Infineon Technologies CY7C1312CV18-250BZI

Overview

CY7C1312CV18 from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 1M × 18 organization, 250 MHz clock operation, 1.8 V core supply, and 1.4–1.8 V I/O supply. It features separate read/write ports, DDR interfaces on both ports (500 MT/s effective data rate), and 1.5-cycle read latency with DLL enabled. Used in high-bandwidth packet buffering for network switches and routers.

For engineers reviewing the CY7C1312CV18 datasheet, CY7C1312CV18 pinout, CY7C1312CV18 application, or CY7C1312CV18 equivalent, key selection criteria include concurrent read/write capability, echo clock support (CQ/CQ) for timing margin recovery, HSTL-18-compatible variable-drive outputs, and FBGA-165 package compatibility with high-density routing constraints.

Technical Context

The CY7C1312CV18 implements a true dual-port synchronous architecture with independent K/K clocks for write address/data capture and C/C clocks for read data output timing. Its internal delay lock loop (DLL) aligns echo clocks (CQ/CQ) to output data edges, enabling reliable capture at 500 MT/s without external deskew circuitry.

All address and control inputs are registered on rising edges of K or K; all outputs are edge-aligned to C or C. Byte write selects (BWS0/BWS1) enable granular 9-bit writes per port, and port selects (RPS/WPS) allow depth expansion while maintaining full port independence.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418B, the CY7C1312CV18 delivers 50% higher bandwidth via 250 MHz DDR operation and eliminates system-level deskew design effort through integrated DLL and echo clocks - critical for new 10G+ infrastructure designs.

Availability

CY7C1312CV18 is available at Aetrix Electronics and suitable for network packet buffering, high-speed test equipment memory, telecom baseband processing, and multi-core processor cache coherency requiring stable component supply across extended production lifecycles.

Supply support for CY7C1312CV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.

The QDR® II SRAM product line targets high-throughput, low-latency memory subsystems in networking and test equipment, where deterministic dual-port access and echo-clock–assisted timing closure are essential.

FAQ

What is the function of the DOFF pin?

The DOFF pin disables the internal delay lock loop (DLL) when pulled LOW. With DLL disabled, the device operates in QDR I mode at up to 167 MHz with 1-cycle read latency and no echo clock alignment. For normal 250 MHz operation, DOFF must be tied HIGH via ≤10 kΩ resistor to VDDQ.

Can CY7C1312CV18 operate in single-clock mode?

Yes - by connecting K to C and K to C, the device uses a single clock domain for both address capture and data output. In this mode, Q[17:0] and CQ/CQ are driven from K/K edges, eliminating need for separate C/C sources but reducing maximum frequency to 200 MHz due to timing margin constraints.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external resistor to ground (typically 100 Ω) to calibrate output driver impedance to 20 Ω (0.2 × RQ). This matches standard HSTL-18 bus impedance, minimizing reflections and ensuring clean eye diagrams at 500 MT/s. Leaving ZQ unconnected or tied to GND causes undefined drive strength and signal degradation.

Is JTAG boundary scan supported during normal operation?

Yes - the IEEE 1149.1 TAP controller operates independently of memory functions. TDI, TDO, TCK, and TMS pins remain fully functional during active read/write cycles, enabling in-system testing and debug without halting data flow. No special initialization or mode entry is required beyond standard JTAG state machine sequencing.