Infineon Technologies CY7C1311KV18-250BZC

Overview

CY7C1311KV18-250BZC from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 2M × 8 organization, 250 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply. It implements separate read/write ports, four-word burst architecture, and DDR interfaces on both ports for high-bandwidth networking buffer applications.

For engineers reviewing the CY7C1311KV18-250BZC datasheet, CY7C1311KV18-250BZC pinout, CY7C1311KV18-250BZC application, or CY7C1311KV18-250BZC equivalent, key selection factors include concurrent read/write capability, echo clock (CQ/CQ) support for timing margin, DOFF-controlled read latency (1 or 1.5 cycles), HSTL-compatible output drive, and 165-ball FBGA package compatibility with high-speed PCB layout constraints.

Technical Context

The device uses synchronous pipelined QDR II architecture with independent read and write data paths, eliminating bus turnaround delays. Address latching occurs on alternate rising edges of K/K clocks, and data transfer occurs on every rising edge of K/K (write) and C/C (read) clocks - enabling true double-data-rate operation at 500 MT/s effective bandwidth.

It integrates an internal PLL for precise data placement, JTAG 1149.1 test access port, programmable impedance control via ZQ pin, and variable-strength HSTL output buffers. Read latency is configurable via DOFF pin: 1 cycle when LOW, 1.5 cycles when HIGH - allowing trade-offs between timing margin and pipeline depth in switch fabric or packet buffer designs.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10BG and IS61QW25636A-250BQ, CY7C1311KV18-250BZC uniquely combines configurable read latency, integrated ZQ calibration, and IEEE 1149.1 JTAG - making it optimal for systems requiring field-testability, signal integrity tuning, and flexible timing adaptation across multiple clock domains.

Availability

CY7C1311KV18-250BZC is available at Aetrix Electronics and suitable for high-speed network switch buffers, telecom line card packet memory, baseband processor caches, and radar signal processing FIFOs requiring stable component supply across extended production lifecycles.

Supply support for CY7C1311KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's QDR II SRAM product line, designed specifically for ultra-low-latency, high-throughput buffering in packet-switched infrastructure where deterministic timing and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1311KV18-250BZC?

The DOFF (Data Output OFFset) pin configures read latency: when asserted HIGH, it enables 1.5-cycle latency for improved timing margin; when LOW, it selects 1-cycle latency for minimal pipeline delay. This setting is sampled synchronously on the K clock and affects all subsequent read operations until changed. It does not impact write timing or burst behavior.

Can CY7C1311KV18-250BZC operate with only one clock signal?

No - the device requires two independent input clocks: K for write operations and address latching, and K for read address latching. Using a single clock violates timing specifications and prevents correct separation of read/write domains. The C/C output clocks are derived internally and cannot replace K/K for control functions.

How does the ZQ pin affect signal integrity?

The ZQ pin connects to a 240 Ω ±1% external resistor to ground and calibrates the output driver impedance of all HSTL-compatible pins (D[7:0], Q[7:0], etc.). This calibration ensures consistent 25 Ω or 50 Ω output impedance across voltage/temperature, reducing reflections and improving eye diagram quality at 500 MT/s data rates.

Is the 165-ball FBGA package of CY7C1311KV18-250BZC compatible with CY7C1311KV18-333BZC?

Yes - both share identical 165-ball FBGA mechanical dimensions (13 × 15 × 1.4 mm), ball pitch (0.8 mm), and pinout. The suffix "-250BZC" vs "-333BZC" denotes speed grade only; electrical characteristics (VDD, VDDQ, timing parameters) differ, but PCB layout and solder mask are fully interchangeable.