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Infineon Technologies CY7C1263V18-375BZXC

Part No.:
CY7C1263V18-375BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1263V18-375BZXC.pdf
Description:
IC SRAM 36MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,297

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Product details

Overview

CY7C1263V18-375BZXC from Cypress Semiconductor is a 2M × 18-bit (36-Mbit), 1.8V QDR-II+ SRAM with separate read/write ports, 375 MHz clock operation (800 Mbps DDR data rate), 2.5-cycle read latency, and HSTL I/O supporting 1.4V–1.8V VDDQ. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.

For engineers reviewing the CY7C1263V18-375BZXC datasheet, CY7C1263V18-375BZXC pinout, CY7C1263V18-375BZXC application, or CY7C1263V18-375BZXC equivalent, key selection criteria include burst depth (4-word), DLL-enabled timing accuracy, echo clock (CQ/CQ) support for source-synchronous capture, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

The device implements a true dual-port synchronous architecture with independent K and K input clocks driving separate read and write pipelines. Its Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to K/K edges with sub-cycle precision, enabling reliable data capture at 800 Mbps without external phase alignment circuitry.

All address, control, and data signals are registered on rising edges of K or K; writes are self-timed and fully synchronous. The 19-bit multiplexed address bus supports 2M-depth addressing, while BWS[1:0] enables byte-level write masking across two 9-bit lanes - critical for partial-word updates in protocol header processing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density36 Mbit (2M × 18-bit organization)
Max Clock Frequency375 MHz - determines maximum sustained bandwidth of 2.7 Gbps (18-bit × 800 Mbps DDR)
Read Latency2.5 clock cycles - fixes minimum time from RPS assertion to first valid Q[17:0] output edge
VDD / VDDQCore VDD = 1.8V ± 0.1V; I/O VDDQ = 1.4V to 1.8V - enables interoperability with 1.5V HSTL-18 and 1.8V logic domains
Burst Length4-word burst - reduces address bus toggling by 75% vs. single-word access, lowering system EMI
Package165-ball FBGA (15 mm × 17 mm × 1.4 mm) - supports fine-pitch routing for differential clock and echo clock pairs
Interface StandardHSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 400 MT/s with controlled slew and termination matching

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, RoHS-compliant Pb-free finish.

Pin/TerminalCircuit RoleDesign Meaning
K / KDifferential clock inputsDrive all synchronous registers; K controls read port, K controls write port - eliminates need for internal clock division
CQ / CQEcho clock outputsSource-synchronous timing references aligned to K/K edges - used by FPGA/ASIC to latch Q[17:0] with zero setup/hold margin
RPS / WPSActive-low port selectsEnable independent read/write initiation; deassertion tri-states Q[17:0] or ignores D[17:0], preventing bus contention
BWS[1:0]Byte write selectsMask 9-bit subwords during write - allows atomic update of protocol headers without full-word overwrite
Q[17:0]DDR read data outputsDeliver 4 sequential 18-bit words over 2 K/K cycles - matches typical packet descriptor size in switch fabric controllers
D[17:0]DDR write data inputsSampled on both K and K rising edges - supports full 36-bit word ingestion per 2-cycle burst window
A[18:0]Multiplexed address bus19-bit bus latched on K edge for read, K edge for write - cuts pin count vs. dual dedicated address buses
QVLDData validity indicatorAsserted coincident with first valid Q[17:0] transfer - synchronizes downstream FIFO loading without additional timing margin

Key Features

FeatureDesign Value
Separate read/write data pathsEliminates bidirectional bus turnaround delay - enables back-to-back read-after-write with zero cycle penalty
Integrated Delay Lock Loop (DLL)Locks CQ/CQ phase to K/K within ±50 ps - removes need for external PLL or manual trace-length matching
4-word burst architectureTransfers full cache line (72 bits) in 2 clock cycles - matches typical L1/L2 cache line widths in network processors
HSTL I/O with programmable driveSupports 1.4V–1.8V VDDQ and adjustable output strength - adapts to varying trace impedance (40–60 Ω) across PCB layers
JTAG 1149.1 test access portEnables boundary scan testing of SRAM interconnects in dense BGA layouts - critical for production test coverage

Applications

Packet Buffering in Switch FabricLine Card Memory for Telecom Equipment

Use Scenario: Storing ingress/egress packet descriptors and payload fragments in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-throughput dual-port buffer providing simultaneous read (for forwarding decision) and write (for packet arrival) at 375 MHz.

Use Value: 2.7 Gbps sustained bandwidth and 2.5-cycle latency enable real-time packet classification without pipeline stalls.

Use Scenario: Serving as frame buffer in OC-192/STM-64 SONET/SDH line interface cards.

IC Role / Device Role / Timing Role: QDR-II+ SRAM acting as elastic store between serial framer and parallel processor bus.

Use Value: Echo clocks (CQ/CQ) simplify timing closure with ASIC framer logic, reducing board-level skew compensation effort.

Protocol Header Processing EngineHigh-Speed Test Equipment Memory

Use Scenario: Holding TCP/IP, MPLS, or VLAN header templates and modification tables in deep packet inspection engines.

IC Role / Device Role / Timing Role: Low-latency memory for microcode-driven header rewrite operations requiring atomic partial-word writes.

Use Value: BWS[1:0] enables selective 9-bit lane updates - avoids full 18-bit write and preserves timestamp or checksum fields.

Use Scenario: Capturing high-speed digital stimulus/response waveforms in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to high-speed DAC/ADC controllers with DDR timing.

Use Value: DLL-aligned echo clocks ensure deterministic sampling of 800 Mbps data streams without jitter-induced bit errors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AS7C362000B-375BIN3.3V core, no DLL, 2-cycle latency, x18 config only at 333 MHz maxLacks echo clocks and DLL - requires external timing management; lower max frequency limits bandwidth to 2.4 GbpsSelect only if legacy 3.3V system power domain prohibits 1.8V adoption and latency budget allows 2-cycle tolerance.
IS61WV102418BLL-375TQLISingle-port, 3.3V, 1M × 18, no DDR, asynchronous burst modeNo concurrent read/write - forces time-multiplexed access, cutting effective throughput by >40% in streaming use casesAcceptable only for cost-sensitive non-real-time buffering where 1.35 Gbps peak bandwidth suffices.

Compared with AS7C362000B-375BIN and IS61WV102418BLL-375TQLI, CY7C1263V18-375BZXC uniquely delivers concurrent 375 MHz dual-port operation with DLL-synchronized echo clocks - essential for deterministic timing in packet-switched infrastructure where jitter-induced retransmissions are unacceptable.

Availability

CY7C1263V18-375BZXC is available at Aetrix Electronics and suitable for telecom switching systems, high-speed test instrumentation, network processor co-processing, and protocol acceleration modules requiring stable component supply across extended product lifecycles.

Supply support for CY7C1263V18-375BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

CY7C1263V18 belongs to the QDR-II+ SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-forwarding and high-speed data acquisition systems.

FAQ

What is the function of the DOFF pin on CY7C1263V18-375BZXC?

The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this mode, the device operates in QDR-I timing with reduced maximum frequency (167 MHz) and no echo clock alignment. For full QDR-II+ performance at 375 MHz, DOFF must be tied HIGH via ≤10 kΩ resistor to VDDQ.

How does the ZQ pin affect output impedance calibration?

ZQ connects to an external resistor (RQ) to ground, setting CQ, CQ, and Q[17:0] output impedance to 0.2 × RQ. If tied directly to VDDQ, it enables minimum impedance mode. ZQ must never float or connect to GND - improper biasing causes signal integrity failure and timing violations.

Can CY7C1263V18-375BZXC operate with only the K clock (not K)?

No. Both K and K clocks are mandatory: K latches read-related signals (RPS, A[18:0]), K latches write-related signals (WPS, BWS[1:0], D[17:0]). Omitting either clock halts functional operation - the architecture requires dual-edge-synchronized control for true port independence.

What is the purpose of the QVLD signal in system timing design?

QVLD asserts synchronously with the first valid data transfer on Q[17:0] during a read burst. It provides a deterministic, clock-aligned strobe for downstream logic to capture data without relying on fixed delay assumptions - critical for meeting setup/hold margins in FPGA-based packet parsers.

CY7C1263V18-375BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
36Mbit
Memory Organization:
4M x 8
Memory Interface:
Parallel
Clock Frequency:
375 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (15x17)

CY7C1263V18-375BZXC FAQ

1.How can I place an order for CY7C1263V18-375BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1263V18-375BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1263V18-375BZXC reliable?

The price and inventory of CY7C1263V18-375BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1263V18-375BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1263V18-375BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1263V18-375BZXC transactions.

Note: Certain payment methods may incur a processing fee.

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CY7C1263V18-375BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1263V18-375BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1263V18-375BZXC?

For technical support, including CY7C1263V18-375BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1263V18-375BZXC requirements.

6.How does Aetrix verify that CY7C1263V18-375BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1263V18-375BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1263V18-375BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1263V18-375BZXC?

All CY7C1263V18-375BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1263V18-375BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1263V18-375BZXC part is unused and in its original packaging.

Return procedure for CY7C1263V18-375BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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