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Infineon Technologies CY7C109D-10ZXI
- Part No.:
- CY7C109D-10ZXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 32-TFSOP (0.724", 18.40mm Width)
- Datasheet:
-
CY7C109D-10ZXI.pdf
- Description:
- IC SRAM 1MBIT PARALLEL 32TSOP I
- Quantity:
- Payment:
- Shipping:
Inventory:2,759
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Product details
Overview
CY7C109D-10ZXI from Cypress Semiconductor is a 1-Mbit (128 K × 8) high-speed CMOS static RAM with 10 ns access time, TTL-compatible I/O, and dual chip enable (CE1 active LOW, CE2 active HIGH) for flexible memory expansion. It operates at 5 V ±0.5 V over –40 °C to +85 °C and supports automatic power-down when deselected - used in industrial control modules requiring deterministic read/write timing and nonvolatile data retention during brownout.
For engineers reviewing the CY7C109D-10ZXI datasheet, CY7C109D-10ZXI pinout, CY7C109D-10ZXI application, or CY7C109D-10ZXI equivalent, key selection criteria include tAA = 10 ns read access, ISB2 = 3 mA CMOS standby current, 2.0 V data retention capability, and compatibility with legacy 5 V TTL microcontrollers such as Intel 80C188 or Motorola MC68EC000.
Technical Context
The CY7C109D-10ZXI implements a fully static 128 K × 8 memory array with tri-state I/O drivers and independent CE1/CE2 control logic enabling seamless bank selection in multi-SRAM systems. Its address decoding uses 17-bit addressing (A0–A16) and supports three distinct access modes: address-controlled read, OE-controlled read, and WE-controlled write.
Power management relies on automatic CE-driven power-down: ISB2 = 3 mA is guaranteed when CE1 > VCC – 0.3 V or CE2 < 0.3 V under CMOS input conditions, while ICC = 80 mA is specified at 100 MHz fmax. Data retention at VCC = 2.0 V is supported with tCDR = 0 ns and full functionality resumes after tR ≥ 50 µs VCC ramp.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128 K × 8 (131,072 words × 8 bits); enables byte-wide data bus interfacing without external data multiplexing |
| Access Time (tAA) | 10 ns maximum; ensures compatibility with 100 MHz CPU buses requiring sub-10 ns memory response |
| Supply Voltage | 5 V ±0.5 V; matches standard TTL logic rails and eliminates need for level-shifting in legacy controller designs |
| Standby Current (ISB2) | 3 mA typical at CMOS input thresholds; reduces system-level quiescent power in sleep-mode industrial HMIs |
| Data Retention Voltage | 2.0 V minimum; sustains stored contents during brownout or backup-battery operation without refresh |
| Input/Output Compatibility | TTL-compatible VIH = 2.2 V min, VOL = 0.4 V max; interfaces directly with 5 V microcontrollers without bus buffers |
| Chip Enable Logic | CE1 active LOW + CE2 active HIGH; allows hierarchical memory mapping with up to four independent banks using shared A0–A16 |
Pinout & Package
CY7C109D-10ZXI is packaged in a Pb-free 32-pin TSOP I (Thin Small Outline Package, Type I), 400-mil wide body, 1.2 mm height, with 0.8 mm lead pitch. Pin 1 marked by notch or dot; top view orientation per Figure 1 in Rev. *J datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A16 | Address Inputs | 17-bit unidirectional address bus; selects one of 131,072 locations; no internal latching - requires stable address before CE1/CE2 assertion |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit tri-state I/O; driven HIGH/LOW during read, high-impedance when CE1 HIGH, CE2 LOW, OE HIGH, or WE LOW |
| CE1 | Active LOW Chip Enable | Primary selection signal; device enabled only when CE1 = LOW AND CE2 = HIGH; enables priority-based bank arbitration |
| CE2 | Active HIGH Chip Enable | Secondary enable; complements CE1 to support AND-gated chip select logic; prevents partial enable states |
| OE | Active LOW Output Enable | Controls output driver state independently of CE; allows data sampling without toggling chip select in burst reads |
| WE | Active LOW Write Enable | Initiates write cycle when CE1 = LOW, CE2 = HIGH; overlapping WE LOW with CE asserts write - no separate write strobe needed |
| VCC, GND | Power Supply | Single 5 V supply; decoupling capacitor required within 10 mm of VCC pin to maintain tAA ≤ 10 ns under switching noise |
| NC | No Connect | Pin 18 (TSOP I); not bonded on die - must be left floating or tied to GND per layout guidelines; no electrical function |
Key Features
| Feature | Design Value |
|---|---|
| PIN- AND FUNCTION-COMPATIBLE WITH CY7C109B | Drop-in replacement for legacy CY7C109B-10 in existing PCB layouts - same pinout, timing, and DC specs |
| AUTOMATIC POWER-DOWN ON DESELECTION | Reduces system standby power by 96% vs. active mode (80 mA → 3 mA) without software intervention or external control logic |
| EASY MEMORY EXPANSION | Dual CE architecture supports up to four 128 K × 8 banks on shared data/address bus - eliminates need for external address decoders |
| 2.0 V DATA RETENTION | Maintains valid SRAM contents during main supply interruption - enables fast wake-up from backup battery or supercapacitor hold-up |
| TTL COMPATIBILITY | Direct interface with 5 V microcontrollers (e.g., 8051 derivatives, Z80, 68K family) - no level translators required for control or data lines |
Applications
| Industrial PLC I/O Module | Legacy Embedded Controller Cache |
|---|---|
|
Use Scenario: Real-time digital I/O buffering in programmable logic controllers where deterministic 10 ns read latency is required for scan-cycle synchronization. IC Role / Device Role / Timing Role: Byte-wide scratchpad RAM holding input status and output command registers; accessed synchronously with CPU clock edge. Use Value: Eliminates wait states for 100 MHz CPU cores; tAA = 10 ns and tRC = 10 ns guarantee single-cycle access across full address range. |
Use Scenario: Instruction/data cache for 80C186-based motion control firmware running from ROM with frequent parameter updates. IC Role / Device Role / Timing Role: Dual-port accessible RAM mapped into CPU's upper memory space; CE1/CE2 used for bank-switching between code and config regions. Use Value: Enables zero-wait-state execution from RAM while retaining 2.0 V data retention during emergency stop-induced power loss. |
| Medical Diagnostic Front-End Buffer | Avionics Data Acquisition Logger |
|
Use Scenario: High-fidelity analog-to-digital sample buffering in portable ultrasound units where EMI resilience and low standby current are critical. IC Role / Device Role / Timing Role: Burst-write FIFO for ADC streams; OE-controlled reads synchronized to display refresh cycles. Use Value: ISB2 = 3 mA extends battery life during idle periods; TTL I/O tolerates 500 mV ground bounce common in mixed-signal PCBs. |
Use Scenario: Nonvolatile event logging in flight data recorders requiring guaranteed data integrity during voltage sag or transient interruption. IC Role / Device Role / Timing Role: Primary working memory with VCC monitoring circuit triggering automatic CE assertion at 2.0 V threshold. Use Value: Data retention at 2.0 V ensures no loss of last 128 KB of telemetry even if main 5 V rail collapses mid-flight. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-10TIN | tAA = 10 ns, but VCC = 2.7–3.6 V only; no 5 V operation; ISB = 1 µA (lower), but incompatible with TTL I/O levels | Suitable for modern 3.3 V SoC designs; unsuitable for 5 V legacy systems due to VIH/VOL mismatch | Select only if migrating entire system to 3.3 V and replacing all TTL peripherals |
| IS61LV10248-10TL | tAA = 10 ns, VCC = 3.3 V ±0.3 V; TTL-compatible inputs via internal level shifters; ISB = 2 µA | Requires external 3.3 V regulator; supports mixed-voltage designs but adds BOM cost and layout complexity | Prefer when upgrading from CY7C109D in new designs targeting lower power and future-proofing |
Compared with AS6C1008-10TIN and IS61LV10248-10TL, CY7C109D-10ZXI uniquely delivers native 5 V TTL compatibility, 2.0 V data retention, and zero-software power-down - making it irreplaceable in field-deployed industrial hardware where voltage stability and backward compatibility are non-negotiable.
Availability
CY7C109D-10ZXI is available at Aetrix Electronics and suitable for industrial PLC I/O modules, legacy embedded controller caches, and medical diagnostic front-end buffers requiring stable component supply across extended product lifecycles.
Supply support for CY7C109D-10ZXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in memory, microcontrollers, and connectivity solutions for industrial and automotive markets.
CY7C109D belongs to Cypress's legacy parallel SRAM product line, designed specifically for drop-in replacement of aging 5 V TTL memory in long-lifecycle industrial and medical equipment where reliability and pin compatibility outweigh density or speed upgrades.
FAQ
Is CY7C109D-10ZXI compatible with 3.3 V microcontrollers?
No. CY7C109D-10ZXI requires 5 V ±0.5 V supply and has TTL-compatible input thresholds (VIH ≥ 2.2 V, VIL ≤ 0.8 V). Interfacing with 3.3 V controllers requires level-shifting on all control and data lines - unlike 3.3 V SRAMs such as IS61LV10248, which integrate level shifters.
What is the function of NC pin (Pin 18) in the TSOP I package?
Pin 18 is a no-connect terminal - not bonded to the die. Per Cypress datasheet Rev. *J, it must remain unconnected or tied to GND for mechanical stability; routing to any signal or power net may cause board-level EMI or thermal stress without functional benefit.
Does CY7C109D-10ZXI support asynchronous burst reads?
No. It lacks burst mode control logic or internal address counters. All accesses require externally generated A0–A16 addresses per cycle. Burst behavior must be implemented in FPGA or ASIC glue logic using OE-controlled timing (tDOE = 5 ns, tHZOE = 5 ns).
Can CY7C109D-10ZXI retain data during complete power removal?
No. Data retention requires VCC ≥ 2.0 V. If VCC drops below 2.0 V, contents are lost. For true nonvolatile storage, external battery backup or NVSRAM with integrated EEPROM is required - this device only retains data during brownout, not full power-off.
CY7C109D-10ZXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 32-TFSOP (0.724", 18.40mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-TSOP I
CY7C109D-10ZXI FAQ
1.How can I place an order for CY7C109D-10ZXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C109D-10ZXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C109D-10ZXI reliable?
The price and inventory of CY7C109D-10ZXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C109D-10ZXI is usually 5 days.
3.What payment methods are accepted for CY7C109D-10ZXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C109D-10ZXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C109D-10ZXI?
CY7C109D-10ZXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C109D-10ZXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C109D-10ZXI?
For technical support, including CY7C109D-10ZXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C109D-10ZXI requirements.
6.How does Aetrix verify that CY7C109D-10ZXI is sourced from the original manufacturer or authorized distributors?
All CY7C109D-10ZXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C109D-10ZXI meets industry standards.
7.What is the process for return or replacement of CY7C109D-10ZXI?
All CY7C109D-10ZXI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C109D-10ZXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C109D-10ZXI part is unused and in its original packaging.
Return procedure for CY7C109D-10ZXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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