Infineon Technologies CY7C1312KV18-250BZI

Overview

CY7C1312KV18 from Cypress Semiconductor is a 1M × 18, 18-Mbit QDR® II SRAM with separate read/write ports, 333 MHz clock support (666 MHz DDR data rate), 1.5-cycle read latency (DOFF = HIGH), and 1.8 V core / 1.4–1.8 V I/O supply. It delivers concurrent burst transfers in networking packet buffers and high-speed switch fabric control memory.

For engineers reviewing the CY7C1312KV18 datasheet, CY7C1312KV18 pinout, CY7C1312KV18 application, or CY7C1312KV18 equivalent, key selection criteria include dual-clock DDR timing, echo clock (CQ/CQ) support for source-synchronous capture, HSTL-compatible output drive, JTAG 1149.1 test access, and FBGA-165 package compatibility with depth expansion via RPS/WPS.

Technical Context

The CY7C1312KV18 implements a synchronous pipelined QDR II architecture with fully independent read and write ports sharing a multiplexed 19-bit address bus. Read and write operations are initiated on rising edges of K/K clocks, while output data is clocked by C/C with associated echo clocks CQ/CQ for flight-time deskew.

It supports two-word burst transfers per access, full data coherency, on-chip self-timed writes, and programmable output impedance via ZQ pin. DOFF pin selects between 1.5-cycle (QDR II mode) and 1-cycle (QDR I mode) read latency - a hardware-configurable timing behavior critical for system-level synchronization.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Compared with IDT72T3615L10BG and IS61WV102418B, CY7C1312KV18 uniquely supports 333 MHz DDR operation with echo clocks and programmable impedance - making it the only option for new designs targeting >500 MB/s sustained throughput with sub-200 ps timing closure.

Availability

CY7C1312KV18 is available at Aetrix Electronics and suitable for high-speed networking equipment, telecom infrastructure, and test instrumentation requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.

Supply support for CY7C1312KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications.

The QDR® II SRAM product line targets high-bandwidth, low-latency memory subsystems in networking, telecom, and test equipment - emphasizing concurrent access, precise timing control, and signal integrity at multi-hundred-MHz speeds.

FAQ

What is the function of the DOFF pin on CY7C1312KV18?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle QDR II latency for optimized timing in high-speed pipelines; when LOW, it reverts to 1-cycle QDR I latency for backward compatibility. This is a static hardware configuration - no register write required.

Can CY7C1312KV18 operate with only one clock signal (K only)?

Yes - it supports single-clock mode where K serves as both input and output clock. In this mode, C/C are unused, CQ/CQ derive from K/K, and Q[17:0] are clocked by K/K. However, echo clock deskew and maximum 333 MHz performance require dual-clock (K/K + C/C) operation.

How does the ZQ pin affect signal integrity?

ZQ connects to an external resistor to ground (typically 240 Ω) to calibrate output driver impedance for Q[17:0], CQ, and CQ pins. This achieves ~48 Ω output impedance (0.2 × RQ), matching standard 50 Ω PCB traces and reducing reflections - eliminating need for discrete series terminators.

Is JTAG boundary scan supported during normal operation?

Yes - the IEEE 1149.1 TAP remains fully functional while the SRAM operates. Test instructions (SAMPLE/PRELOAD, EXTEST, INTEST) can be executed without halting memory access, enabling in-system verification and fault diagnosis without interrupting real-time traffic flow.