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Infineon Technologies CY7C1313BV18-167BZCT

Part No.:
CY7C1313BV18-167BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1313BV18-167BZCT.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,021

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Product details

Overview

CY7C1313BV18-167BZCT from Cypress Semiconductor is a 1M × 18-bit, 18-Mbit QDR-II SRAM with separate read/write ports, 167 MHz maximum operating frequency (600 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It implements synchronous pipelined burst reads/writes of four 18-bit words per access and targets high-bandwidth packet buffering in network line cards and switch fabric interfaces.

For engineers reviewing the CY7C1313BV18-167BZCT datasheet, CY7C1313BV18-167BZCT pinout, CY7C1313BV18-167BZCT application, or CY7C1313BV18-167BZCT equivalent, key selection criteria include dual-port concurrency, echo-clock–assisted DDR timing alignment, HSTL-compatible 18-bit bidirectional data width, and FBGA-165 package compatibility with high-density routing constraints.

Technical Context

The device uses QDR-II architecture with physically independent read and write data paths-Q[17:0] outputs and D[17:0] inputs-eliminating bus turnaround overhead. Address latching occurs on alternating rising edges of K/K clocks, enabling full-duplex operation without arbitration logic.

Read and write operations are synchronized to dedicated clock pairs: K/K for address/control/data input registration, and C/C for output timing with echo clocks CQ/CQ referenced to C/C. A Delay Lock Loop (DLL) ensures precise data placement relative to output clocks, supporting stable 600 Mbps DDR transfers at 300 MHz clock frequency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization1M × 18-bit (18 Mbit total); enables 18-bit parallel data path without external width expansion
Maximum Clock Frequency167 MHz (K/K input); supports sustained 600 Mbps DDR bandwidth via double-data-rate transfers
Core Supply VoltageVDD = 1.8 V ±0.1 V; defines low-power, high-speed 1.8 V logic domain for internal array and control
I/O Supply VoltageVDDQ = 1.4 V to 1.8 V; allows interface voltage scaling to match downstream HSTL or SSTL receivers
Burst Length4-word burst; reduces address bus toggling frequency by 4× versus single-word access mode
Output Drive TypeVariable-drive HSTL Class I; configurable impedance matching via ZQ pin for signal integrity on high-speed traces
Package165-ball FBGA (13 mm × 15 mm × 1.4 mm); supports fine-pitch routing and thermal dissipation in dense PCB layouts

Pinout & Package

165-ball Fine-Pitch Ball Grid Array (FBGA) package with 0.8 mm ball pitch, 13 mm × 15 mm body size, and 1.4 mm height. Designed for automated surface-mount assembly and high-signal-integrity routing in telecom and networking equipment.

Pin/Terminal Circuit Role Design Meaning
D[17:0]Synchronous write data inputsLatched on rising edge of K/K; 18-bit parallel input path for burst writes
Q[17:0]Synchronous read data outputsDriven on rising edges of C/C; tri-stated when RPS is deasserted
RPSRead port select (active LOW)Enables read burst initiation; sampled on rising edge of K
WPSWrite port select (active LOW)Enables write burst initiation; sampled on rising edge of K
BWS[1:0]Byte write selects (active LOW)Controls 9-bit byte granularity: BWS0 → D[8:0], BWS1 → D[17:9]
A[17:0]Multiplexed address inputsLatched on rising edge of K; shared between read and write ports
K, KPositive/negative input clocksReference for all synchronous inputs; rising edges capture address/control/data
C, CPositive/negative output clocksReference for Q[17:0] and CQ/CQ; enable clock deskewing across multi-device systems
CQ, CQEcho clocksFree-running, phase-aligned copies of C/C; simplify source-synchronous data capture at controller
ZQImpedance calibration inputConnects to external resistor to ground to tune output driver impedance to 0.2 × RQ

Key Features

Feature Design Value
Separate read/write data portsEliminates bus turnaround delay and contention, enabling true concurrent read+write at full bandwidth
Double Data Rate (DDR) interfaceTransfers 18-bit data on both rising edges of C/C clocks, achieving 600 Mbps effective throughput
Echo clock support (CQ/CQ)Provides deterministic, low-skew timing reference for controller-side data capture in high-speed systems
On-chip DLLAligns internal data launch timing to output clocks within ±50 ps, ensuring setup/hold compliance at 167 MHz
JTAG 1149.1 test access portEnables boundary-scan testing and in-system debug without additional test fixtures or probes
Variable-drive HSTL outputsAdjustable drive strength via ZQ calibration maintains signal integrity across varying trace lengths and loads

Applications

Network Packet Buffering Switch Fabric Interface

Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as first-level buffer between ingress parser and egress scheduler, accepting writes while simultaneously servicing read requests.

Use Value: 18-bit width matches common header field widths; 4-word burst minimizes address bus activity; echo clocks ensure reliable 600 Mbps data capture at ASIC interface.

Use Scenario: Interfacing line card ASICs to centralized crossbar switches in modular routers.

IC Role / Device Role / Timing Role: High-throughput memory node providing non-blocking read/write access for cell-based or packet-based switching fabric arbitration logic.

Use Value: Separate ports eliminate arbitration stalls; DLL + CQ/CQ guarantee timing closure at 167 MHz clock; FBGA-165 fits tight board spacing requirements.

Telecom Line Card Memory High-Speed Test Equipment Buffer

Use Scenario: Real-time buffering of SONET/SDH frame data in OC-192 or 10G Ethernet PHY interfaces.

IC Role / Device Role / Timing Role: Synchronous pipeline stage between framer and MAC layer, absorbing jitter and aligning data bursts.

Use Value: 1.8 V core reduces power vs. 3.3 V QDR-I; HSTL I/O compatible with TI/Analog Devices SerDes receivers; BWS[1:0] enables partial writes without read-modify-write cycles.

Use Scenario: Capturing high-speed digital stimulus/response waveforms in automated test equipment (ATE) pattern generators.

IC Role / Device Role / Timing Role: Burst-access memory staging point for waveform data before serial-to-parallel conversion and DAC feeding.

Use Value: 4-word burst matches typical ATE vector depth; echo clocks simplify timing alignment with pattern generator clocks; JTAG support enables in-system verification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port burst SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1313BV18-250BZCTHigher max frequency (250 MHz vs. 167 MHz); same 1M×18 organization and FBGA-165 packageSupports 900 Mbps DDR bandwidth; requires tighter timing margins and higher power (500 mA vs. 400 mA)Select when system clock budget permits >200 MHz operation and higher bandwidth justifies increased power and layout complexity
AS7C3256B-167JCSingle-port, 32K×8 asynchronous SRAM; no DDR, no echo clocks, no DLL; SOJ-32 packageLower cost, simpler interface, but no concurrent read/write or burst capabilitySelect only for legacy designs requiring pin-compatible replacement with no bandwidth or concurrency requirements

Compared with CY7C1313BV18-250BZCT, the -167BZCT trades peak bandwidth for lower power and relaxed timing margins; compared with AS7C3256B-167JC, it delivers true dual-port concurrency and DDR timing infrastructure essential for modern packet-processing pipelines.

Availability

CY7C1313BV18-167BZCT is available at Aetrix Electronics and suitable for network packet buffering, switch fabric interface, telecom line card memory, and high-speed test equipment requiring stable component supply, long-lifecycle support, and consistent FBGA-165 packaging.

Supply support for CY7C1313BV18-167BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for communications and industrial markets.

This device belongs to Cypress's QDR-II SRAM product line, engineered specifically for ultra-low-latency, concurrent-access memory subsystems in high-speed networking and telecommunications infrastructure.

FAQ

What is the function of the ZQ pin on CY7C1313BV18-167BZCT?

The ZQ pin calibrates output driver impedance to match the system data bus. When connected to a precision resistor to ground, it sets CQ, CQ, and Q[17:0] output impedance to 0.2 × RQ. Alternatively, tying ZQ to VDDQ enables minimum-impedance mode. This calibration ensures signal integrity and reduces reflections on high-speed traces without external termination resistors.

Can CY7C1313BV18-167BZCT operate in single-clock mode?

Yes. In single-clock mode, the device uses K as both input and output clock reference: K drives input registers and Q[17:0] output registers, while C/C and CQ/CQ are unused. This simplifies clock distribution but reduces maximum achievable bandwidth compared to dual-clock mode, where C/C provide independent output timing control and deskewing capability.

How does the 4-word burst architecture reduce system address bus loading?

Each read or write access transfers four consecutive 18-bit words using a single address. The internal address counter increments automatically after each word, so only one address setup is required per burst. This cuts address bus toggling frequency by 75% versus single-word access, lowering EMI, reducing controller overhead, and easing timing closure on shared address buses in multi-SRAM systems.

What is the role of BWS[1:0] in CY7C1313BV18-167BZCT?

BWS[1:0] are active-LOW byte write select signals controlling 9-bit granularity: BWS0 enables writing to D[8:0], and BWS1 enables D[17:9]. When either is deasserted, the corresponding 9-bit byte is ignored during the write burst, preserving existing data in those bits. This eliminates need for read-modify-write cycles when updating partial words-critical for efficient header modification in packet processing.

CY7C1313BV18-167BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1313BV18-167BZCT FAQ

1.How can I place an order for CY7C1313BV18-167BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1313BV18-167BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1313BV18-167BZCT reliable?

The price and inventory of CY7C1313BV18-167BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313BV18-167BZCT is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1313BV18-167BZCT transactions.

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CY7C1313BV18-167BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1313BV18-167BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1313BV18-167BZCT?

For technical support, including CY7C1313BV18-167BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313BV18-167BZCT requirements.

6.How does Aetrix verify that CY7C1313BV18-167BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1313BV18-167BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313BV18-167BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1313BV18-167BZCT?

All CY7C1313BV18-167BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313BV18-167BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1313BV18-167BZCT part is unused and in its original packaging.

Return procedure for CY7C1313BV18-167BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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