Infineon Technologies CY7C1263V18-375BZXC
- Part No.:
- CY7C1263V18-375BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1263V18-375BZXC.pdf
- Description:
- IC SRAM 36MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,297
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Product details
Overview
CY7C1263V18-375BZXC from Cypress Semiconductor is a 2M × 18-bit (36-Mbit), 1.8V QDR-II+ SRAM with separate read/write ports, 375 MHz clock operation (800 Mbps DDR data rate), 2.5-cycle read latency, and HSTL I/O supporting 1.4V–1.8V VDDQ. It delivers concurrent high-bandwidth memory access for network packet buffering in telecom line cards.
For engineers reviewing the CY7C1263V18-375BZXC datasheet, CY7C1263V18-375BZXC pinout, CY7C1263V18-375BZXC application, or CY7C1263V18-375BZXC equivalent, key selection criteria include burst depth (4-word), DLL-enabled timing accuracy, echo clock (CQ/CQ) support for source-synchronous capture, and FBGA-165 package compatibility with high-speed PCB layout constraints.
Technical Context
The device implements a true dual-port synchronous architecture with independent K and K input clocks driving separate read and write pipelines. Its Delay Lock Loop (DLL) aligns CQ/CQ echo clocks to K/K edges with sub-cycle precision, enabling reliable data capture at 800 Mbps without external phase alignment circuitry.
All address, control, and data signals are registered on rising edges of K or K; writes are self-timed and fully synchronous. The 19-bit multiplexed address bus supports 2M-depth addressing, while BWS[1:0] enables byte-level write masking across two 9-bit lanes - critical for partial-word updates in protocol header processing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18-bit organization) |
| Max Clock Frequency | 375 MHz - determines maximum sustained bandwidth of 2.7 Gbps (18-bit × 800 Mbps DDR) |
| Read Latency | 2.5 clock cycles - fixes minimum time from RPS assertion to first valid Q[17:0] output edge |
| VDD / VDDQ | Core VDD = 1.8V ± 0.1V; I/O VDDQ = 1.4V to 1.8V - enables interoperability with 1.5V HSTL-18 and 1.8V logic domains |
| Burst Length | 4-word burst - reduces address bus toggling by 75% vs. single-word access, lowering system EMI |
| Package | 165-ball FBGA (15 mm × 17 mm × 1.4 mm) - supports fine-pitch routing for differential clock and echo clock pairs |
| Interface Standard | HSTL Class I inputs / variable-drive HSTL outputs - ensures signal integrity at 400 MT/s with controlled slew and termination matching |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, RoHS-compliant Pb-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| K / K | Differential clock inputs | Drive all synchronous registers; K controls read port, K controls write port - eliminates need for internal clock division |
| CQ / CQ | Echo clock outputs | Source-synchronous timing references aligned to K/K edges - used by FPGA/ASIC to latch Q[17:0] with zero setup/hold margin |
| RPS / WPS | Active-low port selects | Enable independent read/write initiation; deassertion tri-states Q[17:0] or ignores D[17:0], preventing bus contention |
| BWS[1:0] | Byte write selects | Mask 9-bit subwords during write - allows atomic update of protocol headers without full-word overwrite |
| Q[17:0] | DDR read data outputs | Deliver 4 sequential 18-bit words over 2 K/K cycles - matches typical packet descriptor size in switch fabric controllers |
| D[17:0] | DDR write data inputs | Sampled on both K and K rising edges - supports full 36-bit word ingestion per 2-cycle burst window |
| A[18:0] | Multiplexed address bus | 19-bit bus latched on K edge for read, K edge for write - cuts pin count vs. dual dedicated address buses |
| QVLD | Data validity indicator | Asserted coincident with first valid Q[17:0] transfer - synchronizes downstream FIFO loading without additional timing margin |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bidirectional bus turnaround delay - enables back-to-back read-after-write with zero cycle penalty |
| Integrated Delay Lock Loop (DLL) | Locks CQ/CQ phase to K/K within ±50 ps - removes need for external PLL or manual trace-length matching |
| 4-word burst architecture | Transfers full cache line (72 bits) in 2 clock cycles - matches typical L1/L2 cache line widths in network processors |
| HSTL I/O with programmable drive | Supports 1.4V–1.8V VDDQ and adjustable output strength - adapts to varying trace impedance (40–60 Ω) across PCB layers |
| JTAG 1149.1 test access port | Enables boundary scan testing of SRAM interconnects in dense BGA layouts - critical for production test coverage |
Applications
| Packet Buffering in Switch Fabric | Line Card Memory for Telecom Equipment |
|---|---|
Use Scenario: Storing ingress/egress packet descriptors and payload fragments in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: High-throughput dual-port buffer providing simultaneous read (for forwarding decision) and write (for packet arrival) at 375 MHz. Use Value: 2.7 Gbps sustained bandwidth and 2.5-cycle latency enable real-time packet classification without pipeline stalls. | Use Scenario: Serving as frame buffer in OC-192/STM-64 SONET/SDH line interface cards. IC Role / Device Role / Timing Role: QDR-II+ SRAM acting as elastic store between serial framer and parallel processor bus. Use Value: Echo clocks (CQ/CQ) simplify timing closure with ASIC framer logic, reducing board-level skew compensation effort. |
| Protocol Header Processing Engine | High-Speed Test Equipment Memory |
Use Scenario: Holding TCP/IP, MPLS, or VLAN header templates and modification tables in deep packet inspection engines. IC Role / Device Role / Timing Role: Low-latency memory for microcode-driven header rewrite operations requiring atomic partial-word writes. Use Value: BWS[1:0] enables selective 9-bit lane updates - avoids full 18-bit write and preserves timestamp or checksum fields. | Use Scenario: Capturing high-speed digital stimulus/response waveforms in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to high-speed DAC/ADC controllers with DDR timing. Use Value: DLL-aligned echo clocks ensure deterministic sampling of 800 Mbps data streams without jitter-induced bit errors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-375BIN | 3.3V core, no DLL, 2-cycle latency, x18 config only at 333 MHz max | Lacks echo clocks and DLL - requires external timing management; lower max frequency limits bandwidth to 2.4 Gbps | Select only if legacy 3.3V system power domain prohibits 1.8V adoption and latency budget allows 2-cycle tolerance. |
| IS61WV102418BLL-375TQLI | Single-port, 3.3V, 1M × 18, no DDR, asynchronous burst mode | No concurrent read/write - forces time-multiplexed access, cutting effective throughput by >40% in streaming use cases | Acceptable only for cost-sensitive non-real-time buffering where 1.35 Gbps peak bandwidth suffices. |
Compared with AS7C362000B-375BIN and IS61WV102418BLL-375TQLI, CY7C1263V18-375BZXC uniquely delivers concurrent 375 MHz dual-port operation with DLL-synchronized echo clocks - essential for deterministic timing in packet-switched infrastructure where jitter-induced retransmissions are unacceptable.
Availability
CY7C1263V18-375BZXC is available at Aetrix Electronics and suitable for telecom switching systems, high-speed test instrumentation, network processor co-processing, and protocol acceleration modules requiring stable component supply across extended product lifecycles.
Supply support for CY7C1263V18-375BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.
CY7C1263V18 belongs to the QDR-II+ SRAM product line, engineered specifically for deterministic, low-latency, concurrent memory access in packet-forwarding and high-speed data acquisition systems.
FAQ
What is the function of the DOFF pin on CY7C1263V18-375BZXC?
The DOFF pin disables the internal Delay Lock Loop when pulled LOW. In this mode, the device operates in QDR-I timing with reduced maximum frequency (167 MHz) and no echo clock alignment. For full QDR-II+ performance at 375 MHz, DOFF must be tied HIGH via ≤10 kΩ resistor to VDDQ.
How does the ZQ pin affect output impedance calibration?
ZQ connects to an external resistor (RQ) to ground, setting CQ, CQ, and Q[17:0] output impedance to 0.2 × RQ. If tied directly to VDDQ, it enables minimum impedance mode. ZQ must never float or connect to GND - improper biasing causes signal integrity failure and timing violations.
Can CY7C1263V18-375BZXC operate with only the K clock (not K)?
No. Both K and K clocks are mandatory: K latches read-related signals (RPS, A[18:0]), K latches write-related signals (WPS, BWS[1:0], D[17:0]). Omitting either clock halts functional operation - the architecture requires dual-edge-synchronized control for true port independence.
What is the purpose of the QVLD signal in system timing design?
QVLD asserts synchronously with the first valid data transfer on Q[17:0] during a read burst. It provides a deterministic, clock-aligned strobe for downstream logic to capture data without relying on fixed delay assumptions - critical for meeting setup/hold margins in FPGA-based packet parsers.
CY7C1263V18-375BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 375 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1263V18-375BZXC FAQ
1.How can I place an order for CY7C1263V18-375BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1263V18-375BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1263V18-375BZXC reliable?
The price and inventory of CY7C1263V18-375BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1263V18-375BZXC is usually 5 days.
3.What payment methods are accepted for CY7C1263V18-375BZXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1263V18-375BZXC transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1263V18-375BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1263V18-375BZXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1263V18-375BZXC?
For technical support, including CY7C1263V18-375BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1263V18-375BZXC requirements.
6.How does Aetrix verify that CY7C1263V18-375BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1263V18-375BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1263V18-375BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1263V18-375BZXC?
All CY7C1263V18-375BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1263V18-375BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1263V18-375BZXC part is unused and in its original packaging.
Return procedure for CY7C1263V18-375BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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