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Infineon Technologies CY7C1314KV18-250BZCT

Part No.:
CY7C1314KV18-250BZCT
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1314KV18-250BZCT.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,452

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Product details

Overview

CY7C1314KV18-250BZCT from Cypress Semiconductor is a 512K × 36-bit, 18-Mbit QDR® II SRAM with two-word burst architecture, 250 MHz maximum clock frequency (400 ps cycle time), 1.8 V core supply (VDD = 1.8 V ±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It features separate read/write ports, DDR interfaces on both ports, and echo clocks (CQ/CQ) for high-speed data capture in networking and packet buffering applications.

For engineers reviewing the CY7C1314KV18-250BZCT datasheet, CY7C1314KV18-250BZCT pinout, CY7C1314KV18-250BZCT application, or CY7C1314KV18-250BZCT equivalent, key selection criteria include its 36-bit × 512K organization, 165-ball FBGA package, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, and JTAG 1149.1 compliance for boundary scan testability.

Technical Context

The device implements a synchronous pipelined QDR II architecture with physically independent read and write ports sharing a multiplexed address bus. Address latching occurs on alternate rising edges of K/K clocks, enabling concurrent read and write transactions without bus turnaround.

It uses dual DDR interfaces: data transfers occur on both rising edges of K/K for writes and C/C for reads, achieving effective 500 Mbps per data line at 250 MHz. The integrated PLL ensures precise data placement, while echo clocks CQ/CQ are phase-aligned to C/C to simplify timing closure in high-speed SerDes and switch fabric designs.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 36-bit (18 Mbit total); supports depth expansion via RPS/WPS and BWS[3:0]
Max Clock Frequency 250 MHz (400 ps period); defines maximum sustained bandwidth of 18 Gbps (36 bits × 250 MHz × 2)
Read Latency Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); impacts pipeline depth in switch ASIC interfaces
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O); enables interoperability with 1.5 V or 1.8 V logic families
Output Drive HSTL Class I compatible; programmable impedance via ZQ pin (0.2×RQ matching to system bus)
Timing Interface Separate K/K (input) and C/C (output) clock pairs; eliminates skew between controller and memory data paths
JTAG Support IEEE 1149.1 compliant TAP controller; enables production test, boundary scan, and debug visibility

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs Sampled on rising edge of K/K; 36-bit parallel input path for burst writes
Q[35:0] Synchronous read data outputs Driven on rising edge of C/C; tristated when RPS is deasserted
RPS / WPS Read/Write port select (active LOW) Enables independent control of read and write ports for concurrent access
BWS[3:0] Byte write select (active LOW) Controls 4 × 9-bit byte lanes; allows partial-word writes without read-modify-write
K / K Positive/negative input clocks Capture all synchronous inputs (address, control, data); define write timing reference
C / C Positive/negative output clocks Source read data timing; used with CQ/CQ for deskewed capture at controller
CQ / CQ Echo clocks referenced to C/C Free-running, phase-aligned copies of C/C; simplify high-speed source-synchronous capture
ZQ Impedance calibration input Connects to external resistor to ground (RQ); sets output driver impedance to 0.2×RQ
DOFF Read latency mode control HIGH → 1.5-cycle latency (QDR II mode); LOW → 1-cycle latency (QDR I compatibility)

Key Features

Feature Design Value
Two-word burst architecture Delivers 72 bits per clock cycle (36-bit × 2) - doubles effective bandwidth over single-word SRAMs
Separate read/write data paths Eliminates bus turnaround delay and contention; enables true simultaneous read+write in same cycle
Programmable output impedance ZQ-pin calibration supports 40–60 Ω matching to PCB trace impedance without external termination resistors
Configurable read latency DOFF pin selects between 1-cycle (QDR I backward compatibility) and 1.5-cycle (QDR II optimized throughput) modes
Integrated PLL Ensures <±50 ps jitter margin on C/C and CQ/CQ outputs - critical for >250 MHz system timing closure

Applications

High-Speed Packet Buffering Network Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches operating at 10+ Gbps line rates.

IC Role / Device Role / Timing Role: Dedicated QDR II SRAM serving as dual-ported buffer memory with zero turnaround latency between header lookup (read) and queue management (write).

Use Value: Enables full-duplex 18 Gbps sustained bandwidth using 36-bit × 250 MHz interface - matches OC-192/STM-64 and 10GbE MAC throughput requirements.

Use Scenario: Interfacing with multi-port switch ASICs requiring low-latency, concurrent access to forwarding tables and statistics counters.

IC Role / Device Role / Timing Role: Asymmetric memory resource where ASIC's read port fetches next-hop addresses while write port updates counter values in parallel.

Use Value: Eliminates arbitration delays inherent in single-port SRAMs; supports deterministic 1-cycle read latency (DOFF = LOW) for critical control-path lookups.

Telecom Line Card Buffering Baseband Processing Memory

Use Scenario: Buffering interleaved voice/data frames in carrier-grade DSLAMs and OLT line cards with strict jitter and latency budgets.

IC Role / Device Role / Timing Role: QDR II SRAM acting as ping-pong buffer between framer and DSP subsystems, synchronized to SONET/SDH clock domains.

Use Value: Echo clocks CQ/CQ provide deterministic source-synchronous timing alignment - reduces setup/hold margin by ≥120 ps versus free-running clocks.

Use Scenario: Supporting real-time FFT and channel estimation in LTE/5G baseband units requiring rapid access to coefficient tables and intermediate results.

IC Role / Device Role / Timing Role: High-bandwidth scratchpad memory interfaced directly to dual-core DSP or FPGA fabric with independent AXI read/write masters.

Use Value: 36-bit wide interface minimizes burst count per transfer; two-word burst delivers full 72-bit complex sample in one cycle - cuts memory transaction overhead by 50%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3615L10BG 36-bit × 256K, 10 ns access, 1.8 V core, but no echo clocks or ZQ calibration; uses SSTL-18 I/O Lacks CQ/CQ timing aids and programmable drive strength - requires tighter board layout control for >200 MHz operation Select when legacy SSTL-18 infrastructure exists and echo-clock simplification is not required
ISSI IS61WV102436B 36-bit × 256K, 200 MHz max, 1.8 V core, HSTL I/O, but no JTAG or DOFF latency selection Fixed 1-cycle latency only; no boundary scan support limits test coverage in high-reliability telecom modules Prefer for cost-sensitive industrial controllers where JTAG and latency flexibility are non-critical

Compared with IDT72T3615L10BG and IS61WV102436B, CY7C1314KV18-250BZCT provides superior timing robustness via echo clocks and impedance tuning, plus configurability (DOFF) and testability (JTAG) essential for carrier-class switch fabric designs.

Availability

CY7C1314KV18-250BZCT is available at Aetrix Electronics and suitable for high-speed packet buffering, network switch fabric memory, telecom line card buffering, and baseband processing requiring stable component supply across extended product lifecycles.

Supply support for CY7C1314KV18-250BZCT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

This device belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, low-latency, concurrent-access memory subsystems in networking ASICs, switch fabrics, and telecom infrastructure equipment.

FAQ

What is the function of the DOFF pin on CY7C1314KV18-250BZCT?

The DOFF (Data Output OFFset) pin configures read latency mode: when asserted HIGH, it enables QDR II mode with 1.5-cycle latency for optimal bandwidth; when LOW, it reverts to QDR I mode with 1-cycle latency for backward compatibility. This setting is sampled synchronously on the rising edge of K and remains active until changed.

How does the ZQ pin affect output drive strength?

The ZQ pin connects to an external resistor (RQ) tied to ground, allowing the device to calibrate its HSTL output drivers to 0.2×RQ impedance. For example, a 200 Ω RQ yields ~40 Ω driver impedance. Direct connection to VDDQ enables minimum impedance mode (~20 Ω), while floating or grounding ZQ is prohibited and may cause undefined behavior.

Can CY7C1314KV18-250BZCT operate with only one clock signal?

Yes - it supports single-clock mode where K and C are tied together (and K and C likewise), eliminating need for separate input/output clock pairs. In this configuration, data is clocked using K/K only, and CQ/CQ are generated relative to K/K. However, dual-clock mode is required to achieve full timing margin and echo-clock benefits at 250 MHz.

What is the purpose of BWS[3:0] signals in write operations?

BWS[3:0] are active-LOW byte write selects that enable partial-word writes without read-modify-write cycles. Each controls a 9-bit lane: BWS0→D[8:0], BWS1→D[17:9], BWS2→D[26:18], BWS3→D[35:27]. Deasserting any BWS prevents corresponding byte from being updated, preserving existing data in those bits - critical for efficient statistics counter updates.

CY7C1314KV18-250BZCT Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1314KV18-250BZCT FAQ

1.How can I place an order for CY7C1314KV18-250BZCT through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1314KV18-250BZCT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1314KV18-250BZCT reliable?

The price and inventory of CY7C1314KV18-250BZCT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1314KV18-250BZCT is usually 5 days.

3.What payment methods are accepted for CY7C1314KV18-250BZCT?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1314KV18-250BZCT transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1314KV18-250BZCT?

CY7C1314KV18-250BZCT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1314KV18-250BZCT order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1314KV18-250BZCT?

For technical support, including CY7C1314KV18-250BZCT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1314KV18-250BZCT requirements.

6.How does Aetrix verify that CY7C1314KV18-250BZCT is sourced from the original manufacturer or authorized distributors?

All CY7C1314KV18-250BZCT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1314KV18-250BZCT meets industry standards.

7.What is the process for return or replacement of CY7C1314KV18-250BZCT?

All CY7C1314KV18-250BZCT units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1314KV18-250BZCT, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1314KV18-250BZCT part is unused and in its original packaging.

Return procedure for CY7C1314KV18-250BZCT:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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