Infineon Technologies CY7C106D-10VXI

Overview

CY7C106D-10VXI from Cypress Semiconductor is a 1-Mbit (256 K × 4) high-speed CMOS static RAM with 10 ns access time, 5 V supply, TTL-compatible I/O, and automatic CE-controlled power-down. It features 28-pin 400-mil SOJ packaging, 2.0 V data retention, and tri-state I/O for bus sharing in embedded memory subsystems.

For engineers reviewing the CY7C106D-10VXI datasheet, CY7C106D-10VXI pinout, CY7C106D-10VXI application, or CY7C106D-10VXI equivalent, key selection criteria include tAA = 10 ns read timing, ISB2 = 3.0 mA standby current, VCC = 5 V ±0.5 V operation, and compatibility with legacy 5 V TTL microprocessors requiring VIH ≥ 2.2 V.

Technical Context

This SRAM implements a 262,144 × 4-bit array with separate address decoding (A0–A17), tri-state bidirectional I/O (IO0–IO3), and three control inputs: CE (active-low chip enable), OE (active-low output enable), and WE (active-low write enable). All control signals are TTL-compatible with VIH ≥ 2.2 V and VIL ≤ 0.8 V.

Power management is handled via automatic CE-driven power-down: when CE is HIGH, ICC drops to ISB2 = 3.0 mA (CMOS mode) or ISB1 = 10 mA (TTL mode); during active read/write, ICC = 80 mA at 100 MHz. Data retention operates down to VCC = 2.0 V with no external refresh required.

Key Specifications

Pinout & Package

28-pin 400-mil wide molded SOJ package with gull-wing leads, RoHS-compliant, JEDEC MS-012AC compliant footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Compared with CY7C106B-10VXI, CY7C106D-10VXI offers RoHS compliance and guaranteed 2.0 V data retention; versus AS6C1008-10TIN, it maintains native 5 V TTL compatibility but consumes more standby power in 3.3 V systems.

Availability

CY7C106D-10VXI is available at Aetrix Electronics and suitable for industrial PLC memory buffers, legacy microcontroller data RAM expansion, and automotive engine control unit cache applications requiring stable component supply and long-term lifecycle support.

Supply support for CY7C106D-10VXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, PSoC, and USB solutions for embedded systems.

The CY7C106D belongs to Cypress's legacy high-speed CMOS SRAM product line, designed specifically for 5 V TTL-based microprocessor systems requiring deterministic timing, low-latency access, and industrial temperature operation.

FAQ

Is CY7C106D-10VXI compatible with 3.3 V systems?

No. CY7C106D-10VXI is specified only for 5 V ±0.5 V operation. Its TTL-compatible inputs require VIH ≥ 2.2 V, but its VCC must be 5 V; applying 3.3 V will cause functional failure and is outside absolute maximum ratings. Use AS6C1008-10TIN or IS61LV25616 for 3.3 V designs.

What is the purpose of the NC pins on CY7C106D-10VXI?

Pins 11 and 12 are No Connect (NC) terminals-unbonded on the die and electrically isolated. They must remain unconnected in PCB layout; tying them to GND or VCC may cause mechanical stress or unintended coupling. Cypress confirms these pins serve no electrical function and are reserved for future package variants.

Does CY7C106D-10VXI require an external clock or refresh circuitry?

No. As a static RAM, CY7C106D-10VXI has no clock input and requires no refresh cycles. Data retention is maintained as long as VCC remains ≥ 2.0 V and CE is held HIGH in standby. All timing is controlled solely by CE, OE, and WE signal edges-not by any internal oscillator or counter.

Can CY7C106D-10VXI be used in place of CY7C1006D-10VXI?

Yes, with mechanical caveats. Both share identical electrical specs and pin functions, but CY7C106D uses a 400-mil SOJ package while CY7C1006D uses a narrower 300-mil SOJ. PCB footprints are not interchangeable-mounting requires matching land patterns. Signal integrity and thermal performance differ slightly due to package size and θJA (58.76 °C/W vs. 59.16 °C/W).