Infineon Technologies CY7C1081DV33-12BAXI
- Part No.:
- CY7C1081DV33-12BAXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-LFBGA
- Datasheet:
-
CY7C1081DV33-12BAXI.pdf
- Description:
- IC SRAM 64MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,660
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Product details
Overview
CY7C1081DV33-12BAXI from Cypress Semiconductor is a 64-Mbit (4 M × 16) high-speed CMOS static RAM with 12 ns access time, 3.3 V ±0.3 V operation, and automatic CE power-down mode. It supports byte-wide writes via independent BHE/ BLE controls and delivers 300 mA active current and 100 mA CMOS standby current. Used in industrial embedded systems requiring deterministic timing and nonvolatile data retention at 2.0 V.
For engineers reviewing the CY7C1081DV33-12BAXI datasheet, CY7C1081DV33-12BAXI pinout, CY7C1081DV33-12BAXI application, or CY7C1081DV33-12BAXI equivalent, key selection criteria include tAA = 12 ns read timing, dual chip enable (CE1/CE2) logic for memory expansion, FBGA-48 package compatibility, and 2.0-V data retention capability under power loss conditions.
Technical Context
The CY7C1081DV33-12BAXI implements a synchronous, address-decoded SRAM array with independent high- and low-byte write enables (BHE/BLE), enabling partial-word writes without read-modify-write cycles. Its dual CE architecture (CE1 LOW + CE2 HIGH) allows hierarchical memory mapping and seamless bank expansion in multi-chip configurations.
It features TTL-compatible I/Os, automatic power-down on chip deselect, and high-impedance outputs during deselection, OE HIGH, or write operations. AC timing guarantees include tDOE = 7 ns (OE to data valid), tHZOE = 7 ns (OE HIGH to high-Z), and tLZCE = 3 ns (CE assertion to low-Z), supporting tight bus timing in real-time controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Mbit (4,194,304 × 16), enabling 8 MB of fast parallel-access storage |
| Access time (tAA) | 12 ns - defines maximum clock-to-data latency in address-stable read cycles |
| Supply voltage | 3.3 V ±0.3 V - requires stable LDO regulation; not compatible with 2.5 V or 5 V rails |
| Active current (ICC) | 300 mA at 12 ns - sets minimum PCB trace width and thermal margin for sustained burst reads |
| CMOS standby current (ISB2) | 100 μA - enables ultra-low-power hold mode during processor sleep states |
| Data retention voltage | 2.0 V - maintains stored contents during brown-out or controlled power-down sequences |
| Package | 48-ball FBGA (6 mm × 8 mm, 0.8 mm pitch) - requires controlled-depth reflow and X-ray inspection |
Pinout & Package
Package: 48-ball fine-pitch ball grid array (FBGA), JEDEC MO-246AC compliant, 6 mm × 8 mm body, 0.8 mm ball pitch, bottom-side solder termination.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A21 | Address inputs | 22-bit address bus supporting full 4 M-word addressing; A0 least significant |
| I/O0–I/O7 | Data bus (low byte) | Bi-directional 8-bit data path enabled when BLE = LOW during read/write |
| I/O8–I/O15 | Data bus (high byte) | Bi-directional 8-bit data path enabled when BHE = LOW during read/write |
| CE1, CE2 | Chip enable pair | Active-low CE1 and active-high CE2 form AND-gated chip select; enables memory banking |
| WE | Write enable | Active-low control initiating write cycle; overrides OE during concurrent access |
| OE | Output enable | Active-low control enabling output drivers; high-Z when HIGH or during write |
| BLE, BHE | Byte enable controls | Independent low/high byte gating - eliminates need for external byte masks |
| VCC, VSS | Power terminals | Dual VCC (3.3 V) and VSS pins distributed across package for low-impedance decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Dual chip enable (CE1/CE2) | Enables hierarchical memory decoding and seamless expansion beyond 64 Mbit using external logic |
| Independent byte write (BHE/BLE) | Allows 8-bit or 16-bit writes without read-modify-write overhead - critical for DMA efficiency |
| Automatic CE power-down | Reduces ICC to 100 μA when CE1 HIGH or CE2 LOW - eliminates need for external power gating |
| TTL-compatible I/O | Supports direct interface with legacy 3.3 V microcontrollers and FPGAs without level shifters |
| 2.0 V data retention | Maintains memory state during brown-out or controlled shutdown - supports safe firmware recovery |
Applications
| Industrial PLC Data Buffer | Avionics Sensor Log Buffer |
|---|---|
Use Scenario: Real-time collection of analog sensor readings and digital I/O status in programmable logic controllers operating at –40 °C to +85 °C. IC Role / Device Role / Timing Role: High-reliability parallel SRAM acting as deterministic latency buffer between ADC/DAC peripherals and ARM Cortex-M7 core. Use Value: 12 ns tAA ensures sub-microsecond response to interrupt-driven sampling; 2.0 V retention preserves last known state during mains failure. | Use Scenario: Continuous logging of inertial measurement unit (IMU) and GPS timestamped telemetry in airborne flight recorders. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM holding pre-crash data frames prior to flash transfer; operates under EMI-heavy environments. Use Value: Dual CE architecture isolates log buffer from main system bus during fault events; ISB2 = 100 μA extends battery-backed runtime. |
| Medical Imaging Frame Store | Test Equipment Pattern Memory |
Use Scenario: Temporary storage of uncompressed ultrasound or endoscope video frames before JPEG compression and network transmission. IC Role / Device Role / Timing Role: Burst-mode parallel memory interfaced to FPGA-based image pipeline with AXI-lite bridge. Use Value: Independent BHE/BLE enables pixel-aligned 16-bit writes without bus turnaround; tDOE = 7 ns meets 100 MHz pixel clock timing. | Use Scenario: Storage of stimulus/response vectors in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: Deterministic-access pattern memory synchronized to 100 MHz ATE controller clock with zero wait states. Use Value: tRC = 12 ns supports full-speed vector streaming; FBGA-48 footprint matches standard ATE socket layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar parallel SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C8016-12BIN | Same density (4M×16), 12 ns access, but uses single CE and no BHE/BLE; 2.7–3.6 V supply range | Lacks byte-select capability; requires external logic for partial writes; wider VCC tolerance eases supply design | Select when byte masking is handled externally and supply rail flexibility outweighs write granularity needs |
| IS61LV51216AL-12MLI | 512 K × 16 (8 Mbit), 12 ns, single CE, 3.3 V only; lower ICC (120 mA) but no 2.0 V retention | Higher density but no data retention below 3.0 V; lacks automatic power-down on deselect | Select for higher capacity where brown-out resilience is managed by system-level backup power |
Compared with AS6C8016-12BIN and IS61LV51216AL-12MLI, the CY7C1081DV33-12BAXI uniquely combines dual CE expansion, independent byte write, and guaranteed 2.0 V data retention - making it optimal for safety-critical industrial and avionics buffers where deterministic behavior and state preservation are mandatory.
Availability
CY7C1081DV33-12BAXI is available at Aetrix Electronics and suitable for industrial PLC data buffering, avionics sensor logging, and medical imaging frame storage requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CY7C1081DV33-12BAXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable system-on-chip solutions for industrial, automotive, and aerospace applications.
The CY7C1081DV33 belongs to Cypress's high-speed parallel SRAM product line, engineered specifically for deterministic-latency, low-power, and fail-safe data buffering in mission-critical embedded systems.
FAQ
What is the minimum VCC required for reliable operation?
The CY7C1081DV33-12BAXI requires VCC ≥ 3.0 V for full functionality. Operation begins 100 μs after VCC reaches typical 3.3 V. Below 3.0 V, only data retention at 2.0 V is guaranteed - no read/write operations are supported in that range.
Can CE1 and CE2 be tied together for simplified interface?
No - CE1 and CE2 implement complementary logic (CE1 LOW AND CE2 HIGH activates the device). Tying them together violates the required logic states and forces the device into permanent deselected or undefined mode per the truth table on page 9 of the datasheet.
Does the device support asynchronous burst reads?
No - the CY7C1081DV33-12BAXI is a static RAM with no internal burst counter or sequential addressing logic. Each read requires a full address setup; burst transfers must be managed externally by the controller or FPGA.
Is the FBGA-48 package RoHS-compliant and lead-free?
Yes - the "X" suffix in CY7C1081DV33-12BAXI denotes Pb-free (lead-free) construction per JEDEC J-STD-609, with matte tin finish on all balls and full compliance with RoHS Directive 2011/65/EU.
CY7C1081DV33-12BAXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-LFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 64Mbit
- Memory Organization:
- 4M x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (8x9.5)
CY7C1081DV33-12BAXI FAQ
1.How can I place an order for CY7C1081DV33-12BAXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1081DV33-12BAXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1081DV33-12BAXI reliable?
The price and inventory of CY7C1081DV33-12BAXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1081DV33-12BAXI is usually 5 days.
3.What payment methods are accepted for CY7C1081DV33-12BAXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1081DV33-12BAXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1081DV33-12BAXI?
CY7C1081DV33-12BAXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1081DV33-12BAXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1081DV33-12BAXI?
For technical support, including CY7C1081DV33-12BAXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1081DV33-12BAXI requirements.
6.How does Aetrix verify that CY7C1081DV33-12BAXI is sourced from the original manufacturer or authorized distributors?
All CY7C1081DV33-12BAXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1081DV33-12BAXI meets industry standards.
7.What is the process for return or replacement of CY7C1081DV33-12BAXI?
All CY7C1081DV33-12BAXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1081DV33-12BAXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1081DV33-12BAXI part is unused and in its original packaging.
Return procedure for CY7C1081DV33-12BAXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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