Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CY7C109B-20ZC

Part No.:
CY7C109B-20ZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
32-TFSOP (0.724", 18.40mm Width)
Datasheet:
AetrixCY7C109B-20ZC.pdf
Description:
IC SRAM 1MBIT PARALLEL 32TSOP I
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,385

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CY7C109B-20ZC from Cypress Semiconductor is a 128K × 8 (1,048,576-bit) high-speed CMOS static RAM in a 32-pin TSOP Type I package, featuring 20 ns access time, 75 mA max operating current, TTL-compatible I/O, and automatic CE power-down. It serves as main or buffer memory in embedded controllers requiring fast, non-refreshed data retention at 5 V.

For engineers reviewing the CY7C109B-20ZC datasheet, CY7C109B-20ZC pinout, CY7C109B-20ZC application, or CY7C109B-20ZC equivalent, key selection criteria include access timing consistency across temperature, low standby current (10 mA), tri-state I/O control via CE1/CE2/OE/WE, and compatibility with legacy 32-pin memory bus layouts.

Technical Context

The CY7C109B-20ZC implements a full asynchronous SRAM architecture with dual chip enables (CE1 active-low, CE2 active-high), separate write enable (WE) and output enable (OE), and 17 address lines (A0–A16) supporting 131,072-word addressing. Its tri-state I/O drivers and automatic power-down on chip deselect eliminate external bus contention.

It operates exclusively at 5 V ±10% over commercial temperature (0°C to +70°C), supports 2.0 V data retention during standby, and uses standard TTL logic thresholds (VIH = 2.2 V, VIL = 0.8 V) for seamless integration with microcontroller buses without level shifting.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 8 (131,072 words × 8 bits); matches 8-bit data bus width without byte masking logic
Access Time (tAA) 20 ns max; guarantees valid data within 20 ns of stable address and CE1/OE assertion
Operating Current (ICC) 75 mA max at fMAX = 50 MHz; defines worst-case power rail sizing for continuous read/write
Standby Current (ISB2) 10 mA max (CMOS inputs); enables low-power sleep mode when CE1 HIGH or CE2 LOW
Data Retention Voltage 2.0 V min; retains stored data with VCC reduced to 2.0 V while CE1/CE2 inactive
I/O Drive Strength VOH = 2.4 V @ –4 mA, VOL = 0.4 V @ 8 mA; ensures noise margin >0.4 V under 50-pF load
Input Capacitance 9 pF max; limits address/data bus loading and signal integrity degradation at 50 MHz

Pinout & Package

Package: 32-pin TSOP Type I (JEDEC MO-153), 10.16 mm × 13.10 mm body, 0.5 mm pitch, gull-wing leads.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit address bus; selects one of 131,072 memory locations; no internal latching
I/O0–I/O7 Bidirectional Data Bus 8-bit multiplexed input/output; high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW
CE1 Active-Low Chip Enable Primary selection signal; device enabled only when CE1 = LOW AND CE2 = HIGH
CE2 Active-High Chip Enable Secondary enable; must be HIGH for read/write; enables memory expansion via CE1/CE2 pairing
OE Active-Low Output Enable Controls output drivers only; does not affect write operations or power state
WE Active-Low Write Enable Initiates write cycle when CE1 = LOW, CE2 = HIGH, and WE = LOW; disables outputs during write
VCC Power Supply +5.0 V ±10%; powers core logic and I/O buffers; decoupling required within 10 mm
GND Ground Reference Signal and power return; requires low-inductance connection to minimize switching noise

Key Features

Feature Design Value
Dual Chip Enable (CE1/CE2) Enables hierarchical memory mapping-e.g., CE2 tied HIGH for local decode, CE1 driven by upper address bits for bank selection
Automatic Power-Down Reduces ICC to 10 mA when deselected (CE1 HIGH or CE2 LOW); eliminates need for external power-gating circuitry
TTL-Compatible I/O Accepts 0.8 V / 2.2 V logic thresholds and drives 2.4 V / 0.4 V levels-interoperates directly with 5 V microcontrollers and FPGAs
2.0 V Data Retention Maintains stored contents during brown-out or controlled shutdown; supports battery-backed backup without external regulators
Tri-State Output Control Three independent disable conditions (OE HIGH, CE1 HIGH, CE2 LOW) prevent bus conflicts in multi-SRAM systems

Applications

Industrial PLC Data Buffer Legacy PC BIOS Cache

Use Scenario: Storing real-time I/O status and configuration registers in programmable logic controllers with 5 V backplane buses.

IC Role / Device Role / Timing Role: Asynchronous data buffer between CPU and field I/O modules; accessed via fixed-address memory-mapped reads/writes.

Use Value: 20 ns tAA ensures deterministic response to interrupt-driven I/O updates; 10 mA ISB2 reduces thermal load during idle cycles.

Use Scenario: Caching boot firmware instructions and configuration tables in ISA/PCI-based industrial motherboards.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM holding decompressed BIOS code; mapped to 0xE0000–0xFFFFF address space.

Use Value: TSOP package fits legacy socket footprints; 2.0 V data retention preserves settings during AC power loss before capacitor hold-up expires.

Medical Imaging Frame Store Test Equipment Pattern Memory

Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transfer to host processor.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfaced to 8-bit parallel ADC/DAC channels and DMA controller.

Use Value: 75 mA ICC supports sustained 50 MHz burst reads; tri-state I/O prevents contention during DMA handshaking with multiple peripherals.

Use Scenario: Holding digital stimulus/response patterns in automated test equipment (ATE) for semiconductor functional validation.

IC Role / Device Role / Timing Role: Static pattern generator memory clocked by tester's timing engine; accessed synchronously via address counter.

Use Value: 20 ns tAA aligns with 50 MHz ATE clock domains; CE1/CE2 allows partitioning of pattern sets into independent banks for parallel test execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61LV1024-20TQLI Same 128K × 8 organization and 20 ns speed, but 3.3 V supply only; lower ICC (35 mA) and ISB (1 µA) Requires level translation or separate 3.3 V rail; unsuitable for pure 5 V systems without interface logic Select if migrating to 3.3 V design or prioritizing ultra-low standby current over 5 V compatibility
AS6C1008-20PCN Pin-compatible 32-pin SOJ (not TSOP); identical 5 V operation, 20 ns tAA, and 10 mA ISB2; higher ICC (85 mA) Fits same PCB footprint as CY7C1009B-20VC; requires SOJ socket or rework for TSOP layout Select for drop-in replacement where SOJ mounting is preferred or existing board uses 400-mil SOJ pads

Compared with IS61LV1024-20TQLI and AS6C1008-20PCN, the CY7C109B-20ZC uniquely delivers 5 V operation in a space-efficient TSOP package with proven industrial reliability and direct TTL bus compatibility-critical for legacy system upgrades where voltage and form factor are constrained.

Availability

CY7C109B-20ZC is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame storage, and legacy PC BIOS caching requiring stable component supply and long-term obsolescence management.

Supply support for CY7C109B-20ZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and mixed-signal ICs for industrial, automotive, and communications infrastructure.

The CY7C109B belongs to Cypress's legacy parallel SRAM product line, engineered for plug-and-play compatibility with 8-bit microcontrollers and FPGA-based systems requiring deterministic, non-refreshed memory access.

FAQ

Is CY7C109B-20ZC RoHS compliant?

Yes. The CY7C109B-20ZC carries the 'Z' suffix per Cypress ordering nomenclature, indicating lead-free (Pb-free) construction and RoHS compliance. It uses matte tin terminations and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements.

Can CY7C109B-20ZC operate at 3.3 V?

No. The device is specified only for 5 V ±10% operation (4.5 V to 5.5 V). Applying 3.3 V violates absolute maximum ratings and results in undefined behavior, including failure to retain data or meet timing specifications.

What is the function of NC pins on CY7C109B-20ZC?

NC (No Connect) pins-specifically Pin 15 (A14) in the TSOP package-are unconnected internally and must remain unconnected on the PCB. Routing traces or applying voltage to NC pins may cause latch-up or parametric failure per Cypress datasheet Note 2.

How does automatic power-down work during CE deassertion?

When CE1 goes HIGH or CE2 goes LOW, the internal array is isolated from VCC, reducing ICC to 10 mA (ISB2). This occurs within tPD = 20 ns, and the device retains data at VCC ≥ 2.0 V-no external control signals or sequencing is required to enter or exit this state.

CY7C109B-20ZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
32-TFSOP (0.724", 18.40mm Width)
Packaging:
Bag
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
1Mbit
Memory Organization:
128K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
20ns
Access Time:
20 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
32-TSOP I

CY7C109B-20ZC FAQ

1.How can I place an order for CY7C109B-20ZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C109B-20ZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C109B-20ZC reliable?

The price and inventory of CY7C109B-20ZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C109B-20ZC is usually 5 days.

3.What payment methods are accepted for CY7C109B-20ZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C109B-20ZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C109B-20ZC?

CY7C109B-20ZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C109B-20ZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C109B-20ZC?

For technical support, including CY7C109B-20ZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C109B-20ZC requirements.

6.How does Aetrix verify that CY7C109B-20ZC is sourced from the original manufacturer or authorized distributors?

All CY7C109B-20ZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C109B-20ZC meets industry standards.

7.What is the process for return or replacement of CY7C109B-20ZC?

All CY7C109B-20ZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C109B-20ZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C109B-20ZC part is unused and in its original packaging.

Return procedure for CY7C109B-20ZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C109B-20ZC Tags

  • CY7C109B-20ZC
  • CY7C109B-20ZC PDF
  • CY7C109B-20ZC Datasheet
  • CY7C109B-20ZC Specifications
  • CY7C109B-20ZC Images
  • Infineon Technologies
  • Infineon Technologies CY7C109B-20ZC
  • Buy CY7C109B-20ZC
  • CY7C109B-20ZC Price
  • CY7C109B-20ZC Distributor
  • CY7C109B-20ZC Supplier
  • CY7C109B-20ZC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER