
- Part No.:
- CY7C1069GE30-10ZSXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1069GE30-10ZSXI.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 54TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:2,006
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1069GE30-10ZSXI from Cypress Semiconductor is a 16-Mbit (2M × 8) CMOS static RAM with embedded single-bit error-correcting code (ECC), dual chip enable (CE1/CE2), and dedicated ERR output for real-time ECC event indication. It operates across 2.2 V–3.6 V, delivers 10 ns access time (tAA), supports TTL-compatible I/O, and retains data at 1.0 V - deployed in industrial-grade embedded controllers requiring fault-resilient memory.
For engineers reviewing the CY7C1069GE30-10ZSXI datasheet, CY7C1069GE30-10ZSXI pinout, CY7C1069GE30-10ZSXI application, or CY7C1069GE30-10ZSXI equivalent, key selection criteria include ECC error signaling behavior, dual CE timing compatibility, TSOP II package thermal resistance (θJA = 93.63 °C/W), and 54-pin center-power pinout layout for signal integrity in high-density PCBs.
Technical Context
The device implements on-die ECC encoding/decoding logic that detects and corrects single-bit errors during read operations, asserting the ERR pin high upon correction. Its dual-chip-enable architecture (CE1 LOW + CE2 HIGH required for access) enables hierarchical memory banking control in multi-SRAM systems.
It uses asynchronous SRAM protocol with separate WE and OE controls: write occurs when CE1=LOW, CE2=HIGH, WE=LOW; read occurs when CE1=LOW, CE2=HIGH, OE=LOW, WE=HIGH. All I/Os enter high-impedance state during deselection, output disable, or write cycles - ensuring clean bus sharing without external isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 words × 8 bits) - supports full byte-wide data paths without multiplexing. |
| Access Time (tAA) | 10 ns at VCC = 2.2–3.6 V - enables direct interface with 100 MHz microcontrollers without wait states. |
| ECC Function | Single-bit error detection and correction per 8-bit word - reduces uncorrectable memory failures in mission-critical firmware storage. |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with modern low-voltage SoCs and FPGA I/O banks. |
| Operating Current (ICC) | 90 mA typical at 100 MHz - defines power budget for continuous burst reads in real-time control loops. |
| Standby Current (ISB2) | 20 mA typical - enables low-power sleep modes while preserving full memory content. |
| Data Retention Voltage | 1.0 V - allows retention during brown-out conditions or battery-backed operation without refresh. |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II) with center power/ground pinout - optimized for thermal dissipation and signal integrity in compact industrial PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address inputs | 21-bit address bus supporting full 2M-word addressing; A20 enables highest address bit selection. |
| I/O0–I/O7 | Bidirectional data bus | 8-bit parallel interface; high-impedance during deselect/write/OE-high - eliminates need for external bus transceivers. |
| CE1, CE2 | Dual chip enable inputs | Logical AND function: only active when CE1=LOW and CE2=HIGH - enables memory bank partitioning and hierarchical decoding. |
| WE | Write enable input | Active-low control for write cycles; latches data on falling edge - synchronizes with standard microprocessor write strobes. |
| OE | Output enable input | Active-low control for read output drivers - decouples read timing from write timing for flexible bus arbitration. |
| ERR | Error indication output | Open-drain output asserted HIGH on single-bit ECC correction - provides interrupt-capable fault signaling to host processor. |
| VCC, VSS | Power and ground | Multiple VCC/VSS pins distributed across center rows - reduces IR drop and improves noise immunity in high-speed operation. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC logic | On-die single-bit error correction per 8-bit word - eliminates need for external ECC controller IC or software overhead. |
| Dual chip enable (CE1/CE2) | Hardware-selectable memory bank enable - simplifies address decoding in multi-SRAM systems and reduces gate count in FPGA glue logic. |
| TTL-compatible I/O | Direct interface with legacy 3.3 V microcontrollers and FPGAs without level-shifting - lowers BOM cost and board area. |
| ERR output pin | Dedicated open-drain interrupt signal - enables immediate host response to corrected memory errors without polling or status register reads. |
| 1.0 V data retention | Full memory content preserved at ultra-low voltage - supports fail-safe operation during power loss or backup battery switchover. |
Applications
| Industrial PLC Memory Buffer | Military Avionics Data Logging |
|---|---|
Use Scenario: Storing real-time sensor fusion outputs and control state history in programmable logic controllers operating in harsh temperature environments. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM buffer with ECC protection - holds critical runtime variables between scan cycles without corruption. Use Value: ERR pin triggers immediate diagnostic logging on first detected bit-flip, enabling predictive maintenance before accumulated errors cause system failure. | Use Scenario: Capturing flight telemetry streams during transient EMI events in airborne mission computers where radiation-induced soft errors are a known risk. IC Role / Device Role / Timing Role: Fault-tolerant scratchpad memory - stores last 2 seconds of inertial measurement unit (IMU) data prior to trigger events. Use Value: On-the-fly ECC correction ensures logged data integrity without CPU intervention, meeting DO-254 DAL-B requirements for data fidelity. |
| Railway Signaling Controller Cache | Medical Imaging System Frame Buffer |
Use Scenario: Caching interlocking logic tables and track occupancy status in EN 5012x-certified signaling hardware with 20-year field life expectancy. IC Role / Device Role / Timing Role: Industrial-grade SRAM with extended temperature support (–40°C to +85°C) and 10 ns access - enables deterministic response within 50 µs safety-critical windows. Use Value: Dual CE architecture allows hot-swappable memory bank isolation during firmware updates, maintaining system availability per IEC 62425. | Use Scenario: Temporary storage of DICOM-compliant ultrasound frames during real-time beamforming processing in portable diagnostic devices. IC Role / Device Role / Timing Role: Low-power, byte-accessible frame buffer - interfaces directly with ARM Cortex-A series SoC AXI bus via GPIO-controlled CE/OE timing. Use Value: 20 mA ISB2 current enables battery-operated imaging sessions >4 hours without compromising image data reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C3256A-10TIN | No integrated ECC; requires external error-checking logic or software implementation. | Lacks hardware ERR signaling - increases host CPU load and latency for error handling. | Select when cost sensitivity outweighs fault tolerance requirements and system-level ECC can be implemented externally. |
| IS61WV20488BLL-10MLI | Includes parity but not full ECC; no automatic correction or ERR output. | Only detects single-bit errors - cannot recover corrupted data without host-initiated reload or reset. | Choose for legacy designs already using parity-based memory subsystems where architectural changes are prohibitive. |
Compared with AS7C3256A-10TIN and IS61WV20488BLL-10MLI, CY7C1069GE30-10ZSXI uniquely delivers autonomous single-bit correction with interrupt signaling - reducing firmware complexity, improving MTBF, and eliminating reliance on external error-handling infrastructure.
Availability
CY7C1069GE30-10ZSXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, military avionics data logging, and railway signaling controller cache applications requiring stable component supply across extended product lifecycles.
Supply support for CY7C1069GE30-10ZSXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-reliability memory, PSoC programmable systems-on-chip, and USB/USB-C solutions for industrial and automotive markets.
The CY7C1069G/E series belongs to Cypress's industrial SRAM portfolio, designed specifically for fault-resilient embedded systems where data integrity must be maintained under EMI, temperature stress, and long-term operation without refresh.
FAQ
What is the function of the ERR pin on CY7C1069GE30-10ZSXI?
The ERR pin is an open-drain output that asserts HIGH whenever the internal ECC logic detects and corrects a single-bit error in the accessed memory word. It remains inactive (high-impedance) during normal reads/writes and does not indicate multi-bit errors. This signal can be directly wired to a microcontroller interrupt input to trigger diagnostic logging or recovery routines without polling.
Does CY7C1069GE30-10ZSXI support automatic write-back after ECC correction?
No. The device performs real-time single-bit error correction during read operations but does not automatically rewrite the corrected data back to the memory array. The corrected value appears on the I/O pins, but the original corrupted bit remains stored until explicitly rewritten by the host system. This behavior is documented in Note 1 of the datasheet.
Can CY7C1069GE30-10ZSXI operate at 1.8 V?
No. The "30" suffix denotes the 2.2 V–3.6 V operating range. For 1.65 V–2.2 V operation, the correct variant is CY7C1069GE18-15ZSXI (15 ns speed grade). Attempting to power CY7C1069GE30-10ZSXI at 1.8 V may result in timing violations, data corruption, or functional failure due to insufficient noise margin and drive strength.
How does the dual chip enable (CE1/CE2) architecture affect memory mapping?
CE1 and CE2 function as a logical AND: the device is selected only when CE1 is LOW and CE2 is HIGH. This allows hierarchical decoding - for example, using CE2 to select a memory region and CE1 to enable individual devices within that region. Unused CE2 lines can be tied HIGH to simplify interface, but doing so forfeits bank-select flexibility in multi-SRAM configurations.
CY7C1069GE30-10ZSXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1069GE30-10ZSXI FAQ
1.How can I place an order for CY7C1069GE30-10ZSXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069GE30-10ZSXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069GE30-10ZSXI reliable?
The price and inventory of CY7C1069GE30-10ZSXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069GE30-10ZSXI is usually 5 days.
3.What payment methods are accepted for CY7C1069GE30-10ZSXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069GE30-10ZSXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069GE30-10ZSXI?
CY7C1069GE30-10ZSXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069GE30-10ZSXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069GE30-10ZSXI?
For technical support, including CY7C1069GE30-10ZSXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069GE30-10ZSXI requirements.
6.How does Aetrix verify that CY7C1069GE30-10ZSXI is sourced from the original manufacturer or authorized distributors?
All CY7C1069GE30-10ZSXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069GE30-10ZSXI meets industry standards.
7.What is the process for return or replacement of CY7C1069GE30-10ZSXI?
All CY7C1069GE30-10ZSXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069GE30-10ZSXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069GE30-10ZSXI part is unused and in its original packaging.
Return procedure for CY7C1069GE30-10ZSXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1069GE30-10ZSXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

