Infineon Technologies CY7C1315BV18-167BZC
- Part No.:
- CY7C1315BV18-167BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1315BV18-167BZC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,607
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Product details
Overview
CY7C1315BV18 from Cypress Semiconductor is a 18-Mbit QDR-II SRAM with 512K × 36 organization, 167 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports, DDR interfaces on both ports, and 4-word burst transfers-enabling high-bandwidth buffering in packet-forwarding engines and network line cards.
For engineers reviewing the CY7C1315BV18 datasheet, CY7C1315BV18 pinout, CY7C1315BV18 application, or CY7C1315BV18 equivalent, key selection criteria include its 36-bit wide synchronous interface, echo clock support (CQ/CQ) for timing margin recovery, JTAG 1149.1 test access, and 165-ball FBGA package with impedance-matching ZQ pin.
Technical Context
The device uses QDR-II architecture with fully independent read and write ports sharing a multiplexed address bus. Read and write operations are initiated on rising edges of K/K clocks, while output data is synchronized to C/C clocks-enabling precise DDR timing without bus turnaround.
Each access delivers four sequential 36-bit words at 600 MT/s effective data rate (300 MHz clock × 2 transitions). Internal DLL ensures accurate data placement, and variable-drive HSTL outputs support impedance-controlled routing in high-speed backplanes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 512K × 36 = 18 Mbit; supports 36-bit parallel data path for high-throughput buffering |
| Max Operating Frequency | 167 MHz; defines maximum sustained clock rate for reliable pipelined operation |
| Data Rate (DDR) | 334 MT/s per port; enables 12.0 Gb/s aggregate bandwidth (36 bits × 334 MHz) |
| Core Supply Voltage | VDD = 1.8 V ± 0.1 V; tight tolerance required for stable internal timing and low-power operation |
| I/O Supply Range | VDDQ = 1.4 V to 1.8 V; allows compatibility with multiple HSTL-18 and SSTL-18 logic families |
| Package | 165-ball FBGA (13 × 15 × 1.4 mm); provides 0.8 mm ball pitch for high-density PCB routing |
| ZQ Pin Function | Impedance calibration input; tunes output driver strength to match 50 Ω system trace impedance |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant lead-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[35:0] | Synchronous write data inputs | Sampled on rising edge of K/K; 36-bit parallel data path for burst writes |
| Q[35:0] | Synchronous read data outputs | Driven on rising edges of C/C; tri-stated when RPS is deasserted |
| RPS | Read port select (active LOW) | Initiates 4-word burst read; sampled on rising edge of K |
| WPS | Write port select (active LOW) | Enables write operation; sampled on rising edge of K |
| BWS[3:0] | Byte write selects (active LOW) | Selects 9-bit bytes for partial writes; BWS0–BWS3 control D[8:0] through D[35:27] |
| A[16:0] | Multiplexed address inputs | 17-bit address bus shared by read/write ports; latched on K rising edge |
| C, C | Output data clocks | Dual-phase clocks for deskewing read data across PCB traces |
| CQ, CQ | Echo clocks | Free-running copies of C/C; simplify source-synchronous capture at controller |
| ZQ | Impedance calibration reference | Connects to external 240 Ω resistor to ground to calibrate 50 Ω output drivers |
| K, K | Input clocks | Rising edges latch all synchronous inputs (address, control, data); K only used in single-clock mode |
| TCK, TMS, TDI, TDO | JTAG boundary-scan interface | IEEE 1149.1 compliant for production test and debug |
Key Features
| Feature | Design Value |
|---|---|
| Separate read/write ports | Eliminates data bus turnaround delay; enables concurrent read+write in same cycle |
| 4-word burst architecture | Reduces address bus toggling frequency by 4× versus single-word access |
| Double Data Rate (DDR) I/O | Delivers 600 MT/s effective throughput per port using 300 MHz clock |
| Delay Lock Loop (DLL) | Aligns internal data paths to minimize setup/hold violations at 167 MHz operation |
| HSTL-compatible variable drive | Adjustable output strength via ZQ calibration ensures signal integrity on 50 Ω transmission lines |
| JTAG 1149.1 test access | Enables boundary-scan testing without additional test fixtures or probe points |
Applications
| Network Packet Buffering | High-Speed Test Equipment Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency buffer between ingress parser and egress scheduler, synchronized to 167 MHz system clock. Use Value: 36-bit width matches typical packet header bus; 4-word burst reduces address bus loading; echo clocks enable reliable capture at 600 MT/s. |
Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) with >200 MS/s sampling. IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA-based acquisition logic using source-synchronous C/C and CQ/CQ. Use Value: Concurrent read/write eliminates FIFO arbitration overhead; ZQ-calibrated outputs maintain signal integrity on long PCB traces to ADC/DAC interfaces. |
| Telecom Line Card Buffering | Real-Time Video Frame Store |
|
Use Scenario: Temporary storage of ATM or SONET cell payloads in OC-192 line interface cards. IC Role / Device Role / Timing Role: Synchronous pipeline stage between framer and switch fabric, operating at 167 MHz with deterministic 4-cycle latency. Use Value: 18-Mbit capacity holds ~500 full ATM cells; BWS[3:0] enables byte-granular updates during cell header modification. |
Use Scenario: Inter-frame buffering in broadcast-grade video processing systems requiring sub-microsecond access latency. IC Role / Device Role / Timing Role: Dual-port frame store allowing simultaneous write of incoming 1080p60 YUV422 stream and read of processed frame for display engine. Use Value: 36-bit bus width accommodates two 16-bit pixels per transfer; DLL ensures jitter-free pixel clock alignment across multiple devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1315BV18-200BZC | Higher max frequency (200 MHz vs. 167 MHz); identical pinout and functionality | Supports tighter timing budgets in next-gen packet processors; requires higher-speed PCB layout | Select when system clock exceeds 167 MHz and board stackup supports 200 MHz signaling |
| AS7C331024B-167BIN | Single-port SSRAM (not QDR-II); 512K × 36, 167 MHz, 3.3 V core; no echo clocks or DDR | Lacks concurrent read/write capability; requires external arbitration logic for bidirectional flow | Choose only if cost sensitivity outweighs bandwidth requirements and system can tolerate bus turnaround delays |
Compared with CY7C1315BV18-200BZC, this -167BZC variant trades peak speed for relaxed timing margins and lower power; versus AS7C331024B-167BIN, it delivers true concurrent access and source-synchronous timing-critical for deterministic real-time buffering.
Availability
CY7C1315BV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card design, high-speed test equipment development, and real-time video frame storage requiring stable component supply and long-term lifecycle support.
Supply support for CY7C1315BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.
This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where concurrent read/write and precise timing control are mandatory.
FAQ
What is the minimum VDDQ voltage supported for CY7C1315BV18?
The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed per datasheet specifications; 1.4 V enables compatibility with HSTL Class I receivers while maintaining sufficient noise margin at 167 MHz.
Can CY7C1315BV18 operate in single-clock mode?
Yes. When only K is driven and C/C are tied to K/K respectively, the device operates in single-clock mode. In this configuration, Q[35:0] outputs are timed to K/K edges, and CQ/CQ become echoes of K/K instead of C/C.
How does the ZQ pin affect output driver impedance?
ZQ connects to an external 240 Ω resistor to ground, enabling internal circuitry to calibrate output drivers to approximately 50 Ω. This matches standard PCB trace impedance and minimizes reflections on 36-bit data buses running at 600 MT/s.
Is JTAG boundary-scan functional during normal SRAM operation?
Yes. The IEEE 1149.1 TAP controller operates independently of memory functions. TCK/TMS/TDI/TDO pins remain active and controllable even while read/write ports are active, enabling in-system test without halting data flow.
CY7C1315BV18-167BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1315BV18-167BZC FAQ
1.How can I place an order for CY7C1315BV18-167BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1315BV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1315BV18-167BZC reliable?
The price and inventory of CY7C1315BV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1315BV18-167BZC is usually 5 days.
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Once your CY7C1315BV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1315BV18-167BZC?
For technical support, including CY7C1315BV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1315BV18-167BZC requirements.
6.How does Aetrix verify that CY7C1315BV18-167BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1315BV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1315BV18-167BZC meets industry standards.
7.What is the process for return or replacement of CY7C1315BV18-167BZC?
All CY7C1315BV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1315BV18-167BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1315BV18-167BZC part is unused and in its original packaging.
Return procedure for CY7C1315BV18-167BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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