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Infineon Technologies CY7C1315BV18-167BZC

Part No.:
CY7C1315BV18-167BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1315BV18-167BZC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,607

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Product details

Overview

CY7C1315BV18 from Cypress Semiconductor is a 18-Mbit QDR-II SRAM with 512K × 36 organization, 167 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports, DDR interfaces on both ports, and 4-word burst transfers-enabling high-bandwidth buffering in packet-forwarding engines and network line cards.

For engineers reviewing the CY7C1315BV18 datasheet, CY7C1315BV18 pinout, CY7C1315BV18 application, or CY7C1315BV18 equivalent, key selection criteria include its 36-bit wide synchronous interface, echo clock support (CQ/CQ) for timing margin recovery, JTAG 1149.1 test access, and 165-ball FBGA package with impedance-matching ZQ pin.

Technical Context

The device uses QDR-II architecture with fully independent read and write ports sharing a multiplexed address bus. Read and write operations are initiated on rising edges of K/K clocks, while output data is synchronized to C/C clocks-enabling precise DDR timing without bus turnaround.

Each access delivers four sequential 36-bit words at 600 MT/s effective data rate (300 MHz clock × 2 transitions). Internal DLL ensures accurate data placement, and variable-drive HSTL outputs support impedance-controlled routing in high-speed backplanes.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 36 = 18 Mbit; supports 36-bit parallel data path for high-throughput buffering
Max Operating Frequency 167 MHz; defines maximum sustained clock rate for reliable pipelined operation
Data Rate (DDR) 334 MT/s per port; enables 12.0 Gb/s aggregate bandwidth (36 bits × 334 MHz)
Core Supply Voltage VDD = 1.8 V ± 0.1 V; tight tolerance required for stable internal timing and low-power operation
I/O Supply Range VDDQ = 1.4 V to 1.8 V; allows compatibility with multiple HSTL-18 and SSTL-18 logic families
Package 165-ball FBGA (13 × 15 × 1.4 mm); provides 0.8 mm ball pitch for high-density PCB routing
ZQ Pin Function Impedance calibration input; tunes output driver strength to match 50 Ω system trace impedance

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, 0.8 mm ball pitch, RoHS-compliant lead-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data inputs Sampled on rising edge of K/K; 36-bit parallel data path for burst writes
Q[35:0] Synchronous read data outputs Driven on rising edges of C/C; tri-stated when RPS is deasserted
RPS Read port select (active LOW) Initiates 4-word burst read; sampled on rising edge of K
WPS Write port select (active LOW) Enables write operation; sampled on rising edge of K
BWS[3:0] Byte write selects (active LOW) Selects 9-bit bytes for partial writes; BWS0–BWS3 control D[8:0] through D[35:27]
A[16:0] Multiplexed address inputs 17-bit address bus shared by read/write ports; latched on K rising edge
C, C Output data clocks Dual-phase clocks for deskewing read data across PCB traces
CQ, CQ Echo clocks Free-running copies of C/C; simplify source-synchronous capture at controller
ZQ Impedance calibration reference Connects to external 240 Ω resistor to ground to calibrate 50 Ω output drivers
K, K Input clocks Rising edges latch all synchronous inputs (address, control, data); K only used in single-clock mode
TCK, TMS, TDI, TDO JTAG boundary-scan interface IEEE 1149.1 compliant for production test and debug

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround delay; enables concurrent read+write in same cycle
4-word burst architecture Reduces address bus toggling frequency by 4× versus single-word access
Double Data Rate (DDR) I/O Delivers 600 MT/s effective throughput per port using 300 MHz clock
Delay Lock Loop (DLL) Aligns internal data paths to minimize setup/hold violations at 167 MHz operation
HSTL-compatible variable drive Adjustable output strength via ZQ calibration ensures signal integrity on 50 Ω transmission lines
JTAG 1149.1 test access Enables boundary-scan testing without additional test fixtures or probe points

Applications

Network Packet Buffering High-Speed Test Equipment Memory

Use Scenario: Storing ingress/egress packet headers and payloads in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-latency buffer between ingress parser and egress scheduler, synchronized to 167 MHz system clock.

Use Value: 36-bit width matches typical packet header bus; 4-word burst reduces address bus loading; echo clocks enable reliable capture at 600 MT/s.

Use Scenario: Capturing high-speed digital waveforms in automated test equipment (ATE) with >200 MS/s sampling.

IC Role / Device Role / Timing Role: High-bandwidth memory buffer interfacing directly to FPGA-based acquisition logic using source-synchronous C/C and CQ/CQ.

Use Value: Concurrent read/write eliminates FIFO arbitration overhead; ZQ-calibrated outputs maintain signal integrity on long PCB traces to ADC/DAC interfaces.

Telecom Line Card Buffering Real-Time Video Frame Store

Use Scenario: Temporary storage of ATM or SONET cell payloads in OC-192 line interface cards.

IC Role / Device Role / Timing Role: Synchronous pipeline stage between framer and switch fabric, operating at 167 MHz with deterministic 4-cycle latency.

Use Value: 18-Mbit capacity holds ~500 full ATM cells; BWS[3:0] enables byte-granular updates during cell header modification.

Use Scenario: Inter-frame buffering in broadcast-grade video processing systems requiring sub-microsecond access latency.

IC Role / Device Role / Timing Role: Dual-port frame store allowing simultaneous write of incoming 1080p60 YUV422 stream and read of processed frame for display engine.

Use Value: 36-bit bus width accommodates two 16-bit pixels per transfer; DLL ensures jitter-free pixel clock alignment across multiple devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1315BV18-200BZC Higher max frequency (200 MHz vs. 167 MHz); identical pinout and functionality Supports tighter timing budgets in next-gen packet processors; requires higher-speed PCB layout Select when system clock exceeds 167 MHz and board stackup supports 200 MHz signaling
AS7C331024B-167BIN Single-port SSRAM (not QDR-II); 512K × 36, 167 MHz, 3.3 V core; no echo clocks or DDR Lacks concurrent read/write capability; requires external arbitration logic for bidirectional flow Choose only if cost sensitivity outweighs bandwidth requirements and system can tolerate bus turnaround delays

Compared with CY7C1315BV18-200BZC, this -167BZC variant trades peak speed for relaxed timing margins and lower power; versus AS7C331024B-167BIN, it delivers true concurrent access and source-synchronous timing-critical for deterministic real-time buffering.

Availability

CY7C1315BV18 is available at Aetrix Electronics and suitable for network packet buffering, telecom line card design, high-speed test equipment development, and real-time video frame storage requiring stable component supply and long-term lifecycle support.

Supply support for CY7C1315BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications.

This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where concurrent read/write and precise timing control are mandatory.

FAQ

What is the minimum VDDQ voltage supported for CY7C1315BV18?

The device supports VDDQ from 1.4 V to 1.8 V. Operation below 1.4 V is not guaranteed per datasheet specifications; 1.4 V enables compatibility with HSTL Class I receivers while maintaining sufficient noise margin at 167 MHz.

Can CY7C1315BV18 operate in single-clock mode?

Yes. When only K is driven and C/C are tied to K/K respectively, the device operates in single-clock mode. In this configuration, Q[35:0] outputs are timed to K/K edges, and CQ/CQ become echoes of K/K instead of C/C.

How does the ZQ pin affect output driver impedance?

ZQ connects to an external 240 Ω resistor to ground, enabling internal circuitry to calibrate output drivers to approximately 50 Ω. This matches standard PCB trace impedance and minimizes reflections on 36-bit data buses running at 600 MT/s.

Is JTAG boundary-scan functional during normal SRAM operation?

Yes. The IEEE 1149.1 TAP controller operates independently of memory functions. TCK/TMS/TDI/TDO pins remain active and controllable even while read/write ports are active, enabling in-system test without halting data flow.

CY7C1315BV18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1315BV18-167BZC FAQ

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Please submit a Request for Quotation (RFQ) for CY7C1315BV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1315BV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1315BV18-167BZC is usually 5 days.

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5.How can I obtain technical support or documentation for CY7C1315BV18-167BZC?

For technical support, including CY7C1315BV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1315BV18-167BZC requirements.

6.How does Aetrix verify that CY7C1315BV18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1315BV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1315BV18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1315BV18-167BZC?

All CY7C1315BV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1315BV18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1315BV18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1315BV18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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