Infineon Technologies CY7C1313CV18-250BZI
- Part No.:
- CY7C1313CV18-250BZI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1313CV18-250BZI.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CY7C1313CV18 from Cypress Semiconductor is a 1M × 18-bit, 18-Mbit QDR-II SRAM with separate read/write ports, 250 MHz operation (400 ps clock period), DDR interfaces on both ports enabling 500 MT/s effective data rate, and DLL-enabled 1.5-cycle read latency. It serves as high-bandwidth buffer memory in network packet processors and FPGA-based protocol accelerators requiring concurrent access.
For engineers reviewing the CY7C1313CV18 datasheet, CY7C1313CV18 pinout, CY7C1313CV18 application, or CY7C1313CV18 equivalent, key selection criteria include its 1M×18 configuration, 165-ball FBGA package, dual-clock DDR timing (K/K and C/C), echo clocks (CQ/CQ), and HSTL-18 I/O compatibility for backplane-adjacent memory subsystems.
Technical Context
The CY7C1313CV18 implements QDR-II architecture with fully independent read and write pipelines, each synchronized to dedicated rising-edge-triggered clocks (K/K for inputs, C/C for outputs). Its internal 256K × 18 memory array is accessed via multiplexed 18-bit address bus latched on alternating K-clock edges.
It supports synchronous self-timed writes with byte-level write enables (BWS[1:0]), delivers burst-4 sequential 18-bit words per access, and uses echo clocks CQ/CQ referenced to C/C to compensate for board trace skew - critical for deterministic setup/hold timing at 500 MT/s.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1M × 18-bit organization) |
| Maximum Clock Frequency | 250 MHz - defines 400 ps minimum clock period for timing closure |
| Data Rate | 500 MT/s - achieved via DDR on both read and write ports |
| Read Latency | 1.5 cycles (DLL enabled) or 1 cycle (DLL disabled) - directly impacts pipeline depth in controller design |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - requires dual-rail power delivery |
| Output Interface | HSTL-18 Class I - mandates 1.4 V termination reference and impedance-matched routing |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm) - 0.8 mm ball pitch, RoHS-compliant |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, 0.8 mm ball pitch, JEDEC MO-245 compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; must meet tDS/tDH relative to K |
| Q[17:0] | Synchronous read data output | 18-bit DDR output driven on rising edges of both C and C clocks; valid after tAC |
| K, K | Positive/negative input clocks | Edge-aligned differential pair controlling all write-port and address latching; K only used for timing |
| C, C | Positive/negative output clocks | Differential pair clocking Q[17:0] output registers; enables deskew with CQ/CQ |
| CQ, CQ | Echo clocks | Free-running copies of C/C, phase-aligned to simplify receiver capture in high-speed controllers |
| RPS, WPS | Read/Write Port Select | Active-low enables; sampled on K rising edge to gate port activity and tri-state outputs when deselected |
| BWS[1:0] | Byte Write Select | Two active-low signals selecting which 9-bit byte (D[8:0] or D[17:9]) is written during burst |
| ZQ | Impedance calibration input | Connects to external 240 Ω resistor to GND to tune output driver impedance to 48 Ω (0.2 × RQ) |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Enables true concurrent access - no bus turnaround required, eliminating arbitration delay in full-duplex traffic buffers |
| 4-word burst architecture | Reduces address bus toggling by 75% vs. single-word access - lowers EMI and simplifies controller address generation |
| Delay Lock Loop (DLL) | Aligns internal data paths to eliminate clock-to-output skew; enables 1.5-cycle latency at 250 MHz |
| HSTL-18 compatible I/O | Supports 1.4–1.8 V VDDQ operation with programmable drive strength - matches FPGA transceivers and ASIC I/O standards |
| JTAG 1149.1 test port | Enables boundary-scan testing of interconnects without requiring functional access to memory array |
Applications
| Network Packet Buffer | FPGA-Based Protocol Accelerator |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G line cards where sustained 500 MT/s throughput is required. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency, non-blocking FIFO between MAC and traffic manager logic. Use Value: Concurrent read/write eliminates serialization bottlenecks, enabling full wire-rate processing without packet loss under bursty traffic. |
Use Scenario: Offloading TCP/IP checksum, encryption, or deep packet inspection in reconfigurable compute platforms. IC Role / Device Role / Timing Role: High-speed scratchpad memory interfacing directly with FPGA fabric using native DDR timing. Use Value: Burst-4 transfers reduce controller logic complexity while HSTL-18 signaling ensures signal integrity across 8+ inch PCB traces. |
| Telecom Baseband Processing | High-Speed Test Equipment Memory |
|
Use Scenario: Real-time buffering of IQ samples between ADC/DAC and DSP cores in 5G massive MIMO radio units. IC Role / Device Role / Timing Role: Synchronous pipelined memory providing deterministic 1.5-cycle read latency for time-critical loopback paths. Use Value: DLL stabilization allows consistent timing margin across temperature, avoiding re-timing logic in production firmware. |
Use Scenario: Capturing high-fidelity waveform data at >200 MS/s in automated test systems with pattern generators and digitizers. IC Role / Device Role / Timing Role: Burst-access memory staging raw sample streams before compression or analysis. Use Value: 165-ball FBGA package supports dense layout with controlled-impedance routing to minimize jitter-induced sampling error. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit bus, 10 ns access, LVDS I/O, 256K × 36 density | Lower bandwidth (200 MT/s), requires LVDS termination and differential routing | Select when system uses LVDS signaling and needs wider data path over higher speed |
| ISSI IS61WV102418BLL-10BLI | 1M × 18, 10 ns async access, SSTL-2 I/O, 3.3 V core | No DDR, no DLL, no echo clocks - simpler interface but limited to ~100 MHz effective rate | Select for cost-sensitive, lower-speed control-plane buffers where timing determinism is less critical |
Compared with IDT72T3615L10BG and IS61WV102418BLL-10BLI, the CY7C1313CV18 uniquely delivers 500 MT/s DDR throughput with deterministic 1.5-cycle latency and echo-clock-assisted capture - essential for real-time packet forwarding and baseband processing where timing closure dominates PCB layout effort.
Availability
CY7C1313CV18 is available at Aetrix Electronics and suitable for network packet buffers, FPGA-based protocol accelerators, telecom baseband processing, and high-speed test equipment requiring stable component supply and long-term industrial availability.
Supply support for CY7C1313CV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive systems, with emphasis on signal integrity and timing precision.
The QDR-II SRAM product line targets high-throughput, low-latency memory subsystems in networking and signal processing applications where concurrent read/write access and deterministic timing are mandatory.
FAQ
What is the function of the ZQ pin on CY7C1313CV18?
The ZQ pin calibrates output driver impedance to match the system data bus. When connected to a 240 Ω resistor to ground, it sets CQ, CQ, and Q[17:0] output impedance to 48 Ω (0.2 × RQ). Direct connection to VDDQ enables minimum impedance mode; floating or grounding ZQ is prohibited and causes undefined behavior.
Can CY7C1313CV18 operate without the Delay Lock Loop (DLL)?
Yes - asserting DOFF low disables the DLL, reverting the device to QDR-I timing with 1-cycle read latency and maximum frequency reduced to 167 MHz. This mode sacrifices bandwidth for simplified timing closure in less demanding applications, but all DDR functionality remains active.
How are address inputs handled for read and write operations?
A[17:0] is a single multiplexed address bus used for both read and write ports. Addresses are latched on alternating rising edges of the K clock: even cycles latch read addresses, odd cycles latch write addresses. RPS and WPS independently enable port activity without affecting address capture timing.
What is the purpose of CQ and CQ echo clocks?
CQ and CQ are free-running output clocks synchronized to C and C, respectively. They provide a local timing reference at the memory device's output pins, allowing the receiving controller to align its capture strobes with actual data flight time - critical for maintaining setup/hold margins across varying PCB trace lengths and temperatures.
CY7C1313CV18-250BZI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1313CV18-250BZI FAQ
1.How can I place an order for CY7C1313CV18-250BZI through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1313CV18-250BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1313CV18-250BZI reliable?
The price and inventory of CY7C1313CV18-250BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1313CV18-250BZI is usually 5 days.
3.What payment methods are accepted for CY7C1313CV18-250BZI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1313CV18-250BZI transactions.
Note: Certain payment methods may incur a processing fee.
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CY7C1313CV18-250BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1313CV18-250BZI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1313CV18-250BZI?
For technical support, including CY7C1313CV18-250BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1313CV18-250BZI requirements.
6.How does Aetrix verify that CY7C1313CV18-250BZI is sourced from the original manufacturer or authorized distributors?
All CY7C1313CV18-250BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1313CV18-250BZI meets industry standards.
7.What is the process for return or replacement of CY7C1313CV18-250BZI?
All CY7C1313CV18-250BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1313CV18-250BZI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1313CV18-250BZI part is unused and in its original packaging.
Return procedure for CY7C1313CV18-250BZI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1313CV18-250BZI Tags

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