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Infineon Technologies CY7C1312KV18-250BZCT

Part No.:
CY7C1312KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1312KV18-250BZCT.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,169

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Product details

Overview

CY7C1312KV18-250BZCT from Cypress Semiconductor is a 1M × 18, 18-Mbit QDR® II SRAM with separate read/write ports, 250 MHz maximum clock frequency (400 Mbps per pin), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent burst reads/writes with two-word DDR transfers per cycle and supports depth expansion via RPS/WPS controls in high-bandwidth networking buffers.

For engineers reviewing the CY7C1312KV18-250BZCT datasheet, CY7C1312KV18-250BZCT pinout, CY7C1312KV18-250BZCT application, or CY7C1312KV18-250BZCT equivalent, key selection criteria include read latency (1.5 cycles with DOFF HIGH), echo clock timing (CQ/CQ), byte write select granularity (BWS0/BWS1), and FBGA-165 package compatibility for multi-chip memory subsystems.

Technical Context

The device implements true dual-port synchronous pipelined architecture: independent K/K clocks latch addresses and data on rising edges, while C/C clocks drive output registers for precise DDR read timing. Echo clocks CQ/CQ are free-running and phase-aligned to C/C, enabling source-synchronous capture at the controller.

All inputs are registered on K/K; all outputs are registered on C/C (or K/K in single-clock mode). Writes use on-chip self-timed circuitry, eliminating external write-strobe timing constraints. The DOFF pin selects between QDR II mode (1.5-cycle read latency) and QDR I mode (1-cycle latency), preserving backward compatibility.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1,048,576 × 18-bit words)
Max Clock Frequency 250 MHz - enables 500 MT/s effective throughput per port
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - selectable real-time latency mode
Core Supply Voltage 1.8 V ±0.1 V - fixed low-voltage core for reduced dynamic power
I/O Supply Range 1.4 V to 1.8 V - supports both 1.5 V and 1.8 V HSTL-compatible interfaces
Burst Length Two-word burst - delivers 36 bits per read/write access cycle
Package 165-ball FBGA (13 × 15 × 1.4 mm) - RoHS-compliant, thermal-enhanced footprint

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[17:0] Synchronous write data input 18-bit parallel data bus sampled on rising edge of K clock during WPS assertion
Q[17:0] Synchronous read data output 18-bit parallel data driven on rising edges of C/C clocks; tristated when RPS inactive
RPS / WPS Read/Write Port Select Active-low asynchronous enable signals controlling port activation and data bus directionality
BWS0 / BWS1 Byte Write Select Independent 9-bit byte masks: BWS0 covers D[8:0], BWS1 covers D[17:9]; enables partial-word writes
K / K Input clock pair Positive/negative differential clocks for address/data capture; rising edges control all synchronous inputs
C / C Output clock pair Positive/negative differential clocks for Q[17:0] output register timing; used for deskewed data capture
CQ / CQ Echo clock pair Free-running, phase-aligned copies of C/C - simplify source-synchronous receiver design at controller
ZQ Impedance calibration input Connects to external 240 Ω resistor to ground to tune Q/CQ output driver impedance to 48 Ω (0.2 × RQ)

Key Features

Feature Design Value
Separate read/write data paths Eliminates bus turnaround overhead and prevents data contention in full-duplex memory systems
Two-word DDR burst per access Delivers 36 bits/cycle at 250 MHz → 9 Gbps aggregate bandwidth (18-bit × 2 × 250 MHz)
Programmable output impedance (ZQ) Enables precise 48 Ω matching to PCB trace impedance without external termination resistors
JTAG 1149.1 boundary scan Supports IEEE-compliant test access for board-level interconnect verification and production testing
DOFF-selectable latency mode Runtime switch between QDR II (1.5-cycle) and QDR I (1-cycle) read latency for legacy compatibility

Applications

Packet Buffering in Switch ASICs Line Card Memory in Telecom Routers

Use Scenario: High-speed packet buffering between ingress and egress pipelines in 10G/40G Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as zero-latency, concurrent-access buffer with independent read/write ports synchronized to line-rate clocks.

Use Value: Enables simultaneous packet enqueue (write) and dequeue (read) at 250 MHz, sustaining 9 Gbps throughput without arbitration stalls.

Use Scenario: Frame storage in modular telecom line cards handling OC-192/STM-64 traffic.

IC Role / Device Role / Timing Role: Burst-mode SRAM interfacing with SerDes PHYs and traffic managers using echo-clocked DDR reads for jitter-tolerant capture.

Use Value: CQ/CQ echo clocks align data valid windows to controller sampling points, reducing setup/hold margin requirements by >150 ps.

Depth-Expanded Memory Subsystem Protocol Accelerator Cache

Use Scenario: 4-Mbit aggregated memory built from four CY7C1312KV18 devices using RPS/WPS for bank selection.

IC Role / Device Role / Timing Role: Individual 1M×18 memory slice controlled by shared K/C clocks and discrete port selects for address-space partitioning.

Use Value: Maintains full 250 MHz operation across all slices with no clock skew penalty due to common clock tree distribution.

Use Scenario: Low-latency instruction/data cache for network protocol offload engines (e.g., TCP/IP, TLS acceleration).

IC Role / Device Role / Timing Role: Pipelined SRAM providing deterministic 1.5-cycle read response to microsequencer fetch requests under DOFF=HIGH configuration.

Use Value: Guarantees sub-6 ns read access time at 250 MHz, meeting tight pipeline stage deadlines in hard real-time accelerators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 1M × 18, 100 MHz max, LVDS interface, no echo clocks, 3.3 V I/O Limited to lower-speed backplane applications; lacks CQ/CQ for source-synchronous capture Select only if system clock ≤100 MHz and LVDS signaling is required; not drop-in compatible
ISSI IS61WV102418BLL-15BLI 1M × 18, 15 ns async access, single-ended CMOS, no DDR or burst capability Suitable for non-pipelined control-plane memory; cannot support concurrent read/write at 250 MHz Use only in cost-sensitive, low-bandwidth management MCU subsystems - not for data-path acceleration

Compared with IDT72T3615L10BG and IS61WV102418BLL-15BLI, CY7C1312KV18-250BZCT uniquely delivers 250 MHz DDR burst performance with echo clocks and programmable impedance-critical for high-speed packet processing where timing closure and signal integrity dominate.

Availability

CY7C1312KV18-250BZCT is available at Aetrix Electronics and suitable for packet buffering in Ethernet switches, line card memory in telecom routers, and depth-expanded memory subsystems requiring stable component supply across extended product lifecycles.

Supply support for CY7C1312KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

This device belongs to the QDR® II SRAM product line, engineered specifically for deterministic, high-bandwidth memory access in packet-switched infrastructure where concurrent read/write and sub-6 ns latency are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1312KV18-250BZCT?

The DOFF (Double-Data-Rate Off) pin configures read latency mode: when asserted HIGH, the device operates in QDR II mode with 1.5-cycle read latency; when LOW or tied to VSS, it reverts to QDR I mode with 1-cycle latency. This allows runtime compatibility with legacy controllers without hardware redesign.

How does the ZQ pin affect signal integrity?

ZQ connects to an external 240 Ω resistor to ground, calibrating internal output drivers to deliver 48 Ω impedance on Q[17:0] and CQ/CQ pins. This matches standard PCB trace impedance, minimizing reflections and ensuring clean DDR waveform edges at 250 MHz operation.

Can CY7C1312KV18-250BZCT operate with only one clock (K) instead of K/K?

Yes - in single-clock mode, K serves as both positive and negative clock reference: K is used for input capture and K is unused (tied or left floating per datasheet guidance). Output timing then references K/K, and CQ/CQ derive from K. All functionality remains intact, though differential clocking benefits are forfeited.

What is the purpose of BWS0 and BWS1 in write operations?

BWS0 and BWS1 are active-low byte write select signals that independently enable writing to D[8:0] and D[17:9]. When deasserted, corresponding 9-bit segments retain prior data - enabling partial-word updates without read-modify-write cycles, critical for efficient header manipulation in packet processing.

CY7C1312KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1312KV18-250BZCT FAQ

1.How can I place an order for CY7C1312KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1312KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1312KV18-250BZCT reliable?

The price and inventory of CY7C1312KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1312KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1312KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1312KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1312KV18-250BZCT?

CY7C1312KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1312KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1312KV18-250BZCT?

For technical support, including CY7C1312KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1312KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1312KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1312KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1312KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1312KV18-250BZCT?

All CY7C1312KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1312KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1312KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1312KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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