Infineon Technologies CY7C1263V18-400BZC
- Part No.:
- CY7C1263V18-400BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1263V18-400BZC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,180
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Product details
Overview
CY7C1263V18 from Cypress Semiconductor is a 2M × 18-bit (36-Mbit), 1.8V synchronous QDR-II+ SRAM with independent read/write ports, 400 MHz clock operation, 2.5-cycle read latency, and DDR interfaces delivering 800 MT/s effective data rate. It implements HSTL I/O, DLL-based timing alignment, and echo clocks (CQ/CQ) for high-speed data capture in packet buffering and network switching applications.
For engineers reviewing the CY7C1263V18 datasheet, CY7C1263V18 pinout, CY7C1263V18 application, or CY7C1263V18 equivalent, key selection criteria include burst depth (4-word), port isolation, VDDQ range (1.4V–1.8V), FBGA-165 package compatibility, and JTAG 1149.1 test support for system-level validation.
Technical Context
The CY7C1263V18 uses a pipelined QDR-II+ architecture with physically separate read and write data paths, eliminating bus turnaround overhead. Its dual-clock interface (K/K) latches addresses and controls on rising edges only, while internal DLL aligns CQ/CQ echo clocks to ±50 ps skew relative to K/K for precise DDR data capture.
It supports synchronous self-timed writes with byte write selects (BWS[1:0]), read port select (RPS), write port select (WPS), and QVLD output to indicate valid DDR-read data. Address inputs (A[18:0]) are multiplexed for both ports, enabling 512K × 18 array access with 19-bit addressing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (2M × 18-bit organization) |
| Max Clock Frequency | 400 MHz - enables 800 MT/s DDR throughput per port |
| Read Latency | 2.5 clock cycles - fixed pipeline delay from RPS assertion to first Q[17:0] valid edge |
| VDD / VDDQ | Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to 1.8 V - supports HSTL Class I drive and termination |
| Package | 165-ball FBGA (15 mm × 17 mm × 1.4 mm) - RoHS-compliant, thermal pad optional |
| Timing Interface | Double Data Rate (DDR) on both ports with echo clocks CQ/CQ - simplifies FPGA/ASIC source-synchronous capture |
| JTAG Support | IEEE 1149.1 compliant TAP controller - enables boundary scan testing and in-system debug |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm footprint, 1.4 mm height, 0.8 mm ball pitch. Compatible with standard reflow profiles for lead-free assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[18:0] | Address Input | 19-bit multiplexed address bus latched on K rising edge for both read/write ports |
| D[17:0] | Write Data Input | 18-bit synchronous input sampled on K/K rising edges during WPS assertion |
| Q[17:0] | Read Data Output | 18-bit DDR output driven on K/K rising edges; tri-stated when RPS inactive |
| RPS / WPS | Port Select Control | Active-low synchronous enables for independent read/write port activation |
| BWS[1:0] | Byte Write Select | Two active-low signals controlling 9-bit byte groups (D[8:0], D[17:9]) during write bursts |
| CQ / CQ | Echo Clock Output | Free-running, DLL-aligned copies of K/K - used by external logic for data capture timing |
| QVLD | Data Valid Indicator | Edge-aligned with CQ/CQ; asserts one cycle after first valid Q[17:0] word in burst |
| ZQ | Impedance Calibration | Connects to external 240 Ω resistor to GND to calibrate CQ/Q[17:0] output impedance to 48 Ω |
Key Features
| Feature | Design Value |
|---|---|
| Independent Read/Write Ports | Eliminates data bus turnaround and contention - enables concurrent full-bandwidth read+write at 400 MHz |
| 4-Word Burst Architecture | Transfers 72 bits (4 × 18) per access in two K/K cycles - reduces address bus toggling by 75% vs. single-word |
| Delay Lock Loop (DLL) | Aligns CQ/CQ to K/K with sub-cycle precision - enables reliable 800 MT/s DDR capture without external phase tuning |
| HSTL I/O with Variable Drive | Meets JEDEC HSTL Class I specs at 1.5V VDDQ; drive strength configurable via VREF and ZQ calibration |
| Synchronous Self-Timed Writes | Internal write sequence completes within fixed K-cycle count - removes external write-strobe timing constraints |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in 10G/40G Ethernet switch ASICs. IC Role / Device Role / Timing Role: High-throughput, low-latency shared memory buffer with simultaneous header read + payload write. Use Value: 2.5-cycle read latency and concurrent ports enable line-rate packet processing without stall cycles. |
Use Scenario: Frame buffering in OC-192 SONET/SDH framer modules requiring deterministic access timing. IC Role / Device Role / Timing Role: Dual-port SRAM acting as elastic store between deserializer and time-slot interchanger. Use Value: Echo clocks CQ/CQ provide traceable timing reference for FPGA-based capture logic across temperature. |
| Baseband Processing Memory | High-Speed Test Equipment FIFO |
|
Use Scenario: Real-time symbol buffering in LTE eNodeB digital predistortion (DPD) subsystems. IC Role / Device Role / Timing Role: Synchronous burst memory interfacing directly to multi-GHz RF DAC/ADC controllers. Use Value: 1.4V–1.8V VDDQ range allows direct interface to 1.5V HSTL FPGA I/O banks without level shifters. |
Use Scenario: Deep acquisition memory in automated test equipment capturing high-speed serial waveforms. IC Role / Device Role / Timing Role: Burst-capable FIFO staging data between sampling ADC and analysis processor. Use Value: JTAG 1149.1 support enables in-system verification of memory integrity during production test. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-Mbit QDR-II+, 250 MHz max, 2.5-cycle latency, 165-ball FBGA, but requires 1.5V VDDQ only | Limited to lower-frequency systems; lacks ZQ calibration and DLL disable (DOFF) flexibility | Select when operating below 300 MHz and using fixed 1.5V I/O rails with no impedance tuning needed |
| ISSI IS61WV102418B | 18-Mbit asynchronous SRAM, 15 ns access, x18 parallel interface, SOJ-54 package - no DDR or dual-port capability | Used in legacy control-plane buffers where concurrency and bandwidth are not required | Select only for cost-sensitive, non-pipelined designs with <200 MT/s throughput needs and no timing-critical burst access |
Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1263V18 delivers 60% higher bandwidth (800 vs. 500 MT/s), integrated DLL timing control, and flexible VDDQ scaling - making it optimal for next-generation packet-processing pipelines requiring deterministic latency and scalable I/O voltage.
Availability
CY7C1263V18 is available at Aetrix Electronics and suitable for network switching, telecom line cards, baseband processing, and high-speed test equipment requiring stable component supply and long-term obsolescence management.
Supply support for CY7C1263V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with focus on signal integrity and timing-critical applications.
The QDR-II+ SRAM product line targets high-bandwidth, low-latency memory interfacing in ASIC/FPGA-based infrastructure equipment - specifically engineered for concurrent read/write operations without bus arbitration overhead.
FAQ
What is the minimum VDDQ voltage supported by CY7C1263V18?
The CY7C1263V18 supports VDDQ from 1.4 V to 1.8 V, as confirmed in the "DC Electrical Characteristics" section of datasheet 001-06366 Rev. *E. Operation at 1.4 V enables compatibility with lower-voltage FPGA I/O banks while maintaining HSTL Class I signal integrity and timing margins.
Can CY7C1263V18 operate without the DLL enabled?
Yes - asserting DOFF (DLL Turn Off) pin LOW disables the internal DLL, reverting the device to QDR-I timing mode with maximum 167 MHz operation. In this mode, CQ/CQ become direct buffered copies of K/K, and read latency increases to 3 cycles.
How many address bits does CY7C1263V18 require for full memory access?
CY7C1263V18 uses A[18:0] - 19 address inputs - to access its 2M × 18-bit memory array (512K × 18 per internal bank × 4 banks). All addresses are latched on the rising edge of K, and the same bus serves both read and write ports.
Is ZQ pin mandatory for normal operation?
ZQ must be connected - either to a 240 Ω resistor to GND for impedance calibration or directly to VDDQ for minimum-drive mode. Leaving ZQ floating or tied to GND violates the Absolute Maximum Ratings and may cause output timing violations or excessive current draw.
CY7C1263V18-400BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1263V18-400BZC FAQ
1.How can I place an order for CY7C1263V18-400BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1263V18-400BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1263V18-400BZC reliable?
The price and inventory of CY7C1263V18-400BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1263V18-400BZC is usually 5 days.
3.What payment methods are accepted for CY7C1263V18-400BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1263V18-400BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1263V18-400BZC?
CY7C1263V18-400BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1263V18-400BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1263V18-400BZC?
For technical support, including CY7C1263V18-400BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1263V18-400BZC requirements.
6.How does Aetrix verify that CY7C1263V18-400BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1263V18-400BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1263V18-400BZC meets industry standards.
7.What is the process for return or replacement of CY7C1263V18-400BZC?
All CY7C1263V18-400BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1263V18-400BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1263V18-400BZC part is unused and in its original packaging.
Return procedure for CY7C1263V18-400BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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