Infineon Technologies CY7C1313BV18-167BZCT
- Part No.:
- CY7C1313BV18-167BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1313BV18-167BZCT.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1313BV18-167BZCT from Cypress Semiconductor is a 1M × 18-bit, 18-Mbit QDR-II SRAM with separate read/write ports, 167 MHz maximum operating frequency (600 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements synchronous pipelined burst reads/writes of four 18-bit words per access and targets high-bandwidth packet buffering in network line cards and switch fabric interfaces.
For engineers reviewing the CY7C1313BV18-167BZCT datasheet, CY7C1313BV18-167BZCT pinout, CY7C1313BV18-167BZCT application, or CY7C1313BV18-167BZCT equivalent, key selection criteria include dual-port concurrency, echo-clock–assisted DDR timing alignment, HSTL-compatible 18-bit bidirectional data width, and FBGA-165 package compatibility with high-density routing constraints.
Technical Context
The device uses QDR-II architecture with physically independent read and write data paths-Q[17:0] outputs and D[17:0] inputs-eliminating bus turnaround overhead. Address latching occurs on alternating rising edges of K/K clocks, enabling full-duplex operation without arbitration logic.
Read and write operations are synchronized to dedicated clock pairs: K/K for address/control/data input registration, and C/C for output timing with echo clocks CQ/CQ referenced to C/C. A Delay Lock Loop (DLL) ensures precise data placement relative to output clocks, supporting stable 600 Mbps DDR transfers at 300 MHz clock frequency.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 1M × 18-bit (18 Mbit total); enables 18-bit parallel data path without external width expansion |
| Maximum Clock Frequency | 167 MHz (K/K input); supports sustained 600 Mbps DDR bandwidth via double-data-rate transfers |
| Core Supply Voltage | VDD = 1.8 V ±0.1 V; defines low-power, high-speed 1.8 V logic domain for internal array and control |
| I/O Supply Voltage | VDDQ = 1.4 V to 1.8 V; allows interface voltage scaling to match downstream HSTL or SSTL receivers |
| Burst Length | 4-word burst; reduces address bus toggling frequency by 4× versus single-word access mode |
| Output Drive Type | Variable-drive HSTL Class I; configurable impedance matching via ZQ pin for signal integrity on high-speed traces |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm); supports fine-pitch routing and thermal dissipation in dense PCB layouts |
Pinout & Package
165-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 13 mm × 15 mm body size, and 1.4 mm height. Designed for automated surface-mount assembly and high-signal-integrity routing in telecom and networking equipment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data inputs | Latched on rising edge of K/K; 18-bit parallel input path for burst writes |
| Q[17:0] | Synchronous read data outputs | Driven on rising edges of C/C; tri-stated when RPS is deasserted |
| RPS | Read port select (active LOW) | Enables read burst initiation; sampled on rising edge of K |
| WPS | Write port select (active LOW) | Enables write burst initiation; sampled on rising edge of K |
| BWS[1:0] | Byte write selects (active LOW) | Controls 9-bit byte granularity: BWS0 → D[8:0], BWS1 → D[17:9] |
| A[17:0] | Multiplexed address inputs | Latched on rising edge of K; shared between read and write ports |
| K, K | Positive/negative input clocks | Reference for all synchronous inputs; rising edges capture address/control/data |
| C, C | Positive/negative output clocks | Reference for Q[17:0] and CQ/CQ; enable clock deskewing across multi-device systems |
| CQ, CQ | Echo clocks | Free-running, phase-aligned copies of C/C; simplify source-synchronous data capture at controller |
| ZQ | Impedance calibration input | Connects to external resistor to ground to tune output driver impedance to 0.2 × RQ |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write data ports | Eliminates bus turnaround delay and contention, enabling true concurrent read+write at full bandwidth |
| Double Data Rate (DDR) interface | Transfers 18-bit data on both rising edges of C/C clocks, achieving 600 Mbps effective throughput |
| Echo clock support (CQ/CQ) | Provides deterministic, low-skew timing reference for controller-side data capture in high-speed systems |
| On-chip DLL | Aligns internal data launch timing to output clocks within ±50 ps, ensuring setup/hold compliance at 167 MHz |
| JTAG 1149.1 test access port | Enables boundary-scan testing and in-system debug without additional test fixtures or probes |
| Variable-drive HSTL outputs | Adjustable drive strength via ZQ calibration maintains signal integrity across varying trace lengths and loads |
Applications
| Network Packet Buffering | Switch Fabric Interface |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffer between ingress parser and egress scheduler, accepting writes while simultaneously servicing read requests. Use Value: 18-bit width matches common header field widths; 4-word burst minimizes address bus activity; echo clocks ensure reliable 600 Mbps data capture at ASIC interface. |
Use Scenario: Interfacing line card ASICs to centralized crossbar switches in modular routers. IC Role / Device Role / Timing Role: High-throughput memory node providing non-blocking read/write access for cell-based or packet-based switching fabric arbitration logic. Use Value: Separate ports eliminate arbitration stalls; DLL + CQ/CQ guarantee timing closure at 167 MHz clock; FBGA-165 fits tight board spacing requirements. |
| Telecom Line Card Memory | High-Speed Test Equipment Buffer |
Use Scenario: Real-time buffering of SONET/SDH frame data in OC-192 or 10G Ethernet PHY interfaces. IC Role / Device Role / Timing Role: Synchronous pipeline stage between framer and MAC layer, absorbing jitter and aligning data bursts. Use Value: 1.8 V core reduces power vs. 3.3 V QDR-I; HSTL I/O compatible with TI/Analog Devices SerDes receivers; BWS[1:0] enables partial writes without read-modify-write cycles. |
Use Scenario: Capturing high-speed digital stimulus/response waveforms in automated test equipment (ATE) pattern generators. IC Role / Device Role / Timing Role: Burst-access memory staging point for waveform data before serial-to-parallel conversion and DAC feeding. Use Value: 4-word burst matches typical ATE vector depth; echo clocks simplify timing alignment with pattern generator clocks; JTAG support enables in-system verification. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port burst SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1313BV18-250BZCT | Higher max frequency (250 MHz vs. 167 MHz); same 1M×18 organization and FBGA-165 package | Supports 900 Mbps DDR bandwidth; requires tighter timing margins and higher power (500 mA vs. 400 mA) | Select when system clock budget permits >200 MHz operation and higher bandwidth justifies increased power and layout complexity |
| AS7C3256B-167JC | Single-port, 32K×8 asynchronous SRAM; no DDR, no echo clocks, no DLL; SOJ-32 package | Lower cost, simpler interface, but no concurrent read/write or burst capability | Select only for legacy designs requiring pin-compatible replacement with no bandwidth or concurrency requirements |
Compared with CY7C1313BV18-250BZCT, the -167BZCT trades peak bandwidth for lower power and relaxed timing margins; compared with AS7C3256B-167JC, it delivers true dual-port concurrency and DDR timing infrastructure essential for modern packet-processing pipelines.
Availability
CY7C1313BV18-167BZCT is available at Aetrix Electronics and suitable for network packet buffering, switch fabric interface, telecom line card memory, and high-speed test equipment requiring stable component supply, long-lifecycle support, and consistent FBGA-165 packaging.
Supply support for CY7C1313BV18-167BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for communications and industrial markets.
This device belongs to Cypress's QDR-II SRAM product line, engineered specifically for ultra-low-latency, concurrent-access memory subsystems in high-speed networking and telecommunications infrastructure.
FAQ
What is the function of the ZQ pin on CY7C1313BV18-167BZCT?
The ZQ pin calibrates output driver impedance to match the system data bus. When connected to a precision resistor to ground, it sets CQ, CQ, and Q[17:0] output impedance to 0.2 × RQ. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode. This calibration ensures signal integrity and reduces reflections on high-speed traces without external termination resistors.
Can CY7C1313BV18-167BZCT operate in single-clock mode?
Yes. In single-clock mode, the device uses K as both input and output clock reference: K drives input registers and Q[17:0] output registers, while C/C and CQ/CQ are unused. This simplifies clock distribution but reduces maximum achievable bandwidth compared to dual-clock mode, where C/C provide independent output timing control and deskewing capability.
How does the 4-word burst architecture reduce system address bus loading?
Each read or write access transfers four consecutive 18-bit words using a single address. The internal address counter increments automatically after each word, so only one address setup is required per burst. This cuts address bus toggling frequency by 75% versus single-word access, lowering EMI, reducing controller overhead, and easing timing closure on shared address buses in multi-SRAM systems.
What is the role of BWS[1:0] in CY7C1313BV18-167BZCT?
BWS[1:0] are active-LOW byte write select signals controlling 9-bit granularity: BWS0 enables writing to D[8:0], and BWS1 enables D[17:9]. When either is deasserted, the corresponding 9-bit byte is ignored during the write burst, preserving existing data in those bits. This eliminates need for read-modify-write cycles when updating partial words-critical for efficient header modification in packet processing.
CY7C1313BV18-167BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1313BV18-167BZCT FAQ
1.How can I place an order for CY7C1313BV18-167BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1313BV18-167BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of CY7C1313BV18-167BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313BV18-167BZCT is usually 5 days.
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Once your CY7C1313BV18-167BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1313BV18-167BZCT?
For technical support, including CY7C1313BV18-167BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313BV18-167BZCT requirements.
6.How does Aetrix verify that CY7C1313BV18-167BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1313BV18-167BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313BV18-167BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1313BV18-167BZCT?
All CY7C1313BV18-167BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313BV18-167BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1313BV18-167BZCT part is unused and in its original packaging.
Return procedure for CY7C1313BV18-167BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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