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Infineon Technologies CY7C1314KV18-300BZXC

Part No.:
CY7C1314KV18-300BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1314KV18-300BZXC.pdf
Description:
IC SRAM 18MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,217

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Product details

Overview

CY7C1314KV18-300BZXC from Cypress Semiconductor is a 512K × 36-bit, 18-Mbit QDR® II SRAM with separate read/write ports, 300 MHz clock operation (600 Mbps DDR data rate), 1.8 V core supply, and 1.4–1.8 V I/O supply. It delivers concurrent burst reads/writes with 1.5-cycle read latency (DOFF = HIGH) and supports depth expansion via RPS/WPS controls in high-bandwidth networking buffers.

For engineers reviewing the CY7C1314KV18-300BZXC datasheet, CY7C1314KV18-300BZXC pinout, CY7C1314KV18-300BZXC application, or CY7C1314KV18-300BZXC equivalent, key selection criteria include dual-clock DDR timing, echo clock (CQ/CQ) support for source-synchronous capture, HSTL-compatible variable-drive outputs, JTAG 1149.1 test access, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This QDR II SRAM implements fully independent read and write pipelines with dedicated address latching on alternating K/K edges, enabling true concurrent access without bus turnaround. Its two-word burst architecture transfers 72 bits per cycle (36-bit × 2) on both ports, synchronized to rising edges of K/K (write) and C/C (read).

The device integrates an internal PLL for precise data placement, echo clocks (CQ/CQ) referenced to C/C for deskewed data capture, and programmable output impedance via ZQ pin tied to external resistor or VDDQ. DOFF pin selects between 1.5-cycle (HIGH) and 1-cycle (LOW) read latency modes, matching QDR I behavior when needed.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (512K × 36 organization)
Max Clock Frequency 300 MHz - enables 600 Mbps DDR throughput per port
Read Latency 1.5 cycles (DOFF = HIGH) or 1 cycle (DOFF = LOW) - configurable for system timing alignment
Core Supply Voltage 1.8 V ±0.1 V - fixed low-voltage core for power-efficient high-speed operation
I/O Supply Range 1.4 V to 1.8 V - supports 1.5 V or 1.8 V HSTL interfaces
Package 165-ball FBGA (13 × 15 × 1.4 mm) - RoHS-compliant, thermal-performance-optimized
Output Drive Variable-drive HSTL - impedance programmable via ZQ pin for signal integrity tuning

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, Pb-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Write Data Input 36-bit synchronous input sampled on rising edge of K/K; supports byte-write via BWS[3:0]
Q[35:0] Read Data Output 36-bit synchronous output driven on rising edge of C/C; tristated when RPS inactive
RPS Read Port Select Active-low control sampled on K rising edge; initiates read burst and enables Q outputs
WPS Write Port Select Active-low control sampled on K rising edge; enables D inputs and write transaction
BWS[3:0] Byte Write Select Four active-low signals controlling 9-bit byte groups; allows partial-word writes without read-modify-write
C, C Read Clock Inputs Differential pair for output data timing; used with CQ/CQ for source-synchronous capture
K, K Write/Address Clock Inputs Differential pair for address/data capture; all synchronous inputs referenced to K rising edge
CQ, CQ Echo Clock Outputs Free-running clocks synchronized to C/C; enable controller to align sampling windows with flight time
ZQ Impedance Calibration Input Connects to external resistor to ground (sets 0.2×RQ output impedance) or to VDDQ (min impedance mode)
DOFF Read Latency Mode HIGH → 1.5-cycle latency; LOW → 1-cycle latency (QDR I compatibility mode)

Key Features

Feature Design Value
Separate Read/Write Ports Eliminates bus turnaround overhead and data contention in full-duplex memory systems
Two-Word Burst Architecture Delivers 72 bits per clock cycle (36-bit × 2) on each port-doubles effective bandwidth vs single-word SRAM
Source-Synchronous Echo Clocks (CQ/CQ) Enables deterministic, flight-time-compensated data capture at >600 Mbps without complex trace length matching
JTAG 1149.1 Test Access Port Supports boundary scan testing and in-system diagnostics without additional test fixtures
Programmable Output Impedance ZQ pin allows real-time tuning of Q[35:0] and CQ/CQ drive strength to match PCB trace impedance (typically 50 Ω)

Applications

Packet Buffer in 10G Ethernet Switch ASIC Line Card Memory for Optical Transport (OTN)

Use Scenario: Stores ingress/egress packet headers and metadata in multi-port switch fabric with strict latency budgets.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as non-blocking buffer between ingress parser and egress scheduler, synchronized to 300 MHz system clock.

Use Value: Concurrent read/write eliminates arbitration delay; 1.5-cycle latency ensures predictable header forwarding within 5 ns jitter window.

Use Scenario: Buffers OTU2/OTU3 frame payloads across multiple line cards in DWDM transport equipment.

IC Role / Device Role / Timing Role: High-reliability burst memory interfacing with SerDes PHYs and FEC engines using source-synchronous CQ/CQ timing.

Use Value: Echo clocks compensate for interposer skew; HSTL outputs maintain signal integrity over 10+ cm backplane traces.

Baseband Processing Memory in 4G/LTE BTS Real-Time Video Frame Buffer for Broadcast Encoder

Use Scenario: Holds uplink/downlink channel estimation coefficients and FFT buffers in multi-carrier LTE baseband processing.

IC Role / Device Role / Timing Role: Low-latency memory co-located with DSP cores; operates in QDR I mode (DOFF = LOW) for 1-cycle deterministic access.

Use Value: 1-cycle latency meets tight 3.67 μs TTI deadline; 1.8 V core reduces thermal load in dense RF card layouts.

Use Scenario: Stores uncompressed 1080p60 YUV422 frames during real-time encoding pipeline with motion estimation and compression.

IC Role / Device Role / Timing Role: Dual-port frame buffer allowing simultaneous write (sensor interface) and read (encoder engine) at 148.5 MHz pixel clock.

Use Value: 512K × 36 capacity holds two full frames; burst transfers reduce memory controller overhead by 50% vs single-word access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar QDR II SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT72T3652L5PF 36-bit × 512K, 250 MHz max, 2.5 V core, no echo clocks, LVDS I/O Requires external clock forwarding; higher voltage increases power and limits integration density Choose when legacy 2.5 V systems or LVDS signaling are mandatory; avoid for new 1.8 V designs
ISSI IS61WV102436B 36-bit × 1M, 166 MHz, 3.3 V core, single-port, no burst or DDR Lacks concurrent access and burst capability; requires external arbitration logic Only suitable for cost-sensitive, low-bandwidth applications where latency and concurrency are not critical

Compared with IDT72T3652L5PF and IS61WV102436B, CY7C1314KV18-300BZXC provides superior bandwidth (600 Mbps vs ≤500 Mbps), lower power (1.8 V core), and built-in timing aids (CQ/CQ, ZQ), making it optimal for next-generation telecom and video infrastructure requiring deterministic low-latency memory access.

Availability

CY7C1314KV18-300BZXC is available at Aetrix Electronics and suitable for 10G Ethernet switching, optical transport line cards, LTE baseband processing, and broadcast video encoding requiring stable component supply, long-lifecycle support, and guaranteed FBGA-165 sourcing.

Supply support for CY7C1314KV18-300BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

CY7C1314KV18 belongs to the QDR® II SRAM product line, engineered specifically for full-duplex, high-throughput buffering in network processors, packet switches, and baseband ICs where deterministic latency and concurrent access are mandatory.

FAQ

What is the function of the DOFF pin on CY7C1314KV18-300BZXC?

The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, the device operates in standard QDR II mode with 1.5-cycle read latency; when LOW, it reverts to QDR I timing with 1-cycle latency. This allows backward compatibility with existing QDR I controllers while retaining QDR II burst and dual-port advantages.

How does the ZQ pin affect output drive strength?

The ZQ pin sets output impedance for Q[35:0], CQ, and CQ signals. When connected to a resistor RQ to ground, outputs are calibrated to 0.2 × RQ (e.g., 50 Ω trace → 10 Ω driver). Connecting ZQ directly to VDDQ enables minimum impedance mode (~7 Ω), useful for short-trace, low-skew layouts. ZQ must never be left floating or tied to GND.

Can CY7C1314KV18-300BZXC operate with only one clock domain?

Yes - the device supports single-clock mode where K and C are tied together (and K and C tied together), eliminating need for separate clock pairs. In this configuration, data is clocked by K/K for both read and write, and echo clocks CQ/CQ derive from K/K. Timing margins tighten, but system clock tree simplification is achieved.

What is the purpose of BWS[3:0] signals in write operations?

BWS[3:0] are active-low byte write enables that allow selective updating of 9-bit segments within the 36-bit word. BWS0 controls D[8:0], BWS1 controls D[17:9], BWS2 controls D[26:18], and BWS3 controls D[35:27]. Deasserting any BWS prevents corresponding byte from being written, preserving prior data without requiring read-modify-write cycles.

CY7C1314KV18-300BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
300 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1314KV18-300BZXC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1314KV18-300BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1314KV18-300BZXC reliable?

The price and inventory of CY7C1314KV18-300BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1314KV18-300BZXC is usually 5 days.

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4.How is shipping managed for CY7C1314KV18-300BZXC?

CY7C1314KV18-300BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1314KV18-300BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1314KV18-300BZXC?

For technical support, including CY7C1314KV18-300BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1314KV18-300BZXC requirements.

6.How does Aetrix verify that CY7C1314KV18-300BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1314KV18-300BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1314KV18-300BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1314KV18-300BZXC?

All CY7C1314KV18-300BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1314KV18-300BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1314KV18-300BZXC part is unused and in its original packaging.

Return procedure for CY7C1314KV18-300BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1314KV18-300BZXC Tags

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