Infineon Technologies CY7C1312KV18-250BZCT
- Part No.:
- CY7C1312KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1312KV18-250BZCT.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1312KV18-250BZCT from Cypress Semiconductor is a 1M × 18, 18-Mbit QDR® II SRAM with separate read/write ports, 250 MHz maximum clock frequency (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent burst reads/writes with two-word DDR transfers per cycle and supports depth expansion via RPS/WPS controls in high-bandwidth networking buffers.
For engineers reviewing the CY7C1312KV18-250BZCT datasheet, CY7C1312KV18-250BZCT pinout, CY7C1312KV18-250BZCT application, or CY7C1312KV18-250BZCT equivalent, key selection criteria include read latency (1.5 cycles with DOFF HIGH), echo clock timing (CQ/CQ), byte write select granularity (BWS0/BWS1), and FBGA-165 package compatibility for multi-chip memory subsystems.
Technical Context
The device implements true dual-port synchronous pipelined architecture: independent K/K clocks latch addresses and data on rising edges, while C/C clocks drive output registers for precise DDR read timing. Echo clocks CQ/CQ are free-running and phase-aligned to C/C, enabling source-synchronous capture at the controller.
All inputs are registered on K/K; all outputs are registered on C/C (or K/K in single-clock mode). Writes use on-chip self-timed circuitry, eliminating external write-strobe timing constraints. The DOFF pin selects between QDR II mode (1.5-cycle read latency) and QDR I mode (1-cycle latency), preserving backward compatibility.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1,048,576 × 18-bit words) |
| Max Clock Frequency | 250 MHz - enables 500 MT/s effective throughput per port |
| Read Latency | 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable real-time latency mode |
| Core Supply Voltage | 1.8 V ±0.1 V - fixed low-voltage core for reduced dynamic power |
| I/O Supply Range | 1.4 V to 1.8 V - supports both 1.5 V and 1.8 V HSTL-compatible interfaces |
| Burst Length | Two-word burst - delivers 36 bits per read/write access cycle |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm) - RoHS-compliant, thermal-enhanced footprint |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data bus sampled on rising edge of K clock during WPS assertion |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS inactive |
| RPS / WPS | Read/Write Port Select | Active-low asynchronous enable signals controlling port activation and data bus directionality |
| BWS0 / BWS1 | Byte Write Select | Independent 9-bit byte masks: BWS0 covers D[8:0], BWS1 covers D[17:9]; enables partial-word writes |
| K / K | Input clock pair | Positive/negative differential clocks for address/data capture; rising edges control all synchronous inputs |
| C / C | Output clock pair | Positive/negative differential clocks for Q[17:0] output register timing; used for deskewed data capture |
| CQ / CQ | Echo clock pair | Free-running, phase-aligned copies of C/C - simplify source-synchronous receiver design at controller |
| ZQ | Impedance calibration input | Connects to external 240 Ω resistor to ground to tune Q/CQ output driver impedance to 48 Ω (0.2 × RQ) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data paths | Eliminates bus turnaround overhead and prevents data contention in full-duplex memory systems |
| Two-word DDR burst per access | Delivers 36 bits/cycle at 250 MHz → 9 Gbps aggregate bandwidth (18-bit × 2 × 250 MHz) |
| Programmable output impedance (ZQ) | Enables precise 48 Ω matching to PCB trace impedance without external termination resistors |
| JTAG 1149.1 boundary scan | Supports IEEE-compliant test access for board-level interconnect verification and production testing |
| DOFF-selectable latency mode | Runtime switch between QDR II (1.5-cycle) and QDR I (1-cycle) read latency for legacy compatibility |
Applications
| Packet Buffering in Switch ASICs | Line Card Memory in Telecom Routers |
|---|---|
|
Use Scenario: High-speed packet buffering between ingress and egress pipelines in 10G/40G Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM serving as zero-latency, concurrent-access buffer with independent read/write ports synchronized to line-rate clocks. Use Value: Enables simultaneous packet enqueue (write) and dequeue (read) at 250 MHz, sustaining 9 Gbps throughput without arbitration stalls. |
Use Scenario: Frame storage in modular telecom line cards handling OC-192/STM-64 traffic. IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing with SerDes PHYs and traffic managers using echo-clocked DDR reads for jitter-tolerant capture. Use Value: CQ/CQ echo clocks align data valid windows to controller sampling points, reducing setup/hold margin requirements by >150 ps. |
| Depth-Expanded Memory Subsystem | Protocol Accelerator Cache |
|
Use Scenario: 4-Mbit aggregated memory built from four CY7C1312KV18 devices using RPS/WPS for bank selection. IC Role / Device Role / Timing Role: Individual 1M×18 memory slice controlled by shared K/C clocks and discrete port selects for address-space partitioning. Use Value: Maintains full 250 MHz operation across all slices with no clock skew penalty due to common clock tree distribution. |
Use Scenario: Low-latency instruction/data cache for network protocol offload engines (e.g., TCP/IP, TLS acceleration). IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic 1.5-cycle read response to microsequencer fetch requests under DOFF=HIGH configuration. Use Value: Guarantees sub-6 ns read access time at 250 MHz, meeting tight pipeline stage deadlines in hard real-time accelerators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 1M × 18, 100 MHz max, LVDS interface, no echo clocks, 3.3 V I/O | Limited to lower-speed backplane applications; lacks CQ/CQ for source-synchronous capture | Select only if system clock ≤100 MHz and LVDS signaling is required; not drop-in compatible |
| ISSI IS61WV102418BLL-15BLI | 1M × 18, 15 ns async access, single-ended CMOS, no DDR or burst capability | Suitable for non-pipelined control-plane memory; cannot support concurrent read/write at 250 MHz | Use only in cost-sensitive, low-bandwidth management MCU subsystems - not for data-path acceleration |
Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C1312KV18-250BZCT uniquely delivers 250 MHz DDR burst performance with echo clocks and programmable impedance-critical for high-speed packet processing where timing closure and signal integrity dominate.
Availability
CY7C1312KV18-250BZCT is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, line card memory in telecom routers, and depth-expanded memory subsystems requiring stable component supply across extended product lifecycles.
Supply support for CY7C1312KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
This device belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure where concurrent read/write and sub-6 ns latency are mandatory.
FAQ
What is the function of the DOFF pin on CY7C1312KV18-250BZCT?
The DOFF (Double-Data-Rate Off) pin configures read latency mode: when asserted HIGH, the device operates in QDR II mode with 1.5-cycle read latency; when LOW or tied to VSS, it reverts to QDR I mode with 1-cycle latency. This allows runtime compatibility with legacy controllers without hardware redesign.
How does the ZQ pin affect signal integrity?
ZQ connects to an external 240 Ω resistor to ground, calibrating internal output drivers to deliver 48 Ω impedance on Q[17:0] and CQ/CQ pins. This matches standard PCB trace impedance, minimizing reflections and ensuring clean DDR waveform edges at 250 MHz operation.
Can CY7C1312KV18-250BZCT operate with only one clock (K) instead of K/K?
Yes - in single-clock mode, K serves as both positive and negative clock reference: K is used for input capture and K is unused (tied or left floating per datasheet guidance). Output timing then references K/K, and CQ/CQ derive from K. All functionality remains intact, though differential clocking benefits are forfeited.
What is the purpose of BWS0 and BWS1 in write operations?
BWS0 and BWS1 are active-low byte write select signals that independently enable writing to D[8:0] and D[17:9]. When deasserted, corresponding 9-bit segments retain prior data - enabling partial-word updates without read-modify-write cycles, critical for efficient header manipulation in packet processing.
CY7C1312KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1312KV18-250BZCT FAQ
1.How can I place an order for CY7C1312KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1312KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1312KV18-250BZCT reliable?
The price and inventory of CY7C1312KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1312KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1312KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1312KV18-250BZCT transactions.
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CY7C1312KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1312KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1312KV18-250BZCT?
For technical support, including CY7C1312KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1312KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1312KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1312KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1312KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1312KV18-250BZCT?
All CY7C1312KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1312KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1312KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1312KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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