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Infineon Technologies CY7C1311CV18-250BZC

Part No.:
CY7C1311CV18-250BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1311CV18-250BZC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,555

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Product details

Overview

CY7C1311CV18 from Cypress Semiconductor is a 2M × 8, 18-Mbit QDR-II SRAM with separate read/write ports, 250 MHz operation (400 ps clock period), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers 600 MT/s DDR data transfer on both ports using echo clocks CQ/CQ and dual input clocks K/K, targeting high-bandwidth packet buffering in network switches and routers.

For engineers reviewing the CY7C1311CV18 datasheet, CY7C1311CV18 pinout, CY7C1311CV18 application, or CY7C1311CV18 equivalent, key selection criteria include its 165-ball FBGA package, 1.5-cycle read latency with DLL enabled, independent port selects (RPS/WPS), nibble write enables (NWS0/NWS1), and HSTL-compatible variable-drive outputs for signal integrity at 250 MHz.

Technical Context

The CY7C1311CV18 implements QDR-II architecture with fully independent synchronous read and write pipelines, each clocked by dedicated rising-edge-triggered inputs (K/K for writes, C/C for reads). Its 4-word burst transfers 32 bits per access on the 8-bit data bus, eliminating bus turnaround overhead.

Internal Delay Lock Loop (DLL) aligns echo clocks CQ/CQ to output data edges for precise capture at the controller; when disabled via DOFF, it reverts to QDR-I timing with 1-cycle latency and reduced max frequency (≤167 MHz). Address latching uses a single multiplexed A[18:0] bus sampled alternately on K and K edges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (2M × 8 organization)
Max Clock Frequency 250 MHz - supports 600 MT/s DDR throughput on both read and write ports
Read Latency 1.5 cycles with DLL enabled - enables deterministic timing alignment for high-speed controllers
Core Supply Voltage 1.8 V ±0.1 V - defines minimum power delivery stability for internal logic and array operation
I/O Supply Range 1.4 V to 1.8 V - allows compatibility with multiple HSTL-18 and SSTL-18 interface standards
Burst Length 4-word - reduces address bus toggling frequency by 75% vs. single-word access
Package 165-ball FBGA (13 × 15 × 1.4 mm) - provides 0.8 mm ball pitch for high-density routing and thermal dissipation

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[7:0] Synchronous write data input Latched on rising edge of K/K; drives 8-bit parallel data into memory during active WPS cycle
Q[7:0] Synchronous read data output Drives valid 4-word burst on rising edges of C/C; tri-stated when RPS is deasserted
RPS Read port select (active low) Enables read pipeline and output drivers; sampled on rising edge of K
WPS Write port select (active low) Enables write pipeline and data sampling; sampled on rising edge of K
NWS0, NWS1 Nibble write select (active low) Selects D[3:0] and D[7:4] independently; preserves unselected nibbles during partial writes
K, K Positive/negative input clocks Control all synchronous inputs (address, control, data); rising edges define timing reference
C, C Positive/negative output clocks Gate read data output timing; used with CQ/CQ for flight-time deskew in multi-device systems
CQ, CQ Echo clocks referenced to C/C Free-running, phase-aligned copies of C/C; simplify source-synchronous capture at controller
DOFF DLL disable (active low) Forces QDR-I mode (1-cycle latency, ≤167 MHz); requires external pull-up for normal operation
ZQ Output impedance calibration Connects to external resistor to ground to tune Q[7:0] and CQ/CQ drive strength to 0.2×RQ
VDD, VDDQ, VSS, VREF Power and reference supplies VDD = 1.8 V core; VDDQ = 1.4–1.8 V I/O; VREF sets HSTL threshold; all require local decoupling

Key Features

Feature Design Value
Independent read/write ports Eliminates bus turnaround delay - enables concurrent read+write operations without arbitration
4-word burst architecture Reduces effective address bus frequency by 75%, easing PCB layout and timing closure
DDR interfaces on both ports Delivers 600 MT/s bandwidth at 250 MHz clock - doubles data rate vs. single-data-rate SRAM
Delay Lock Loop (DLL) Aligns CQ/CQ to Q[7:0] edges within ±50 ps - enables reliable source-synchronous capture at 600 MT/s
HSTL-compatible variable-drive outputs Adjustable drive strength via ZQ calibration - maintains signal integrity across varying trace lengths and loads
JTAG 1149.1 test access port Supports boundary-scan testing and in-system diagnostics without additional test pads

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Line-rate buffering of Ethernet frames in Layer 2/3 switches with >10 Gbps aggregate throughput.

IC Role / Device Role / Timing Role: Dedicated read/write SRAM acting as first-level packet buffer with zero-turnaround latency between ingress and egress paths.

Use Value: 250 MHz QDR-II operation sustains 4 GB/s bidirectional bandwidth - matches OC-192/STM-64 interface rates without bottlenecking.

Use Scenario: Real-time waveform capture and pattern generation in automated test equipment (ATE) with sub-nanosecond timing resolution.

IC Role / Device Role / Timing Role: High-speed acquisition memory synchronized to system clock domain via DLL-aligned CQ/CQ echo clocks.

Use Value: 1.5-cycle read latency and 600 MT/s DDR enable deterministic 1.6 ns sample intervals - critical for jitter-sensitive parametric testing.

Telecom Baseband Processing FPGA Co-Processor Cache

Use Scenario: Inter-FPGA data exchange in wireless baseband units handling LTE-Advanced carrier aggregation with 100+ MHz bandwidth.

IC Role / Device Role / Timing Role: Shared memory buffer between FPGA fabric and DSP cores, accessed via AXI4-Stream or custom parallel interface.

Use Value: Independent RPS/WPS controls allow simultaneous FPGA read and DSP write - eliminates arbitration logic and improves utilization efficiency.

Use Scenario: Low-latency instruction/data cache for soft-core processors (e.g., MicroBlaze) running real-time control firmware on Xilinx 7-series FPGAs.

IC Role / Device Role / Timing Role: External cache memory interfaced directly to FPGA's parallel I/O banks with source-synchronous timing using C/C and CQ/CQ.

Use Value: 4-word burst reduces address decode complexity and increases effective bandwidth over single-word SRAM - accelerates tight-loop execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR-II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10PA 36-Mbit (1M × 36), 100 MHz max, LVDS I/O, no DLL, 208-pin PQFP Lower bandwidth, legacy packaging, no echo clocks - suited for cost-sensitive, lower-speed designs Select when board space permits larger package and system clock <125 MHz; avoid for 250 MHz timing-critical paths
ISSI IS61WV102416BLL-10TLI 16-Mbit (1M × 16), 100 MHz async SRAM, CMOS I/O, no burst, no DDR No concurrent ports, no DDR, no DLL - lacks QDR-II architecture entirely Only viable for non-concurrent, non-burst applications where latency tolerance >10 ns and bandwidth <1.6 GB/s

Compared with IDT72T3615L10PA and IS61WV102416BLL-10TLI, CY7C1311CV18 uniquely delivers 250 MHz QDR-II performance with DLL-aligned echo clocks and 165-ball FBGA density - essential for modern packet-processing and test-equipment designs requiring >4 GB/s bidirectional bandwidth.

Availability

CY7C1311CV18 is available at Aetrix Electronics and suitable for network switch buffering, high-speed ATE memory subsystems, telecom baseband processing, and FPGA co-processor caches requiring stable component supply and long-term industrial availability.

Supply support for CY7C1311CV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with emphasis on signal integrity and timing precision.

The QDR-II SRAM product line targets high-bandwidth, low-latency memory subsystems in infrastructure equipment - specifically engineered to replace asynchronous SRAM and reduce FPGA logic overhead in burst-oriented data paths.

FAQ

What is the minimum VDDQ voltage required for CY7C1311CV18 operation at 250 MHz?

The device requires VDDQ ≥ 1.4 V for full-spec 250 MHz operation. At 1.4 V, HSTL output drive strength and AC timing parameters meet datasheet limits; operation below 1.4 V violates guaranteed timing and may cause setup/hold violations at the controller interface.

Can CY7C1311CV18 operate without connecting the ZQ pin?

No. ZQ must be connected either to a precision resistor to ground (for impedance tuning) or directly to VDDQ (for minimum drive strength). Leaving ZQ floating or tied to VSS violates the absolute maximum ratings and risks output driver instability and signal integrity failure.

How does DLL disable (DOFF = LOW) affect read latency and maximum frequency?

With DOFF asserted, the device operates in QDR-I mode: read latency drops to 1 cycle but maximum frequency is limited to 167 MHz. All DLL-related timing parameters (e.g., CQ skew, read data hold) change - the device must be re-characterized per QDR-I specifications in that mode.

Are NWS0 and NWS1 functional in DLL-off mode?

Yes. Nibble write select functionality is independent of DLL state. NWS0 and NWS1 remain fully operational in both DLL-on and DLL-off modes, enabling partial writes to D[3:0] and D[7:4] respectively at any supported frequency up to 167 MHz in QDR-I mode.

CY7C1311CV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
2M x 8
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1311CV18-250BZC FAQ

1.How can I place an order for CY7C1311CV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1311CV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1311CV18-250BZC reliable?

The price and inventory of CY7C1311CV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1311CV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1311CV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1311CV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1311CV18-250BZC?

CY7C1311CV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1311CV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1311CV18-250BZC?

For technical support, including CY7C1311CV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1311CV18-250BZC requirements.

6.How does Aetrix verify that CY7C1311CV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1311CV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1311CV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1311CV18-250BZC?

All CY7C1311CV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1311CV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1311CV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1311CV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1311CV18-250BZC Tags

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