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Infineon Technologies CY7C1312KV18-250BZC

Part No.:
CY7C1312KV18-250BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1312KV18-250BZC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,128

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Product details

Overview

CY7C1312KV18 from Cypress Semiconductor is a 1.8 V, 18-Mbit QDR® II SRAM with 1M × 18 organization, two-word burst architecture, 333 MHz clock support (666 MHz DDR data rate), and separate read/write ports enabling concurrent transactions in high-bandwidth networking buffers and packet memory applications.

For engineers reviewing the CY7C1312KV18 datasheet, CY7C1312KV18 pinout, CY7C1312KV18 application, or CY7C1312KV18 equivalent, key selection considerations include its 1.5-cycle read latency (DOFF = HIGH), HSTL-compatible 1.4–1.8 V I/O supply, echo clocks (CQ/CQ) for timing margin recovery, and 165-ball FBGA package with verified pin mapping for depth expansion via RPS/WPS and BWS[1:0].

Technical Context

The CY7C1312KV18 implements a synchronous pipelined QDR II architecture with fully independent read and write ports sharing a multiplexed 19-bit address bus. Read and write operations are initiated on rising edges of complementary K/K clocks, while output data is synchronized to C/C clocks - enabling precise DDR timing control without bus turnaround.

It supports single-clock mode (K/K only) and dual-clock mode (K/K for inputs, C/C for outputs), includes a PLL for accurate data placement, JTAG 1149.1 test access, programmable output impedance via ZQ, and DOFF-configurable read latency (1 cycle in QDR I mode, 1.5 cycles in QDR II mode).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1,048,576 × 18 bits) - provides 2 MiB of high-speed buffer storage per device.
Max Clock Frequency 250 MHz (K/K input) - enables 500 MT/s effective throughput with two-word burst and DDR interface.
Data Interface Double-data-rate (DDR) on both read and write ports - transfers 36 bits per clock cycle (2 × 18-bit words) at 500 MT/s.
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable real-time trade-off between bandwidth and pipeline depth.
Supply Voltages Core VDD = 1.8 V ±0.1 V; I/O VDDQ = 1.4–1.8 V - supports interoperability with 1.5 V and 1.8 V logic families.
Package 165-ball FBGA (13 × 15 × 1.4 mm) - industry-standard footprint for high-density routing and thermal management in telecom line cards.
Output Drive Variable-drive HSTL-compliant outputs - configurable impedance matching via ZQ pin to minimize signal integrity issues on long traces.

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data inputs 18-bit parallel data sampled on rising edge of K clock; supports byte-write via BWS0/BWS1 for partial updates.
Q[17:0] Synchronous read data outputs 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS is deasserted.
RPS, WPS Port select controls Active-low asynchronous enable signals - gate port activity and prevent unintended reads/writes during idle cycles.
BWS[1:0] Byte write select Two independent 9-bit byte masks - allows selective update of D[8:0] (BWS0) and D[17:9] (BWS1) without disturbing other bytes.
K, K Input clock pair Complementary clocks for latching all synchronous inputs (address, data, controls); rising edges define timing reference.
C, C Output clock pair Complementary clocks for synchronizing Q[17:0] output timing; used with CQ/CQ to deskew flight time across multiple devices.
CQ, CQ Echo clocks Free-running copies of C/C, phase-aligned to output data - simplify high-speed capture at controller by eliminating clock-to-data skew.
ZQ Impedance calibration input Connects to external resistor to ground (RQ) to tune output driver strength; sets Q/CQ output impedance to 0.2 × RQ.
DOFF Read latency mode select High = QDR II mode (1.5-cycle latency); Low = QDR I mode (1-cycle latency) - configures internal pipeline behavior.

Key Features

Feature Design Value
Separate read/write ports Eliminates bus turnaround overhead and enables true concurrent read+write - critical for full-duplex packet buffering in switches/routers.
Two-word burst + DDR interface Delivers 36 bits per clock cycle (2 × 18-bit words) at 500 MT/s - doubles effective bandwidth versus single-word SRAMs at same clock rate.
Echo clocks (CQ/CQ) Phase-locked to C/C outputs - enables source-synchronous capture at controller with relaxed PCB trace length matching requirements.
Programmable output impedance ZQ-controlled drive strength matches system data bus impedance - reduces reflections and improves signal integrity on >10 cm traces.
JTAG 1149.1 boundary scan Full IEEE 1149.1 compliance - supports production testing, interconnect verification, and in-system diagnostics without additional test fixtures.

Applications

Telecom Line Card Buffering Network Packet Switching

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet line cards with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as shared buffer between MAC and switch fabric controllers, using RPS/WPS for arbitration-free access.

Use Value: Concurrent read/write eliminates serialization delay - sustains 40 Gbps+ throughput with sub-10 ns access granularity.

Use Scenario: High-speed forwarding table lookup and temporary frame storage in Layer 2/L3 enterprise switches.

IC Role / Device Role / Timing Role: Burst-mode memory providing two 18-bit words per cycle to match TCAM output width and feed next-stage processing pipelines.

Use Value: Two-word burst + DDR delivers 500 MT/s bandwidth - meets line-rate forwarding for 10GbE ports with zero packet loss under burst traffic.

Baseband Processing Memory Test Equipment Pattern Buffer

Use Scenario: Real-time buffering of IQ samples between ADC/DAC and FPGA-based digital pre-distortion (DPD) engines in 5G massive MIMO radios.

IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly to FPGA fabric via HSTL I/O, using CQ/CQ for deterministic data capture.

Use Value: 1.5-cycle latency (DOFF = HIGH) balances pipeline depth and jitter tolerance - maintains EVM < 2.5% at 28 GHz carrier frequencies.

Use Scenario: Storing stimulus/response patterns in automated test equipment (ATE) for high-pin-count SoC validation.

IC Role / Device Role / Timing Role: High-reliability memory holding multi-cycle test vectors with precise timing alignment via K/K and C/C clock domains.

Use Value: JTAG boundary scan enables full interconnect test coverage - reduces test development time by 40% versus non-scannable alternatives.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-Mbit (1M × 36), 166 MHz max clock, LVDS I/O, no echo clocks, fixed 1-cycle latency Higher density but lower speed; requires external clock forwarding for timing closure Select when needing wider data bus (36-bit) and LVDS compatibility, accepting reduced bandwidth and added layout complexity.
ISSI IS61WV102418BLL-15BLI 18-Mbit (512K × 36), 15 ns async access, CMOS I/O, no DDR or burst capability Asynchronous operation limits throughput to ~66 MHz effective; no concurrent port support Select only for cost-sensitive, low-bandwidth control-plane buffers where QDR timing features are unnecessary.

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, the CY7C1312KV18 uniquely delivers 500 MT/s DDR throughput with echo-clock–assisted timing closure and configurable latency - making it optimal for 10+ Gbps packet memory where deterministic timing and concurrency are mandatory.

Availability

CY7C1312KV18 is available at Aetrix Electronics and suitable for telecom line card buffering, network packet switching, and baseband processing requiring stable component supply, long-lifecycle support, and guaranteed Pb-free compliance.

Supply support for CY7C1312KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with over 30 years of SRAM innovation.

The QDR® II SRAM product line targets high-speed infrastructure applications demanding deterministic latency, concurrent access, and DDR bandwidth - specifically engineered for packet buffering, switching fabrics, and real-time signal processing.

FAQ

What is the function of the DOFF pin on CY7C1312KV18?

The DOFF (Data Output OFF) pin selects the read latency mode: when asserted HIGH, the device operates in QDR II mode with 1.5-cycle read latency; when LOW or tied to VSS, it reverts to QDR I mode with 1-cycle latency. This pin directly controls internal pipeline staging and must be held static during operation - it is not sampled dynamically per access.

Can CY7C1312KV18 operate with only the K clock (single-clock mode)?

Yes - in single-clock mode, K and K serve as the sole timing reference for both input latching and output driving; C and C are unused, and Q[17:0] outputs are synchronized to K/K edges. All timing parameters shift accordingly, and echo clocks CQ/CQ derive from K/K instead of C/C. The device remains fully functional but loses dual-clock deskew benefits.

How is output impedance calibrated using the ZQ pin?

ZQ connects to an external precision resistor (RQ) tied to ground; the device measures RQ and configures its output drivers (Q[17:0], CQ, CQ) to 20% of that resistance value. For example, a 50 Ω RQ yields ~10 Ω driver impedance. Direct connection to VDDQ enables minimum impedance mode (~7 Ω), while floating or grounding ZQ is prohibited and may cause undefined behavior.

What is the role of BWS0 and BWS1 in write operations?

BWS0 and BWS1 are active-low byte write select signals controlling independent 9-bit segments of the 18-bit data bus: BWS0 enables writes to D[8:0], BWS1 enables writes to D[17:9]. When either is deasserted, the corresponding byte group retains its prior value - enabling partial-word updates without read-modify-write cycles, essential for protocol header manipulation in packet processing.

CY7C1312KV18-250BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1312KV18-250BZC FAQ

1.How can I place an order for CY7C1312KV18-250BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1312KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1312KV18-250BZC reliable?

The price and inventory of CY7C1312KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1312KV18-250BZC is usually 5 days.

3.What payment methods are accepted for CY7C1312KV18-250BZC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1312KV18-250BZC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1312KV18-250BZC?

CY7C1312KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1312KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1312KV18-250BZC?

For technical support, including CY7C1312KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1312KV18-250BZC requirements.

6.How does Aetrix verify that CY7C1312KV18-250BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1312KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1312KV18-250BZC meets industry standards.

7.What is the process for return or replacement of CY7C1312KV18-250BZC?

All CY7C1312KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1312KV18-250BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1312KV18-250BZC part is unused and in its original packaging.

Return procedure for CY7C1312KV18-250BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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