Infineon Technologies CY7C109B-15VXC
- Part No.:
- CY7C109B-15VXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-BSOJ (0.400", 10.16mm Width)
- Datasheet:
-
CY7C109B-15VXC.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32SOJ
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C109B-15VXC from Cypress Semiconductor is a 128K × 8 (131,072 words × 8-bit) high-speed CMOS static RAM with 15 ns maximum access time (tAA), TTL-compatible I/O, automatic CE-controlled power-down, and 2.0V data retention capability. It operates at 5V ±10% over the commercial temperature range (0°C to +70°C) and is used in embedded controllers, industrial PLCs, and legacy communication interface buffers requiring non-volatile data hold during low-power states.
For engineers reviewing the CY7C109B-15VXC datasheet, CY7C109B-15VXC pinout, CY7C109B-15VXC application, or CY7C109B-15VXC equivalent, key selection criteria include its dual chip enable architecture (CE1 active LOW, CE2 active HIGH), tri-state I/O timing (tHZOE = 8 ns), 400-mil SOJ Pb-free package, and compatibility with memory expansion via OE/WE/CE control logic in space-constrained board designs.
Technical Context
The CY7C109B-15VXC implements a full CMOS SRAM core with row/column decoding, sense amplifiers, and input/output buffers. Its dual CE architecture enables hierarchical memory mapping-CE1 and CE2 must be asserted in complementary polarity (CE1 = LOW, CE2 = HIGH) for read/write activation, while either CE deassertion forces automatic power-down with ISB2 ≤ 10 mA at VCC = 5.0V.
Read operations require CE1 = LOW, OE = LOW, WE = HIGH, and CE2 = HIGH; write operations require CE1 = LOW, WE = LOW, CE2 = HIGH, with address setup (tAW = 12 ns) and data hold (tHD = 0 ns) referenced to the terminating edge of the control signal. All eight I/O pins enter high-impedance state during deselect, output disable, or write cycles.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 8 (131,072 words × 8-bit); supports byte-wide data bus interfacing without external demultiplexing |
| Access Time (tAA) | 15 ns max; defines minimum clock-to-data delay in synchronous read cycles at 5V |
| Operating Voltage | 5.0V ±10%; ensures compatibility with legacy 5V TTL/CMOS system rails and level-shifting simplicity |
| Standby Current (ISB2) | 10 mA max (CMOS inputs); enables low-quiescent power management when deselected in battery-backed systems |
| Data Retention Voltage | 2.0V min; guarantees data integrity during brown-out or controlled power-down without external backup supply |
| Output Enable Delay (tDOE) | 8 ns max; determines minimum latency between OE assertion and valid data on I/O0–I/O7 |
| Package | 32-pin 400-mil SOJ (Pb-free); surface-mount compatible with standard reflow profiles and legacy socket footprints |
Pinout & Package
Package: 32-pin 400-mil Small Outline J-Lead (SOJ), Pb-free, body width 400 mil (10.16 mm), JEDEC MO-052 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 131,072-word addressing; A16 is MSB |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tri-state I/O lines shared for read and write; high-impedance when CE1 HIGH, CE2 LOW, or OE HIGH |
| CE1 | Active-LOW Chip Enable | Primary selection signal; device disabled if HIGH, enabling hierarchical memory banking |
| CE2 | Active-HIGH Chip Enable | Secondary selection signal; must be HIGH with CE1 LOW for access; enables OR/NAND decode flexibility |
| OE | Active-LOW Output Enable | Controls output drivers only; does not affect internal memory state or power mode |
| WE | Active-LOW Write Enable | Initiates write cycle when CE1 LOW and CE2 HIGH; latches data on I/O0–I/O7 |
| VCC | Power Supply | +5.0V ±10% main supply; powers core logic, I/O buffers, and sense amplifiers |
| GND | Ground Reference | Signal and power return path; decoupling required within 10 mm of VCC pin |
| NC | No Connect | Pin 15 (SOJ top view); internally unconnected; must remain floating or grounded per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Dual Chip Enable Interface | CE1 (active LOW) and CE2 (active HIGH) allow flexible address decoding using NAND or NOR gates without external logic |
| Automatic Power-Down | Device enters low-current standby (ISB2 ≤ 10 mA) when CE1 HIGH or CE2 LOW - no external control needed |
| 2.0V Data Retention | Maintains stored data down to 2.0V VCC, enabling use in systems with brown-out detection and graceful shutdown |
| TTL-Compatible I/O | VIH = 2.2V min, VOL = 0.4V max at IOL = 8.0 mA - interoperable with 5V microcontrollers and FPGAs without level shifters |
| Tri-State Output Timing | tHZOE = 8 ns and tLZOE = 0 ns ensure glitch-free bus sharing and clean transitions during multi-device arbitration |
Applications
| Industrial PLC Data Buffer | Legacy Communication Protocol Adapter |
|---|---|
|
Use Scenario: Storing protocol translation tables and frame buffers in RS-485/Modbus gateways where firmware updates occur infrequently but data persistence across power cycles is critical. IC Role / Device Role: Byte-addressable scratchpad memory holding configuration registers and transient packet payloads. Use Value: 2.0V data retention allows safe storage during brief AC dropout; 15 ns access supports real-time response to master polling at up to 66 kHz. |
Use Scenario: Acting as a FIFO buffer between UART peripherals and an 8-bit microcontroller in point-of-sale terminals with intermittent power delivery. IC Role / Device Role: Standalone parallel SRAM providing deterministic read/write latency without DRAM refresh overhead. Use Value: Dual CE architecture simplifies address decoding in constrained 8-bit address spaces; Pb-free SOJ meets RoHS compliance for medical-grade devices. |
| Embedded Controller Bootloader Cache | Test Equipment Firmware Patch Memory |
|
Use Scenario: Caching decompressed bootloader code segments during cold start in automotive body control modules with strict boot-time budgets. IC Role / Device Role: High-reliability instruction/data cache supplementing internal MCU RAM for secure firmware validation routines. Use Value: 15 ns tAA enables single-cycle reads at 66 MHz CPU clock rates; ISB2 ≤ 10 mA reduces standby current in always-on monitoring circuits. |
Use Scenario: Holding field-upgradable calibration constants and instrument-specific firmware patches in benchtop oscilloscopes and signal generators. IC Role / Device Role: Non-volatile shadow memory accessed only during service mode, isolated from main execution path. Use Value: 400-mil SOJ footprint matches legacy test equipment PCB tooling; CE/OE/WE timing margins accommodate aging controller timing skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-15PCN | 128K × 8, 15 ns, 5V, 32-pin SOP; higher ICC (100 mA) and no 2.0V data retention | Lacks data retention below 3.0V; requires external backup circuitry for brown-out resilience | Prefer when SOP footprint is mandatory and power-down functionality is handled externally |
| IS61LV1024-15KLI | 128K × 8, 15 ns, 3.3V core (5V-tolerant I/O), 32-pin TSOP; lower active power (300 mW) | Requires 3.3V supply rail; incompatible with pure 5V-only systems without level translation | Choose for new 3.3V designs prioritizing thermal performance and density over legacy 5V compatibility |
Compared with AS6C1008-15PCN and IS61LV1024-15KLI, the CY7C109B-15VXC uniquely combines 5V operation, 2.0V data retention, and Pb-free 400-mil SOJ packaging - making it irreplaceable in retrofitting legacy 5V industrial controllers requiring guaranteed data hold during undervoltage events.
Availability
CY7C109B-15VXC is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy communication protocol adapters, and embedded controller bootloader caching requiring stable component supply across long-lifecycle programs.
Supply support for CY7C109B-15VXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, PSoC, and USB solutions for industrial, automotive, and consumer applications.
The CY7C109B belongs to Cypress's legacy parallel SRAM product line, designed specifically for drop-in replacement of obsolete 5V NMOS and HMOS memories in mission-critical industrial and telecom infrastructure.
FAQ
Is CY7C109B-15VXC pin-compatible with CY7C1009B-15VXC?
Yes - both share identical 32-pin 400-mil SOJ pinouts and functional behavior. The CY7C1009B uses a narrower 300-mil SOJ body, but the CY7C109B-15VXC's 400-mil variant maintains mechanical and electrical compatibility with existing 400-mil sockets and PCB footprints.
Does CY7C109B-15VXC support true 2.0V operation or only data retention at 2.0V?
It supports data retention only at 2.0V - active read/write operation requires 5.0V ±10%. The 2.0V specification applies solely to VCC during power-down mode when CE1 is HIGH or CE2 is LOW, ensuring stored bits remain intact without refresh.
Can CE1 and CE2 be tied together for simplified decoding?
No - CE1 is active LOW and CE2 is active HIGH; tying them directly would prevent device selection. To simplify decoding, use an inverter between CE1 and CE2, or implement NAND-based logic where CE1 = /CS and CE2 = /(/CS · /OE) to maintain proper polarity separation.
What is the maximum capacitive load supported on I/O0–I/O7 for guaranteed timing compliance?
The datasheet specifies AC timing under 30 pF total load (including PCB trace and scope probe). For guaranteed tDOE ≤ 8 ns and tHZOE ≤ 8 ns, total load must not exceed 30 pF; derating is required beyond this value, and layout should minimize stub length and use series termination if driving >2 loads.
CY7C109B-15VXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-BSOJ (0.400", 10.16mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-SOJ
CY7C109B-15VXC FAQ
1.How can I place an order for CY7C109B-15VXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C109B-15VXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C109B-15VXC reliable?
The price and inventory of CY7C109B-15VXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C109B-15VXC is usually 5 days.
3.What payment methods are accepted for CY7C109B-15VXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C109B-15VXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C109B-15VXC?
CY7C109B-15VXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C109B-15VXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C109B-15VXC?
For technical support, including CY7C109B-15VXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C109B-15VXC requirements.
6.How does Aetrix verify that CY7C109B-15VXC is sourced from the original manufacturer or authorized distributors?
All CY7C109B-15VXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C109B-15VXC meets industry standards.
7.What is the process for return or replacement of CY7C109B-15VXC?
All CY7C109B-15VXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C109B-15VXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C109B-15VXC part is unused and in its original packaging.
Return procedure for CY7C109B-15VXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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