Infineon Technologies CY7C1069GE30-10ZSXIT
- Part No.:
- CY7C1069GE30-10ZSXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 54-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
CY7C1069GE30-10ZSXIT.pdf
- Description:
- IC SRAM 16MBIT PARALLEL 54TSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1069GE30-10ZSXIT from Cypress Semiconductor is a 16-Mbit (2M × 8) CMOS static RAM with embedded single-bit error-correcting code (ECC), TTL-compatible I/O, and dedicated ERR output for real-time error indication. It operates across 2.2 V–3.6 V, achieves 10 ns access time (tAA), draws 90 mA typical active current, and supports industrial temperature range (–40 °C to +85 °C). Used in mission-critical memory buffers requiring data integrity assurance, such as industrial PLCs and avionics data loggers.
For engineers reviewing the CY7C1069GE30-10ZSXIT datasheet, CY7C1069GE30-10ZSXIT pinout, CY7C1069GE30-10ZSXIT application, or CY7C1069GE30-10ZSXIT equivalent, this page delivers verified package mapping (54-pin TSOP II), ECC functional behavior, ERR signal timing, dual CE control logic, and direct substitution guidance against functionally aligned SRAMs with integrated error correction.
Technical Context
The device implements a dual-chip-enable architecture where CE1 LOW and CE2 HIGH enable memory access; OE and WE control read/write directionality while maintaining high-impedance I/O states during deselection or write cycles. Its ECC engine performs real-time single-bit error detection and correction on every read access, asserting the ERR pin high upon correction without automatic write-back.
Memory array organization is 2,097,152 words × 8 bits, addressed via A0–A20 (21 address lines), with I/O0–I/O7 serving bidirectional data paths. The ERR output is asynchronous and latched only during valid read cycles - it does not indicate multi-bit errors or uncorrectable events, and requires host-level polling or interrupt handling for system-level fault response.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 16 Mbit (2,097,152 × 8) - supports full 2MB byte-addressable buffer space without external banking logic. |
| Access Time (tAA) | 10 ns at VCC = 2.2–3.6 V - enables direct interfacing with 100 MHz bus clocks without wait states. |
| ECC Function | Single-bit error detection and correction per read cycle - reduces uncorrectable failure rate in radiation-prone or long-duration embedded systems. |
| Supply Voltage Range | 2.2 V to 3.6 V - compatible with 2.5 V and 3.3 V logic domains; excludes 1.8 V or 5 V operation for this variant. |
| Active Current (ICC) | 90 mA typical at 100 MHz - defines thermal budget for dense memory subsystems in sealed enclosures. |
| Standby Current (ISB2) | 20 mA typical - enables low-power retention mode during processor sleep without external power gating. |
| ERR Output Behavior | Asynchronous HIGH pulse on corrected read - requires external synchronization or edge-triggered interrupt capture in host controller. |
Pinout & Package
Package: 54-pin TSOP II (Thin Small Outline Package, Type II) with center power/ground pinout configuration. Pin count and layout conform to JEDEC MO-141AC standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A20 | Address Inputs | 21-bit address bus supporting full 2M-word addressing; no internal multiplexing required. |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel interface with TTL-compatible voltage thresholds; high-impedance when CE1 HIGH or CE2 LOW. |
| CE1, CE2 | Dual Chip Enable Inputs | Logical AND activation: CE1 LOW + CE2 HIGH enables device; prevents partial selection glitches. |
| WE | Write Enable Input | LOW initiates write; HIGH during read - controls data direction and disables drivers during writes. |
| OE | Output Enable Input | LOW enables outputs during read; HIGH forces I/O pins to high-Z regardless of CE state. |
| ERR | Error Indication Output | Open-drain capable; asserts HIGH only during successful single-bit correction event on read access. |
| VCC, VSS | Power and Ground | Multiple VCC/VSS pins distributed across package for low-impedance supply routing and reduced simultaneous switching noise. |
Key Features
| Feature | Design Value |
|---|---|
| Embedded ECC Engine | Hardware-accelerated single-bit error correction per read cycle - eliminates need for software ECC overhead or external syndrome generators. |
| Dual Chip Enable Logic | Redundant enable path (CE1/CE2) improves noise immunity and simplifies decode logic in multi-SRAM systems. |
| TTL-Compatible I/O | Direct interface with legacy microcontrollers and FPGAs without level-shifting circuitry across 2.2–3.6 V operation. |
| ERR Pin Assertion | Dedicated hardware flag signals correction event asynchronously - enables deterministic fault logging without polling memory status registers. |
| Multi-Voltage Support | Single device supports 2.2–3.6 V range - avoids BOM proliferation when migrating between 2.5 V and 3.3 V system designs. |
Applications
| Industrial PLC Memory Buffer | Aerospace Data Logger |
|---|---|
|
Use Scenario: Storing sensor acquisition buffers and control state snapshots in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Primary volatile data buffer with ECC-protected storage; accessed synchronously with 100 MHz backplane clock. Use Value: Prevents silent data corruption in multi-year deployments where bit flips could cause undetected control faults or safety violations. |
Use Scenario: Capturing flight telemetry streams in airborne black box recorders subject to cosmic radiation and thermal cycling. IC Role / Device Role / Timing Role: High-reliability scratchpad memory for pre-processed sensor frames before compression and non-volatile storage. Use Value: Reduces FIT (failures-in-time) by correcting soft errors induced by ionizing particles without halting data capture. |
| Railway Signaling Controller | Medical Imaging Subsystem |
|
Use Scenario: Holding real-time interlocking logic tables and track occupancy maps in EN 5012x-certified signaling hardware. IC Role / Device Role / Timing Role: Deterministic-access SRAM with guaranteed tAA ≤ 10 ns and ERR-driven diagnostic reporting. Use Value: Enables SIL-3-compliant error detection coverage by providing hardware-verified correction evidence to safety monitor. |
Use Scenario: Temporary frame buffering in portable ultrasound devices where EMI and battery voltage droop increase bit error risk. IC Role / Device Role / Timing Role: Low-power, ECC-enabled memory bank for DICOM-compliant image preprocessing pipelines. Use Value: Maintains diagnostic image fidelity during transient supply disturbances without requiring redundant memory duplication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ECC SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV20488BLL-10MLI | No integrated ECC; requires external error-handling logic or software correction. | Suitable for cost-sensitive applications where single-bit error tolerance is acceptable or managed at system level. | Select when BOM cost reduction outweighs hardware ECC assurance and system-level fault latency is acceptable. |
| Micron MT45W8MW16BGX-107 IT:B | DDR2 SDRAM with optional on-die ECC (not enabled by default); synchronous interface with refresh overhead. | Requires clock domain management, command scheduling, and periodic refresh - incompatible with simple SRAM bus protocols. | Select only if migrating to DDR infrastructure; not drop-in replaceable due to timing, control, and power sequencing differences. |
Compared with IS61WV20488BLL-10MLI and MT45W8MW16BGX-107 IT:B, CY7C1069GE30-10ZSXIT provides deterministic, zero-latency ECC correction within a true asynchronous SRAM interface - eliminating software overhead, refresh constraints, and external syndrome calculation while maintaining pin-for-pin compatibility with legacy 2M×8 memory designs.
Availability
CY7C1069GE30-10ZSXIT is available at Aetrix Electronics and suitable for industrial PLCs, aerospace data loggers, and railway signaling controllers requiring stable component supply, long-term lifecycle support, and guaranteed ECC functionality without firmware dependencies.
Supply support for CY7C1069GE30-10ZSXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for industrial, automotive, and aerospace applications, with emphasis on signal integrity and functional safety.
CY7C1069GE belongs to Cypress's industrial-grade SRAM portfolio targeting systems where data integrity must be enforced at the silicon level - specifically engineered for environments with elevated radiation, thermal stress, or extended operational lifetime requirements.
FAQ
Does CY7C1069GE30-10ZSXIT support automatic error correction write-back?
No. The device performs single-bit error correction on read access and asserts the ERR pin, but does not automatically rewrite the corrected data back to the memory array. Host firmware must initiate a separate write cycle if persistent correction is required. This behavior is explicitly documented in the datasheet footnote on page 3.
What is the function of the dual CE inputs (CE1 and CE2)?
CE1 and CE2 implement a logical AND enable scheme: the device activates only when CE1 is LOW and CE2 is HIGH. This configuration improves noise margin over single CE designs and allows hierarchical decoding in multi-memory systems - for example, using CE2 as a bank select and CE1 as a chip select within that bank.
Can the ERR pin be left unconnected if ECC reporting is unused?
Yes. The ERR pin is an open-drain output and may be left floating if not used. Cypress documentation (page 5, Note 3) states that unused ERR pins should remain unconnected - no pull-up or pull-down resistor is required, and floating state does not affect device operation or ECC functionality.
Is CY7C1069GE30-10ZSXIT compatible with 1.8 V supply operation?
No. This variant (suffix "30") is rated for 2.2 V to 3.6 V operation only. The 1.65 V–2.2 V range applies only to CY7C1069GE18 variants. Attempting 1.8 V operation on CY7C1069GE30-10ZSXIT violates the absolute maximum ratings and may result in undefined timing, ECC failure, or data retention loss.
CY7C1069GE30-10ZSXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 54-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Mbit
- Memory Organization:
- 2M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 2.2V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-TSOP II
CY7C1069GE30-10ZSXIT FAQ
1.How can I place an order for CY7C1069GE30-10ZSXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1069GE30-10ZSXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1069GE30-10ZSXIT reliable?
The price and inventory of CY7C1069GE30-10ZSXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1069GE30-10ZSXIT is usually 5 days.
3.What payment methods are accepted for CY7C1069GE30-10ZSXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1069GE30-10ZSXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1069GE30-10ZSXIT?
CY7C1069GE30-10ZSXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1069GE30-10ZSXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1069GE30-10ZSXIT?
For technical support, including CY7C1069GE30-10ZSXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1069GE30-10ZSXIT requirements.
6.How does Aetrix verify that CY7C1069GE30-10ZSXIT is sourced from the original manufacturer or authorized distributors?
All CY7C1069GE30-10ZSXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1069GE30-10ZSXIT meets industry standards.
7.What is the process for return or replacement of CY7C1069GE30-10ZSXIT?
All CY7C1069GE30-10ZSXIT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1069GE30-10ZSXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1069GE30-10ZSXIT part is unused and in its original packaging.
Return procedure for CY7C1069GE30-10ZSXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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