Infineon Technologies CY7C1306CV25-167BZC

Overview

CY7C1306CV25-167BZC from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous pipelined SRAM with QDR™ architecture, featuring independent read/write ports, 167 MHz operation, 2.5 ns clock-to-valid access time, and DDR interfaces on both ports for 333 MHz effective data transfer. It serves as high-bandwidth buffer memory in network packet processors and telecom line cards requiring concurrent burst reads/writes without bus turnaround.

For engineers reviewing the CY7C1306CV25-167BZC datasheet, CY7C1306CV25-167BZC pinout, CY7C1306CV25-167BZC application, or CY7C1306CV25-167BZC equivalent, key selection criteria include its dual-clock DDR timing control (K/K and C/C), HSTL I/O compatibility (1.4–1.9 V), JTAG debug support, and 165-ball FBGA package with depth expansion via RPS/WPS and BWS[3:0].

Technical Context

The device implements true QDR architecture with physically separate read and write data paths, eliminating bus contention and enabling simultaneous access to the same memory location - writes initiated on K's rising edge forward data to subsequent reads on C's rising edge. Its internal organization comprises two 256K × 36 arrays, accessed via multiplexed 18-bit address bus latched separately on K (read) and K (write) edges.

All synchronous inputs (D[35:0], RPS, WPS, BWS[3:0], A[17:0]) are registered on K/K rising edges; all outputs (Q[35:0]) are registered on C/C rising edges. Output impedance is programmable via ZQ pin tied to external resistor or VDDQ, supporting system-level HSTL bus termination matching.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, JEDEC MO-245 compliant. Thermal pad absent; mechanical mounting relies on perimeter solder balls only.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with IDT72T36150L167BG and IS61WV102436B, CY7C1306CV25-167BZC uniquely delivers deterministic 2.5 ns latency, integrated ZQ calibration, and JTAG visibility - making it optimal for new designs demanding jitter-controlled, scalable, and debuggable memory subsystems.

Availability

CY7C1306CV25-167BZC is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing applications requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for CY7C1306CV25-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and timing precision.

CY7C1306CV25 belongs to the QDR SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking infrastructure and high-speed test equipment.

FAQ

What is the function of the ZQ pin on CY7C1306CV25-167BZC?

The ZQ pin calibrates output driver impedance to match the system data bus. When connected to a 100 Ω resistor to ground, it sets Q[35:0] output impedance to 20 Ω (0.2 × RQ). Tying ZQ to VDDQ enables minimum-impedance mode. It must never be left floating or tied directly to GND, as this disables impedance control and risks signal integrity failure.

Can CY7C1306CV25-167BZC operate in single-clock mode?

Yes. By tying C and C HIGH at power-on, the device enters single-clock mode where K/K clocks control both input and output registers. All timing parameters remain unchanged, and operation mimics zero-skew C/C relative to K/K. This mode is fixed at power-up and cannot be reconfigured dynamically.

How does byte write select (BWS[3:0]) work during a 36-bit write operation?

BWS[3:0] independently enables or disables four 9-bit bytes (D[8:0], D[17:9], D[26:18], D[35:27]). Each BWS bit is sampled on the corresponding K or K edge during the two-phase write cycle. Only asserted BWS lines allow their associated byte to be written; deselected bytes retain prior contents, enabling efficient read-modify-write sequences without full-word reread.

Is JTAG support on CY7C1306CV25-167BZC functional for boundary-scan testing?

Yes. The device implements IEEE 1149.1-compliant JTAG with TCK, TMS, TDI, and TDO pins. It supports mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and device-specific IDCODE register (0x04003001). Boundary-scan testing is fully operational in-system and requires no special initialization beyond standard JTAG state machine sequencing.