Infineon Technologies CY7C109BN-20ZXCT
- Part No.:
- CY7C109BN-20ZXCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY7C109BN-20ZXCT.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:

- Shipping:

Inventory:4,168
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Product details
Overview
CY7C109BN-20ZXCT from Cypress Semiconductor is a 128K × 8 (131,072 × 8) high-speed CMOS static RAM with 20 ns maximum access time, TTL-compatible I/O, automatic CE power-down, and 2.0V data retention. It operates at 5V ±10% over commercial temperature range (0°C to +70°C) and is used in embedded controllers, industrial PLCs, and legacy communication interface buffers where deterministic read/write timing and low standby current are required.
For engineers reviewing the CY7C109BN-20ZXCT datasheet, CY7C109BN-20ZXCT pinout, CY7C109BN-20ZXCT application, or CY7C109BN-20ZXCT equivalent, key selection considerations include tAA = 20 ns access time, ISB2 = 2 mA CMOS standby current, dual chip enable (CE1 active LOW, CE2 active HIGH), and TSOP Type I 32-pin package compatibility with space-constrained PCB layouts.
Technical Context
This SRAM implements a synchronous, non-volatile-retentive memory array using a 512 × 256 × 8 architecture with separate column and row decoders, sense amplifiers, and three-state I/O drivers. Its dual CE architecture enables hierarchical memory expansion without external logic, while automatic power-down activates when CE1 is HIGH or CE2 is LOW - independent of OE or WE state.
The device supports three standard read/write cycles: CE-controlled (Cycle No. 1), OE-controlled read (Cycle No. 2), and WE-controlled write with OE LOW (Cycle No. 3). Timing parameters are defined with 3 ns input transition times, 1.5 V reference levels, and 30 pF load capacitance per I/O pin, ensuring interoperability with 5 V TTL and CMOS bus systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 131,072 words × 8 bits - provides byte-wide data path for 8-bit microcontrollers and legacy peripherals. |
| Access Time (tAA) | 20 ns max - guarantees deterministic read latency for real-time control loops running ≤50 MHz. |
| Supply Voltage | 5 V ±10% - compatible with standard 5 V logic rails; no level-shifting required. |
| Standby Current (ISB2) | 2 mA max - enables low-power hold mode during CPU sleep without external power gating. |
| Data Retention Voltage | 2.0 V min - preserves memory contents during brown-out conditions down to 2 V supply. |
| Input/Output Compatibility | TTL-compatible - interfaces directly with 74LS, 74HC, and 8051-family peripherals without buffers. |
| Operating Temperature | 0°C to +70°C - qualified for commercial-grade industrial control panels and test equipment. |
Pinout & Package
The CY7C109BN-20ZXCT is packaged in a 32-pin TSOP Type I (8 mm × 20 mm) with gull-wing leads, JEDEC MO-153 compliant, lead-free (Pb-free) finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit address bus supporting full 128K-word decoding; A16 is MSB. |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state CMOS I/O pins shared for read data output and write data input. |
| CE1 | Active LOW Chip Enable | Primary chip select; device enters high-Z or power-down when HIGH. |
| CE2 | Active HIGH Chip Enable | Secondary chip select; must be HIGH with CE1 LOW to enable operation. |
| OE | Active LOW Output Enable | Controls output drivers only; does not affect internal memory state or power mode. |
| WE | Active LOW Write Enable | Initiates write cycle when CE1 LOW and CE2 HIGH; latches data on falling edge. |
| VCC, GND | Power Supply | Single 5 V supply; no separate I/O or core voltage rails required. |
Key Features
| Feature | Design Value |
|---|---|
| Dual CE architecture (CE1/CE2) | Enables seamless bank selection in multi-SRAM systems without glue logic or address decoding overhead. |
| Automatic CE power-down | Reduces ICC to 2 mA when deselected - eliminates need for external power management circuitry. |
| 2.0 V data retention | Maintains stored data during undervoltage events, supporting graceful shutdown in power-loss scenarios. |
| Three standard read/write cycles | Supports flexible bus timing: CE-controlled, OE-controlled read, and WE-controlled write with OE LOW. |
| TTL-compatible I/O | Direct interface with legacy 5 V microcontrollers (e.g., 8051, Z80) and peripheral ICs without level shifters. |
Applications
| Industrial PLC Data Buffer | Legacy Communication Interface |
|---|---|
Use Scenario: Storing real-time I/O scan data between CPU execution cycles in programmable logic controllers. IC Role / Device Role / Timing Role: Byte-wide static RAM acting as deterministic-access scratchpad memory with 20 ns tAA guaranteeing sub-microsecond response to interrupt-driven I/O updates. Use Value: Eliminates wait states in 8-bit MCU-based PLC firmware, enabling consistent 10 kHz I/O update rates without DMA or cache coherency logic. | Use Scenario: Buffering asynchronous serial frames (RS-232/RS-485) in protocol converters and modem interface cards. IC Role / Device Role / Timing Role: Dual-CE SRAM serving as FIFO-like temporary storage for incoming/outgoing packets, synchronized to UART clock domains via CE/OE handshaking. Use Value: Prevents frame loss during burst traffic by absorbing up to 128 KB of transient data without software intervention or dynamic memory allocation. |
| Embedded Controller Boot Loader | Test Equipment Pattern Memory |
Use Scenario: Holding decompressed firmware images during cold boot of resource-constrained microcontrollers. IC Role / Device Role / Timing Role: Non-volatile-retentive SRAM storing validated application code prior to execution, powered from backup rail during main supply ramp-up. Use Value: Enables verified boot sequence with 2.0 V data retention - maintains image integrity during 5 V supply stabilization (typically 10–100 ms). | Use Scenario: Storing digital stimulus/response patterns in automated test equipment (ATE) for semiconductor wafer probing. IC Role / Device Role / Timing Role: High-reliability, timing-deterministic memory providing glitch-free pattern delivery to DUT pins at fixed 50 MHz clock rates. Use Value: Guarantees zero-cycle jitter on pattern edges due to 20 ns tAA and 0 ns tLZOE/tPU - critical for sub-nanosecond timing margin validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-20TIN | 20 ns tAA, 5 V, 128K × 8, but uses single CE (active LOW) and lacks CE2; standby current 1.5 mA. | No hierarchical CE expansion support; requires external logic for multi-bank addressing. | Select when board space is constrained and only one CE signal is available; verify OE/WE timing compatibility. |
| IS61LV1024-20TI | 20 ns tAA, 3.3 V core (5 V tolerant I/O), 128K × 8, single CE, ISB = 1 µA typical. | Requires level translation for pure 5 V systems; lower standby power but incompatible voltage domain without translation. | Select for mixed-voltage designs or ultra-low-power hold modes; avoid in legacy 5 V-only buses. |
Compared with AS6C1008-20TIN and IS61LV1024-20TI, the CY7C109BN-20ZXCT uniquely supports dual CE expansion and retains data at 2.0 V - making it irreplaceable in brown-out-resilient industrial controllers and 5 V legacy bus systems requiring deterministic multi-chip addressing.
Availability
CY7C109BN-20ZXCT is available at Aetrix Electronics and suitable for industrial PLC data buffering, legacy communication interface design, and embedded controller boot loader implementations requiring stable component supply across extended production lifecycles.
Supply support for CY7C109BN-20ZXCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, PSoC, USB, and timing solutions for industrial, automotive, and consumer applications.
The CY7C109BN belongs to Cypress's legacy parallel SRAM product line, designed specifically for 5 V TTL/CMOS system integration with emphasis on timing predictability, low standby power, and robust CE-based memory expansion in space- and cost-sensitive embedded platforms.
FAQ
What is the minimum VCC required to retain data in CY7C109BN-20ZXCT?
The device guarantees data retention down to VCC = 2.0 V when CE1 is HIGH or CE2 is LOW and all inputs are within valid logic thresholds. This is measured under ISB2 conditions (CMOS input thresholds) and does not require active refresh or external hold circuitry. Below 2.0 V, data integrity is not assured per specification.
Can CY7C109BN-20ZXCT operate with CE2 permanently tied HIGH?
Yes - CE2 may be hardwired HIGH (e.g., to VCC) to simplify design, reducing the control signal count to CE1, OE, and WE. In this configuration, CE1 becomes the sole chip enable, and the device behaves identically to a single-CE SRAM. All timing parameters remain valid per datasheet Table 6.
Does CY7C109BN-20ZXCT support battery-backed operation?
No - it is not a battery-backed SRAM (BBSRAM). While it retains data at 2.0 V, it lacks integrated lithium battery, charge circuitry, or auto-switching logic. External backup power must be implemented using discrete diodes, regulators, and supercapacitors or batteries, with careful attention to CE and WE state during switchover.
Is the TSOP package of CY7C109BN-20ZXCT RoHS-compliant?
Yes - the "ZXC" suffix denotes Pb-free (RoHS-compliant) TSOP packaging per JEDEC J-STD-609. The device meets exemption 7a (lead in glass frits and ceramic materials) and contains <1000 ppm lead by weight in solderable terminations, verified through material declarations and XRF testing per IPC-J-STD-020.
CY7C109BN-20ZXCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY7C109BN-20ZXCT FAQ
1.How can I place an order for CY7C109BN-20ZXCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C109BN-20ZXCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C109BN-20ZXCT reliable?
The price and inventory of CY7C109BN-20ZXCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C109BN-20ZXCT is usually 5 days.
3.What payment methods are accepted for CY7C109BN-20ZXCT?
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4.How is shipping managed for CY7C109BN-20ZXCT?
CY7C109BN-20ZXCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C109BN-20ZXCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C109BN-20ZXCT?
For technical support, including CY7C109BN-20ZXCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C109BN-20ZXCT requirements.
6.How does Aetrix verify that CY7C109BN-20ZXCT is sourced from the original manufacturer or authorized distributors?
All CY7C109BN-20ZXCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C109BN-20ZXCT meets industry standards.
7.What is the process for return or replacement of CY7C109BN-20ZXCT?
All CY7C109BN-20ZXCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C109BN-20ZXCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C109BN-20ZXCT part is unused and in its original packaging.
Return procedure for CY7C109BN-20ZXCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C109BN-20ZXCT Tags

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M24C02-WMN6TP
STMicroelectronics
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Microchip Technology

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Microchip Technology

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Microchip Technology
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STMicroelectronics

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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