Infineon Technologies CY7C1312CV18-167BZI

Overview

CY7C1312CV18-167BZI from Cypress Semiconductor is a 1.8V QDR® II SRAM with 1M × 18 organization (18-Mbit), 167 MHz maximum operating frequency, 1.5-cycle read latency with DLL enabled, and dual DDR interfaces supporting 500 MT/s effective data rate on both read and write ports. It delivers concurrent read/write transactions via separate address/data paths and is used in high-bandwidth networking buffers, packet classification engines, and FPGA co-processor memory subsystems.

For engineers reviewing the CY7C1312CV18-167BZI datasheet, CY7C1312CV18-167BZI pinout, CY7C1312CV18-167BZI application, or CY7C1312CV18-167BZI equivalent, key selection criteria include its 165-ball FBGA package, HSTL I/O compatibility, echo clock (CQ/CQ) support for timing deskew, and DLL-enabled low-latency operation at 167 MHz.

Technical Context

The CY7C1312CV18-167BZI implements a true dual-port synchronous architecture with independent K/K clocks for write address/data capture and C/C clocks for read data output - all edges are rising-edge-triggered. Its internal delay lock loop (DLL) aligns echo clocks (CQ/CQ) to output clocks with sub-cycle precision, enabling reliable data capture at 500 MT/s without external phase alignment.

It supports 2-word burst transfers on every access, full data coherency between ports, and byte-selectable writes via BWS0/BWS1. The device operates in single-clock mode (K-only) or dual-clock mode (K/K + C/C), with DOFF pin disabling the DLL to fall back to QDR-I timing at ≤167 MHz.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Compared with IDT72T36120L10PFI and IS61WV102418BLL-167BLI, the CY7C1312CV18-167BZI uniquely combines 167 MHz DDR performance, DLL-based latency optimization, and echo clock support - making it the only option among the three capable of robust 500 MT/s operation on standard FR4 without custom PCB tuning.

Availability

CY7C1312CV18-167BZI is available at Aetrix Electronics and suitable for network packet buffering, FPGA-based protocol acceleration, and telecom line card memory requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1312CV18-167BZI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

The CY7C1312CV18 belongs to Cypress's QDR® II SRAM product line, designed specifically for deterministic, high-throughput memory subsystems in packet-switched infrastructure where concurrent read/write, low latency, and timing repeatability are mandatory.

FAQ

What is the function of the DOFF pin, and how should it be configured?

The DOFF (DLL Turn Off) pin disables the internal delay lock loop when pulled LOW. For normal operation at 167 MHz with 1.5-cycle latency, DOFF must be tied HIGH via a ≤10 kΩ pull-up resistor to VDDQ. When disabled, the device reverts to QDR-I timing with 1-cycle latency but reduced timing margin - this mode is intended only for debug or thermal derating scenarios.

Can CY7C1312CV18-167BZI operate with only one clock (K) instead of K/K and C/C pairs?

Yes - the device supports single-clock mode where K serves as both address capture and output clock. In this mode, Q[17:0] is driven on K and K edges, eliminating need for separate C/C. However, echo clocks (CQ/CQ) remain inactive, and timing margins tighten due to lack of deskew capability; use only in space-constrained or low-complexity designs where 500 MT/s reliability is not required.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external resistor (typically 50 Ω) to ground to calibrate output driver impedance. This sets Q[17:0], CQ, and CQ drive strength to 0.2 × RQ (i.e., 10 Ω), matching standard 50 Ω transmission lines. Proper ZQ calibration reduces reflections and jitter by >25%, directly improving eye height and timing margin at 500 MT/s - skipping calibration risks bit errors above 133 MHz.

Is the 165-ball FBGA package compatible with standard reflow profiles?

Yes - the 165-ball FBGA (13 × 15 × 1.4 mm) uses SnAgCu (SAC305) solder balls and complies with IPC/JEDEC J-STD-020D moisture sensitivity level 3. Standard lead-free reflow profiles with peak temperature ≤260 °C and time above liquidus 60–90 seconds are fully supported; no special thermal ramp rates or underfill are required for reliability.