Infineon Technologies CY7C1314KV18-250BZCT
- Part No.:
- CY7C1314KV18-250BZCT
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1314KV18-250BZCT.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,452
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1314KV18-250BZCT from Cypress Semiconductor is a 512K × 36-bit, 18-Mbit QDR® II SRAM with two-word burst architecture, 250 MHz maximum clock frequency (400 ps cycle time), 1.8 V core supply (VDD = 1.8 V ±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It features separate read/write ports, DDR interfaces on both ports, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.
For engineers reviewing the CY7C1314KV18-250BZCT datasheet, CY7C1314KV18-250BZCT pinout, CY7C1314KV18-250BZCT application, or CY7C1314KV18-250BZCT equivalent, key selection criteria include its 36-bit × 512K organization, 165-ball FBGA package, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and JTAG 1149.1 compliance for boundary scan testability.
Technical Context
The device implements a synchronous pipelined QDR II architecture with physically independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K/K clocks, enabling concurrent read and write transactions without bus turnaround.
It uses dual DDR interfaces: data transfers occur on both rising edges of K/K for writes and C/C for reads, achieving effective 500 Mbps per data line at 250 MHz. The integrated PLL ensures precise data placement, while echo clocks CQ/CQ are phase-aligned to C/C to simplify timing closure in high-speed SerDes and switch fabric designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36-bit (18 Mbit total); supports depth expansion via RPS/WPS and BWS[3:0] |
| Max Clock Frequency | 250 MHz (400 ps period); defines maximum sustained bandwidth of 18 Gbps (36 bits × 250 MHz × 2) |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); impacts pipeline depth in switch ASIC interfaces |
| Supply Voltages | VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); enables interoperability with 1.5 V or 1.8 V logic families |
| Output Drive | HSTL Class I compatible; programmable impedance via ZQ pin (0.2×RQ matching to system bus) |
| Timing Interface | Separate K/K (input) and C/C (output) clock pairs; eliminates skew between controller and memory data paths |
| JTAG Support | IEEE 1149.1 compliant TAP controller; enables production test, boundary scan, and debug visibility |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Sampled on rising edge of K/K; 36-bit parallel input path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edge of C/C; tristated when RPS is deasserted |
| RPS / WPS | Read/Write port select (active LOW) | Enables independent control of read and write ports for concurrent access |
| BWS[3:0] | Byte write select (active LOW) | Controls 4 × 9-bit byte lanes; allows partial-word writes without read-modify-write |
| K / K | Positive/negative input clocks | Capture all synchronous inputs (address, control, data); define write timing reference |
| C / C | Positive/negative output clocks | Source read data timing; used with CQ/CQ for deskewed capture at controller |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-aligned copies of C/C; simplify high-speed source-synchronous capture |
| ZQ | Impedance calibration input | Connects to external resistor to ground (RQ); sets output driver impedance to 0.2×RQ |
| DOFF | Read latency mode control | HIGH → 1.5-cycle latency (QDR II mode); LOW → 1-cycle latency (QDR I compatibility) |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst architecture | Delivers 72 bits per clock cycle (36-bit × 2) - doubles effective bandwidth over single-word SRAMs |
| Separate read/write data paths | Eliminates bus turnaround delay and contention; enables true simultaneous read+write in same cycle |
| Programmable output impedance | ZQ-pin calibration supports 40–60 Ω matching to PCB trace impedance without external termination resistors |
| Configurable read latency | DOFF pin selects between 1-cycle (QDR I backward compatibility) and 1.5-cycle (QDR II optimized throughput) modes |
| Integrated PLL | Ensures <±50 ps jitter margin on C/C and CQ/CQ outputs - critical for >250 MHz system timing closure |
Applications
| High-Speed Packet Buffering | Network Switch Fabric Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches operating at 10+ Gbps line rates. IC Role / Device Role / Timing Role: Dedicated QDR II SRAM serving as dual-ported buffer memory with zero turnaround latency between header lookup (read) and queue management (write). Use Value: Enables full-duplex 18 Gbps sustained bandwidth using 36-bit × 250 MHz interface - matches OC-192/STM-64 and 10GbE MAC throughput requirements. |
Use Scenario: Interfacing with multi-port switch ASICs requiring low-latency, concurrent access to forwarding tables and statistics counters. IC Role / Device Role / Timing Role: Asymmetric memory resource where ASIC's read port fetches next-hop addresses while write port updates counter values in parallel. Use Value: Eliminates arbitration delays inherent in single-port SRAMs; supports deterministic 1-cycle read latency (DOFF = LOW) for critical control-path lookups. |
| Telecom Line Card Buffering | Baseband Processing Memory |
|
Use Scenario: Buffering interleaved voice/data frames in carrier-grade DSLAMs and OLT line cards with strict jitter and latency budgets. IC Role / Device Role / Timing Role: QDR II SRAM acting as ping-pong buffer between framer and DSP subsystems, synchronized to SONET/SDH clock domains. Use Value: Echo clocks CQ/CQ provide deterministic source-synchronous timing alignment - reduces setup/hold margin by ≥120 ps versus free-running clocks. |
Use Scenario: Supporting real-time FFT and channel estimation in LTE/5G baseband units requiring rapid access to coefficient tables and intermediate results. IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfaced directly to dual-core DSP or FPGA fabric with independent AXI read/write masters. Use Value: 36-bit wide interface minimizes burst count per transfer; two-word burst delivers full 72-bit complex sample in one cycle - cuts memory transaction overhead by 50%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar QDR II SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72T3615L10BG | 36-bit × 256K, 10 ns access, 1.8 V core, but no echo clocks or ZQ calibration; uses SSTL-18 I/O | Lacks CQ/CQ timing aids and programmable drive strength - requires tighter board layout control for >200 MHz operation | Select when legacy SSTL-18 infrastructure exists and echo-clock simplification is not required |
| ISSI IS61WV102436B | 36-bit × 256K, 200 MHz max, 1.8 V core, HSTL I/O, but no JTAG or DOFF latency selection | Fixed 1-cycle latency only; no boundary scan support limits test coverage in high-reliability telecom modules | Prefer for cost-sensitive industrial controllers where JTAG and latency flexibility are non-critical |
Compared with IDT72T3615L10BG and IS61WV102436B, CY7C1314KV18-250BZCT provides superior timing robustness via echo clocks and impedance tuning, plus configurability (DOFF) and testability (JTAG) essential for carrier-class switch fabric designs.
Availability
CY7C1314KV18-250BZCT is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom line card buffering, and baseband processing requiring stable component supply across extended product lifecycles.
Supply support for CY7C1314KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.
This device belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking ASICs, switch fabrics, and telecom infrastructure equipment.
FAQ
What is the function of the DOFF pin on CY7C1314KV18-250BZCT?
The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables QDR II mode with 1.5-cycle latency for optimal bandwidth; when LOW, it reverts to QDR I mode with 1-cycle latency for backward compatibility. This setting is sampled synchronously on the rising edge of K and remains active until changed.
How does the ZQ pin affect output drive strength?
The ZQ pin connects to an external resistor (RQ) tied to ground, allowing the device to calibrate its HSTL output drivers to 0.2×RQ impedance. For example, a 200 Ω RQ yields ~40 Ω driver impedance. Direct connection to VDDQ enables minimum impedance mode (~20 Ω), while floating or grounding ZQ is prohibited and may cause undefined behavior.
Can CY7C1314KV18-250BZCT operate with only one clock signal?
Yes - it supports single-clock mode where K and C are tied together (and K and C likewise), eliminating need for separate input/output clock pairs. In this configuration, data is clocked using K/K only, and CQ/CQ are generated relative to K/K. However, dual-clock mode is required to achieve full timing margin and echo-clock benefits at 250 MHz.
What is the purpose of BWS[3:0] signals in write operations?
BWS[3:0] are active-LOW byte write selects that enable partial-word writes without read-modify-write cycles. Each controls a 9-bit lane: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]. Deasserting any BWS prevents corresponding byte from being updated, preserving existing data in those bits - critical for efficient statistics counter updates.
CY7C1314KV18-250BZCT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1314KV18-250BZCT FAQ
1.How can I place an order for CY7C1314KV18-250BZCT through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1314KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1314KV18-250BZCT reliable?
The price and inventory of CY7C1314KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1314KV18-250BZCT is usually 5 days.
3.What payment methods are accepted for CY7C1314KV18-250BZCT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1314KV18-250BZCT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1314KV18-250BZCT?
CY7C1314KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1314KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1314KV18-250BZCT?
For technical support, including CY7C1314KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1314KV18-250BZCT requirements.
6.How does Aetrix verify that CY7C1314KV18-250BZCT is sourced from the original manufacturer or authorized distributors?
All CY7C1314KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1314KV18-250BZCT meets industry standards.
7.What is the process for return or replacement of CY7C1314KV18-250BZCT?
All CY7C1314KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1314KV18-250BZCT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1314KV18-250BZCT part is unused and in its original packaging.
Return procedure for CY7C1314KV18-250BZCT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1314KV18-250BZCT Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…

