Infineon Technologies CY7C1268V18-400BZXC
- Part No.:
- CY7C1268V18-400BZXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1268V18-400BZXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,395
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Product details
Overview
CY7C1268V18 from Cypress Semiconductor is a 36-Mbit (2M × 18) synchronous pipelined SRAM with DDR-II+ architecture, operating at 400 MHz with 2.5-cycle read latency and dual-edge DDR data transfer at 800 Mbps. It features HSTL I/O, 1.8V core supply, 1.4–1.8V I/O supply, and echo clocks (CQ/CQ) for precise high-speed data capture in memory subsystems. Used in network packet buffers and high-throughput FPGA co-processor interfaces.
For engineers reviewing the CY7C1268V18 datasheet, CY7C1268V18 pinout, CY7C1268V18 application, or CY7C1268V18 equivalent, key selection criteria include burst depth (2-word), DDR timing alignment via K/K clocks, QVLD validity signaling, DLL-enabled data placement accuracy, and FBGA-165 package compatibility with high-density PCB layouts.
Technical Context
The CY7C1268V18 implements a synchronous pipelined architecture where address and control signals are registered on rising edges of K and K clocks. Read data bursts two 18-bit words sequentially, driven on both K and K rising edges with QVLD edge-aligned to CQ/CQ outputs.
Its internal 2M × 18 array uses dual-clock DDR timing with Delay Lock Loop (DLL) for sub-cycle data placement accuracy. Write operations employ synchronous self-timed write circuitry with BWS[1:0] byte-select control, and impedance matching is managed via ZQ pin referenced to external resistor or VDDQ.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 36 Mbit (2M × 18 configuration) |
| Max Clock Frequency | 400 MHz - enables 800 Mbps DDR data rate on DQ[17:0] |
| Read Latency | 2.5 clock cycles - determines minimum read-to-read turnaround time |
| Core Supply | VDD = 1.8 V ± 0.1 V - defines power integrity requirements for logic core |
| I/O Supply Range | VDDQ = 1.4 V to VDD - supports HSTL Class I/II output drive and termination |
| Burst Length | 2-word - reduces address bus toggling frequency by 50% vs. single-word access |
| Package | 165-ball FBGA (15 × 17 × 1.4 mm) - matches standard high-pin-count memory footprint |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 17 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data | 18-bit DDR data path; latched on K/K rising edges; tri-stated automatically after deselection |
| K / K | Dual-phase input clocks | Positive/negative DDR clock pair; all synchronous inputs/outputs referenced to both edges |
| CQ / CQ | Output echo clocks | Free-running, phase-matched copies of K/K; simplify system-level data capture without skew compensation |
| QVLD | Data validity indicator | Edge-aligned with CQ/CQ; asserts when DQ[17:0] contains valid burst data |
| BWS[1:0] | Byte write select | Active-low controls which 9-bit byte (D[8:0] or D[17:9]) is written during each half-burst cycle |
| ZQ | Impedance calibration input | Connects to external resistor to ground; sets CQ/CQ/DQ output impedance to 0.2 × RQ |
| DOFF | DLL disable control | Active-low; disables DLL to revert to DDR-I mode (≤167 MHz) with simplified timing |
Key Features
| Feature | Design Value |
|---|---|
| DDR-II+ burst architecture | 2-word burst reduces address bus bandwidth requirement by 50% versus single-word SRAMs |
| Delay Lock Loop (DLL) | Enables accurate data-eye centering at 400 MHz clock, supporting <1 ns setup/hold margins |
| HSTL Class I/II I/O | Ensures signal integrity on high-speed parallel buses with programmable drive strength and VREF-referenced thresholds |
| JTAG 1149.1 test port | Supports boundary-scan testing and in-system diagnostics without additional test fixtures |
| QVLD + echo clocks | Eliminates need for per-device strobe routing; allows deterministic data capture across multiple SRAMs in parallel |
Applications
| Network Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Line-rate buffering of 10G Ethernet frames in switch ASICs requiring low-latency, burst-access memory. IC Role / Device Role / Timing Role: High-bandwidth, synchronous SRAM acting as first-level packet buffer with deterministic 2.5-cycle read response. Use Value: 800 Mbps DDR throughput and QVLD-synchronized echo clocks enable reliable frame capture without glue logic or FIFO arbitration. | Use Scenario: Real-time data staging between FPGA fabric and external processors in radar signal processing systems. IC Role / Device Role / Timing Role: Burst-access memory interfacing directly to FPGA I/O banks with HSTL-compatible voltage levels and DLL-aligned timing. Use Value: 2M × 18 organization matches common FPGA data-path widths; BWS[1:0] enables selective byte writes without full-word overwrite overhead. |
| Telecom Baseband Memory | High-Speed Test Equipment Buffer |
Use Scenario: Channelized data storage in 4G/LTE baseband units handling multi-carrier OFDM symbol buffering. IC Role / Device Role / Timing Role: Pipelined SRAM providing synchronized, low-jitter memory access aligned to symbol clock domains via K/K dual-edge sampling. Use Value: DLL-controlled data placement ensures stable sampling margin under temperature/voltage variation across wide operating range. | Use Scenario: Pattern generation and acquisition buffer in automated test equipment requiring deterministic read/write timing at >300 MHz. IC Role / Device Role / Timing Role: Deterministic-latency memory with DOFF pin enabling fallback to DDR-I mode for debug or legacy timing validation. Use Value: Dual-mode operation (DDR-II+ / DDR-I) simplifies test program development and hardware bring-up across frequency bins. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C362000B-400BIN | 400 MHz QDR-II+ SRAM, 2M × 18, but uses QDR interface (separate read/write ports) and requires different clocking scheme | Designed for true dual-port applications; lacks echo clocks and QVLD; requires separate read/write address paths | Select only if system requires independent read/write concurrency and can accommodate QDR-specific timing constraints |
| IS61WV204818BLL-400BLI | 400 MHz DDR-II+ SRAM, same 2M × 18 density, but uses SSTL-2 I/O and lacks DLL; max VDDQ = 1.5 V | Compatible with DDR memory controllers using SSTL-2; no ZQ calibration or echo clock support; higher timing uncertainty above 333 MHz | Prefer for cost-sensitive designs where DLL precision is non-critical and board-level termination is fixed |
Compared with AS7C362000B-400BIN and IS61WV204818BLL-400BLI, the CY7C1268V18 uniquely integrates DLL-based data alignment, QVLD validity signaling, and HSTL I/O with ZQ calibration-enabling robust 400 MHz operation in tightly timed, multi-device memory subsystems without external timing compensation.
Availability
CY7C1268V18 is available at Aetrix Electronics and suitable for network packet buffering, FPGA co-processor caching, telecom baseband memory, and high-speed test equipment requiring stable component supply and long-lifecycle support.
Supply support for CY7C1268V18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.
The CY7C1268V18 belongs to Cypress's DDR-II+ SRAM product line, engineered specifically for ultra-low-latency, high-bandwidth memory subsystems in networking, wireless infrastructure, and test instrumentation.
FAQ
What is the function of the DOFF pin on CY7C1268V18?
The DOFF (DLL Turn Off) pin is an active-low control that disables the internal Delay Lock Loop. When asserted, the device reverts to DDR-I timing mode with reduced maximum frequency (≤167 MHz) and relaxed setup/hold requirements. For normal DDR-II+ operation at 400 MHz, DOFF must be pulled high via ≤10 kΩ resistor to VDDQ.
How does the ZQ pin affect output impedance calibration?
The ZQ pin connects to an external resistor (RQ) tied to ground, enabling on-die calibration of CQ, CQ, and DQ[17:0] output drivers to 0.2 × RQ. This achieves precise HSTL-compatible impedance matching to the PCB trace. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode; ZQ must never be left floating or connected to VSS.
Can CY7C1268V18 operate with only the K clock (not K)?
No. The CY7C1268V18 requires both K and K clocks for full DDR-II+ functionality. K and K are complementary inputs used to latch data and control signals on alternating edges. Omitting K violates timing specifications and prevents correct burst read/write operation, as data is sampled and driven on both clock edges.
What is the role of BWS[1:0] during write operations?
BWS[1:0] are active-low byte write select inputs controlling which 9-bit portion of DQ[17:0] is written during each half of the 2-word burst. BWS0 enables DQ[8:0], BWS1 enables DQ[17:9]. Both must be asserted to write the full 18-bit word; deselecting either preserves the corresponding byte in memory, enabling partial-word updates without read-modify-write cycles.
CY7C1268V18-400BZXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 36Mbit
- Memory Organization:
- 4M x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- 400 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (15x17)
CY7C1268V18-400BZXC FAQ
1.How can I place an order for CY7C1268V18-400BZXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1268V18-400BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1268V18-400BZXC reliable?
The price and inventory of CY7C1268V18-400BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1268V18-400BZXC is usually 5 days.
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5.How can I obtain technical support or documentation for CY7C1268V18-400BZXC?
For technical support, including CY7C1268V18-400BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1268V18-400BZXC requirements.
6.How does Aetrix verify that CY7C1268V18-400BZXC is sourced from the original manufacturer or authorized distributors?
All CY7C1268V18-400BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1268V18-400BZXC meets industry standards.
7.What is the process for return or replacement of CY7C1268V18-400BZXC?
All CY7C1268V18-400BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1268V18-400BZXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1268V18-400BZXC part is unused and in its original packaging.
Return procedure for CY7C1268V18-400BZXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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