Infineon Technologies CY7C1262XV18-450BZXC

Overview

CY7C1262XV18 from Infineon Technologies (formerly Cypress) is a 36-Mbit QDR® II+ Xtreme SRAM with 2 M × 18 organization, dual independent DDR read/write ports, 450 MHz clock support (900 Mbps data rate), 2.5-cycle read latency, and HSTL I/Os operating at 1.4–1.6 V VDDQ. It delivers high-bandwidth buffering for network packet processing in telecom line cards.

For engineers reviewing the CY7C1262XV18 datasheet, CY7C1262XV18 pinout, CY7C1262XV18 application, or CY7C1262XV18 equivalent, key selection criteria include concurrent read/write capability, echo clock timing support (CQ/CQ), QVLD validity signaling, DOFF-configurable PLL mode (QDR-II+ vs QDR-I), and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements true dual-port synchronous architecture: separate K (read) and K̄ (write) clocks latch address and data on rising edges only, enabling fully independent read and write transactions without bus turnaround. The integrated PLL aligns output data placement to system timing requirements.

It supports two-word burst transfers per access, reducing effective address bus frequency by half. Echo clocks CQ and CQ are free-running, phase-aligned replicas of K and K̄, simplifying capture in FPGA-based systems. QVLD provides edge-aligned valid-data indication synchronized to CQ/CQ.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free, JEDEC MO-270 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with AS7C362000B-450BIN and MT47H64M16HR-37E, CY7C1262XV18 uniquely delivers deterministic 2.5-cycle latency with hardware-validity signaling and echo clocks-critical for real-time packet buffering and test instrumentation where jitter tolerance is sub-100 ps.

Availability

CY7C1262XV18 is available at Aetrix Electronics and suitable for network infrastructure, semiconductor test equipment, 5G baseband processing, and PCIe switching applications requiring stable component supply across multi-year production cycles.

Supply support for CY7C1262XV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies acquired Cypress Semiconductor in 2020 and maintains full product continuity, technical support, and long-term supply commitment for the QDR® II+ Xtreme SRAM portfolio.

This device belongs to Infineon's high-performance memory product line, engineered specifically for deterministic, low-latency, dual-port buffering in wireline and wireless infrastructure where DDR SDRAM latency and command overhead are unacceptable.

FAQ

What is the function of the DOFF pin, and how does it affect timing?

The DOFF (PLL Turn Off) pin is an active-Low control that disables the internal PLL. When asserted, the device operates in QDR-I mode with 1-cycle read latency and maximum frequency reduced to 167 MHz. All timing parameters shift to QDR-I specifications, including K–Q and K̄–D setup/hold windows. Pull DOFF HIGH via ≤10 kΩ resistor for normal QDR-II+ operation at 450 MHz.

How does the ZQ pin calibrate output drive strength?

ZQ connects to an external precision resistor (RQ) tied to ground. The device measures RQ and sets CQ, CQ̄, and Q[17:0] output impedance to 0.2 × RQ. For example, a 240 Ω resistor yields 48 Ω drive strength. Connecting ZQ directly to VDDQ enables minimum impedance mode (~25 Ω). ZQ must never be left floating or tied to VSS.

Can CY7C1262XV18 support depth expansion, and how is it implemented?

Yes - depth expansion is supported using RPS (Read Port Select) and WPS (Write Port Select) pins. Multiple devices can share the same address/data buses; each is enabled independently via its RPS/WPS signal. This allows building wider or deeper memory arrays without external multiplexing, preserving full concurrency across all devices in the bank.

Is JTAG boundary scan supported, and what standards does it comply with?

Yes - CY7C1262XV18 integrates IEEE 1149.1-compliant TAP controller with TDI, TDO, TCK, and TMS pins. It supports instruction register loading, boundary scan register access, and IDCODE readback. Scan chain integrity and pin-level interconnect testing are fully supported per JTAG specification, enabling in-circuit validation of high-speed FBGA solder joints.