Infineon Technologies CY7C1245KV18-400BZXC
- Part No.:
- CY7C1245KV18-400BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1245KV18-400BZXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1245KV18-400BZXC from Cypress Semiconductor is a 1M × 36, 36-Mbit QDR® II+ SRAM with 2.0-cycle read latency, 400 MHz clock operation (800 MT/s DDR), 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, four-word burst transfers, echo clocks (CQ/CQ), and QVLD data-valid indicator - deployed in high-speed network packet buffers and FPGA co-processor memory interfaces.
For engineers reviewing the CY7C1245KV18-400BZXC datasheet, CY7C1245KV18-400BZXC pinout, CY7C1245KV18-400BZXC application, or CY7C1245KV18-400BZXC equivalent, key selection criteria include 400 MHz sustained DDR bandwidth, HSTL-compatible 165-ball FBGA package, DOFF-configurable QDR I/II+ mode, and JTAG 1149.1 test access for production validation.
Technical Context
This device implements a synchronous pipelined QDR II+ architecture with independent read and write ports sharing a multiplexed 18-bit address bus. All inputs are registered on rising edges of K/K clocks; outputs are edge-aligned to CQ/CQ echo clocks and qualified by QVLD.
The internal PLL enables precise 2.0-cycle read latency when DOFF = HIGH; disabling the PLL via DOFF = LOW reverts operation to QDR I timing (1-cycle latency, ≤167 MHz). Depth expansion uses RPS/WPS and BWS[3:0] signals, supporting 36-bit-wide burst writes with byte-select granularity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (1M × 36 organization) |
| Max Clock Frequency | 400 MHz - delivers 800 MT/s DDR throughput on both ports |
| Read Latency | 2.0 clock cycles - deterministic timing for pipeline-synchronized systems |
| Core Supply (VDD) | 1.8 V ± 0.1 V - fixed low-voltage core enabling high-speed, low-power operation |
| I/O Supply (VDDQ) | 1.4 V to 1.8 V - supports HSTL Class I/III signaling and mixed-voltage system interfacing |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - standard footprint for high-density PCB routing |
| Burst Length | Four 36-bit words per access - reduces address bus toggling and simplifies controller logic |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Write data input | 36-bit synchronous write bus sampled on K/K rising edges; supports byte-write via BWS[3:0] |
| Q[35:0] | Read data output | 36-bit DDR output aligned to CQ/CQ; tri-stated when RPS deasserted |
| RPS / WPS | Port select control | Active-low synchronous enable for read/write ports; enables depth expansion and port isolation |
| BWS[3:0] | Byte write select | Four independent active-low signals controlling 9-bit byte lanes (D[8:0] to D[35:27]) |
| K / K | Dual-phase input clocks | Rising-edge-triggered clocks for all synchronous operations; K drives read path, K drives write path |
| CQ / CQ | Echo clock outputs | Free-running, phase-matched copies of K/K - simplify high-speed data capture without external delay tuning |
| QVLD | Data validity indicator | Output pulse edge-aligned to CQ/CQ - unambiguously marks valid Q[35:0] data windows |
| DOFF | PLL disable control | Active-low pin that switches device between QDR II+ (2-cycle latency, 400 MHz) and QDR I (1-cycle, ≤167 MHz) modes |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune CQ/CQ/Q[35:0] output drive strength to match 50 Ω system trace impedance |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround overhead and prevents contention in full-duplex memory access |
| Four-word burst architecture | Reduces effective address bus frequency by 4× versus single-word access - lowers controller complexity |
| HSTL Class I/III I/O buffers | Ensures signal integrity at 800 MT/s with programmable drive strength and on-die termination support |
| JTAG 1149.1 test access port | Enables boundary scan testing, silicon validation, and production-level fault coverage without additional test fixtures |
| Synchronous self-timed writes | Internal write sequencing eliminates external write-strobe timing constraints - simplifies FPGA/controller interface |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet line cards with real-time classification and forwarding decisions. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory between MAC and traffic manager ASICs using parallel QDR II+ interface. Use Value: 800 MT/s DDR throughput sustains full line-rate packet buffering without stall cycles; QVLD eliminates setup/hold uncertainty in FPGA capture logic. |
Use Scenario: Serving as scratchpad memory for Xilinx Ultrascale+ or Intel Stratix 10 FPGA-based hardware accelerators performing real-time video analytics. IC Role / Device Role / Timing Role: Off-chip burst-access memory tightly coupled to FPGA fabric via dedicated read/write data paths and echo-clock–synchronized capture. Use Value: Four-word burst + 2-cycle latency enables predictable 4-cycle memory transaction completion - critical for pipelined compute kernels. |
| Telecom Baseband Processing | High-Speed Test Equipment |
|
Use Scenario: Interfacing with multi-core DSPs in 5G massive MIMO baseband units requiring concurrent FFT/IFFT buffer access across multiple antenna channels. IC Role / Device Role / Timing Role: Shared dual-port SRAM acting as channel coefficient store and time-domain sample buffer with deterministic read/write arbitration. Use Value: Independent RPS/WPS controls allow simultaneous read from one channel and write to another - maximizing spectral efficiency processing throughput. |
Use Scenario: Embedded in automated test equipment (ATE) pattern generators where waveform data must be streamed to DACs at >1 GSPS rates with sub-nanosecond timing precision. IC Role / Device Role / Timing Role: Burst-mode waveform storage element synchronized to system clock tree via K/K and echoed through CQ/CQ for jitter-free DAC triggering. Use Value: Echo clocks eliminate interconnect skew between memory and DAC sampling clocks - directly improving SFDR and ENOB performance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II+ SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-400BIN | 2M × 18 configuration (36 Mbit), same 400 MHz speed, but lacks DOFF-configurable QDR I mode and JTAG support | Requires external PLL for echo clock generation; no built-in impedance calibration (ZQ) | Select when cost-sensitive designs prioritize pin count over testability and voltage flexibility |
| IS45S32800J-400BLI | 32 Mbit (1M × 32), 400 MHz, but uses QDR II (not II+) architecture - fixed 2-cycle latency, no DOFF mode switch | No QVLD signal; CQ/CQ not available - demands tighter board-level timing closure | Choose only if legacy QDR II compatibility is mandatory and echo-clock–based capture is handled externally |
Compared with AS7C362000B-400BIN and IS45S32800J-400BLI, CY7C1245KV18-400BZXC uniquely combines 36-bit width, DOFF-switchable latency modes, integrated ZQ calibration, and JTAG testability - making it optimal for new high-reliability telecom and test equipment designs requiring design margin and production test coverage.
Availability
CY7C1245KV18-400BZXC is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor memory, and telecom baseband processing requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CY7C1245KV18-400BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and system-level timing robustness.
CY7C1245KV18 belongs to the QDR® II+ SRAM product line, engineered specifically for full-duplex, burst-oriented memory subsystems in packet-processing and FPGA-accelerated systems demanding deterministic latency and DDR bandwidth.
FAQ
What is the function of the DOFF pin on CY7C1245KV18-400BZXC?
The DOFF pin controls the internal PLL: when pulled HIGH, the device operates in QDR II+ mode with 2.0-cycle read latency at up to 400 MHz; when pulled LOW, the PLL is disabled and the device reverts to QDR I timing with 1-cycle latency and maximum 167 MHz operation. This allows backward compatibility and flexible timing trade-offs without changing hardware layout.
How does the ZQ pin affect signal integrity in high-speed designs?
The ZQ pin connects to an external resistor to ground (typically 240 Ω) to calibrate the output driver impedance of Q[35:0], CQ, and CQ pins to ~50 Ω. This matches standard PCB trace impedances, minimizing reflections and ensuring clean eye diagrams at 800 MT/s - eliminating need for external series termination resistors.
Can CY7C1245KV18-400BZXC perform simultaneous read and write operations to the same address?
Yes - the QDR II+ architecture supports fully independent read and write ports. Concurrent access to the same address is permitted and results in coherent behavior: the most recently written data becomes immediately available on the next read cycle, guaranteed by the synchronous self-timed write circuitry and full data coherency design.
What is the role of QVLD in system timing validation?
QVLD is a synchronous output that pulses high exactly when Q[35:0] data is valid and stable relative to CQ/CQ edges. Unlike relying on clock-to-output timing specs alone, QVLD provides a deterministic, pin-level assertion of data readiness - enabling robust FPGA capture logic without margin-intensive static timing analysis or complex dynamic calibration.
CY7C1245KV18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 36Mbit
- Memory Organization:
- 1M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1245KV18-400BZXC FAQ
1.How can I place an order for CY7C1245KV18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1245KV18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1245KV18-400BZXC reliable?
The price and inventory of CY7C1245KV18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1245KV18-400BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1245KV18-400BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1245KV18-400BZXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1245KV18-400BZXC?
CY7C1245KV18-400BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1245KV18-400BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1245KV18-400BZXC?
For technical support, including CY7C1245KV18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1245KV18-400BZXC requirements.
6.How does Aetrix verify that CY7C1245KV18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1245KV18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1245KV18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1245KV18-400BZXC?
All CY7C1245KV18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1245KV18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1245KV18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1245KV18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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