Infineon Technologies CY7C12451KV18-400BZC

Overview

CY7C12451KV18 from Cypress Semiconductor is a 1M × 36-bit, 36-Mbit QDR® II+ SRAM with synchronous pipelined architecture, 4-word burst, 2.0-cycle read latency, and DDR interfaces on both read and write ports operating at 400 MHz (900 Mbps effective data rate). It features separate read/write data ports, echo clocks (CQ/CQ), QVLD data-valid signaling, and operates with core VDD = 1.8 V ± 0.1 V and I/O VDDQ = 1.4–1.8 V. Used in high-bandwidth packet buffering for network line cards and telecom switching fabric.

For engineers reviewing the CY7C12451KV18 datasheet, CY7C12451KV18 pinout, CY7C12451KV18 application, or CY7C12451KV18 equivalent, key selection criteria include its 1M × 36 organization, 400 MHz clock support, HSTL I/O compatibility, 165-ball FBGA package, and DOFF-configurable 1-cycle/2-cycle latency mode - all critical for deterministic low-latency memory subsystems in FPGA- or ASIC-based infrastructure.

Technical Context

This device implements QDR II+ architecture with fully independent read and write ports sharing a multiplexed address bus, latched on alternate rising edges of K/K clocks. Its internal PLL enables precise DDR timing alignment, while echo clocks (CQ/CQ) simplify high-speed data capture without external delay tuning.

All inputs are synchronous to K or K; outputs are registered to K or K. Writes use on-chip self-timed circuitry, and depth expansion is supported via RPS/WPS port selects. The DOFF pin dynamically configures read latency between 1-cycle (QDR-I mode) and 2-cycle (native QDR II+ mode), preserving backward compatibility while enabling higher bandwidth.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, lead-free (Pb-free) option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with AS7C361024B-15JIN and MT47H128M16RT-25E, CY7C12451KV18 uniquely delivers deterministic 2-cycle latency, concurrent dual-port DDR access, and echo-clock–assisted timing closure - making it irreplaceable in hard-real-time packet processing where jitter must remain below 100 ps.

Availability

CY7C12451KV18 is available at Aetrix Electronics and suitable for telecom line cards, network processor buffers, FPGA-based protocol analyzers, and switch fabric memory requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CY7C12451KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for infrastructure, automotive, and industrial applications, with focus on signal integrity and timing precision.

CY7C12451KV18 belongs to the QDR II+ SRAM product line, engineered specifically for deterministic, low-jitter, high-throughput memory interfacing in networking and communications equipment where DDR timing predictability is non-negotiable.

FAQ

What is the function of the DOFF pin on CY7C12451KV18?

The DOFF (Data-Off) pin configures read latency mode: when asserted HIGH, it enables native QDR II+ 2.0-cycle read latency; when LOW, it reverts to QDR-I–compatible 1.0-cycle latency. This pin is sampled synchronously on the rising edge of the K clock and affects only read operations - write timing remains unchanged. It allows seamless integration into legacy systems while unlocking full QDR II+ bandwidth in new designs.

How does the CQ/CQ echo clock improve system timing margin?

CQ and CQ are output-synchronized copies of the K and K clocks, respectively, routed alongside Q[35:0] data. They allow the receiving device (e.g., FPGA) to latch data using the same edge-aligned clock that generated it - eliminating clock-to-data skew caused by PCB trace mismatches. This removes the need for dynamic phase alignment or delay-locked loops, improving timing closure margin by up to 150 ps at 400 MHz operation.

Can CY7C12451KV18 support partial writes without read-modify-write cycles?

Yes. Four independent Byte Write Select signals (BWS[3:0]) enable selective writing of individual 8-bit bytes within the 36-bit D[35:0] bus. Each BWS pin controls nine consecutive bits (e.g., BWS0 → D[8:0]), and when deasserted, the corresponding byte remains unaltered. This eliminates the need for external read-modify-write logic and preserves data coherency during sparse updates - essential for header-only packet modifications.

Is the 165-ball FBGA package of CY7C12451KV18 compatible with standard reflow profiles?

Yes. The 165-ball FBGA (13 × 15 × 1.4 mm) uses SnAgCu (SAC305) solder balls and complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3. It supports standard lead-free reflow profiles with peak temperature ≤ 260°C and time above liquidus of 60–90 seconds. Thermal resistance (θJA = 23.5°C/W) ensures safe operation under full 400 MHz load with standard 2-layer thermal pads on PCB.