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Infineon Technologies CY7C1315BV18-200BZXC

Part No.:
CY7C1315BV18-200BZXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1315BV18-200BZXC.pdf
Description:
IC SRAM 18MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,958

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Product details

Overview

CY7C1315BV18-200BZXC from Cypress Semiconductor is a 18-Mbit QDR-II SRAM with 512K × 36 organization, 200 MHz maximum operating frequency, 1.8 V core supply (±0.1 V), and 1.4–1.8 V I/O supply (VDDQ). It implements separate read/write ports with DDR interfaces on both, delivering 600 MT/s effective data rate using echo clocks CQ/CQ for timing-critical high-speed capture in packet buffering and network switching applications.

For engineers reviewing the CY7C1315BV18-200BZXC datasheet, CY7C1315BV18-200BZXC pinout, CY7C1315BV18-200BZXC application, or CY7C1315BV18-200BZXC equivalent, key selection criteria include burst depth (4-word), byte write select support (BWS[3:0]), FBGA-165 package compatibility, DLL-assisted data placement, and JTAG 1149.1 test access for production validation.

Technical Context

The device uses synchronous pipelined architecture with independent read and write ports sharing a multiplexed 17-bit address bus (A[16:0]). Read and write operations are initiated on rising edges of K/K clocks, while output data is clocked by C/C - enabling precise deskew control across multi-device memory subsystems.

Each access delivers four sequential 36-bit words via DDR interface, achieving full data coherency without bus turnaround. Internal delay lock loop (DLL) aligns echo clocks CQ/CQ to output clocks, minimizing setup/hold violations at 600 MT/s. Write operations use on-chip self-timed circuitry and support granular byte-level writes via BWS[3:0].

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (512K × 36 configuration)
Max Clock Frequency 200 MHz - defines maximum sustained transaction rate for burst reads/writes
Data Rate 600 MT/s - achieved via DDR on both read and write ports using K/K and C/C clocks
Supply Voltages VDD = 1.8 V ±0.1 V (core); VDDQ = 1.4–1.8 V (I/O) - enables low-power operation with HSTL-compatible drive strength
Burst Length 4-word - reduces address bus toggling frequency by 75% versus single-word access
Write Select Granularity BWS[3:0] - enables independent 9-bit byte masking per write cycle, preserving unselected data
Package 165-ball FBGA (13 × 15 × 1.4 mm) - supports high-density PCB layout with controlled impedance routing

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant lead-free option available.

Pin/Terminal Circuit Role Design Meaning
D[35:0] Synchronous write data input 36-bit parallel data sampled on rising edge of K/K; ignored when WPS deasserted
Q[35:0] Synchronous read data output 36-bit parallel data driven on rising edges of C/C; tri-stated when RPS deasserted
RPS Read port select (active LOW) Enables read burst initiation; output drivers auto-tri-state after final C edge when deasserted
WPS Write port select (active LOW) Enables write burst; D[35:0] ignored when deasserted
BWS[3:0] Byte write select (active LOW) Four independent 9-bit write masks; each controls one 9-bit segment of D[35:0]
A[16:0] Multiplexed address input 17-bit address latched on K rising edge for both read and write port access
K, K Positive/negative input clocks Rising edges sample all synchronous inputs (RPS, WPS, BWS, A, D); define internal timing reference
C, C Positive/negative output clocks Rising edges clock Q[35:0] and CQ/CQ; used for board-level flight-time deskew
CQ, CQ Echo clocks Free-running outputs synchronized to C/C; simplify source-synchronous capture in FPGA/ASIC receivers
ZQ Output impedance calibration Connects to external resistor to ground to tune Q[35:0]/CQ/CQ drive strength to 0.2×RQ

Key Features

Feature Design Value
Separate read/write ports Eliminates data bus turnaround overhead and contention, enabling true concurrent access in full-duplex systems
4-word burst architecture Reduces required address bus frequency by factor of 4, lowering routing complexity and EMI in high-speed designs
DDR interfaces on both ports Delivers 600 MT/s throughput at 200 MHz clock, doubling bandwidth versus SDR without increasing clock frequency
Delay Lock Loop (DLL) Aligns echo clocks CQ/CQ to output clocks C/C within ±50 ps, ensuring deterministic data capture at 600 MT/s
JTAG 1149.1 test access Enables boundary-scan testing and in-system debug without requiring additional test pads or probes
Variable-drive HSTL outputs Supports programmable drive strength via ZQ calibration, matching trace impedance across varying PCB stackups

Applications

Network Packet Buffering High-Speed Switch Fabric Memory

Use Scenario: Storing ingress/egress packet headers and payload fragments in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as shared buffer between line-card ASICs and switch fabric controllers.

Use Value: Concurrent read/write eliminates arbitration latency; 4-word burst matches typical packet header size, reducing memory cycles per packet.

Use Scenario: Interfacing between traffic manager and scheduler in carrier-grade routers handling OC-192/STM-64 line rates.

IC Role / Device Role / Timing Role: High-bandwidth memory for temporary queue state storage with sub-ns timing margin requirements.

Use Value: DLL-aligned CQ/CQ clocks enable reliable 600 MT/s capture in FPGA-based schedulers without custom PLL tuning.

Telecom Baseband Processing Test Equipment Pattern Memory

Use Scenario: Holding interleaved I/Q samples during real-time channel estimation in 4G/LTE baseband units.

IC Role / Device Role / Timing Role: Low-latency dual-port memory bridging ADC/DAC interfaces and DSP cores.

Use Value: Independent RPS/WPS allows simultaneous sample ingestion and coefficient readout, sustaining 200+ MSPS aggregate throughput.

Use Scenario: Storing stimulus/response patterns in automated test equipment for high-pin-count SoC validation.

IC Role / Device Role / Timing Role: Deterministic-access memory for pattern sequencer engines driving parallel pin electronics.

Use Value: Byte-write select (BWS[3:0]) enables partial updates to 36-bit vectors without disturbing adjacent test data, improving pattern edit efficiency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1315BV18-250BZXC 250 MHz max frequency (vs. 200 MHz); identical pinout, timing, and feature set Requires tighter PCB layout control and higher-power supply stability; suitable only where 25% bandwidth uplift is mandatory Select when system clock domain supports >200 MHz and thermal budget permits higher IDD
AS7C331024B-200BIN Single-port SSRAM (not QDR-II); 200 MHz, 32M × 36 organization; no echo clocks or DLL Lacks concurrent read/write capability; requires external arbitration logic and bus turnaround management Consider only for cost-sensitive, non-concurrent applications where latency tolerance exceeds 10 ns

Compared with CY7C1315BV18-250BZXC, the -200BZXC trades 50 MHz bandwidth for lower power and relaxed signal integrity margins; versus AS7C331024B-200BIN, it delivers true dual-port concurrency and source-synchronous timing - critical for deterministic packet processing.

Availability

CY7C1315BV18-200BZXC is available at Aetrix Electronics and suitable for network packet buffering, high-speed switch fabric memory, telecom baseband processing, and test equipment pattern memory requiring stable component supply and long-term industrial availability.

Supply support for CY7C1315BV18-200BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with headquarters in San Jose, CA.

This device belongs to the QDR-II SRAM product line, engineered specifically for deterministic, low-latency, full-duplex memory access in packet-switched infrastructure and real-time signal processing systems.

FAQ

What is the function of the ZQ pin on CY7C1315BV18-200BZXC?

The ZQ pin calibrates output driver impedance for Q[35:0], CQ, and CQ signals. When connected to a precision resistor to ground (RQ), it sets output impedance to 0.2 × RQ. Direct connection to VDDQ enables minimum-impedance mode. This ensures consistent signal integrity across varying PCB trace impedances without external termination resistors.

Can CY7C1315BV18-200BZXC operate in single-clock mode?

Yes - the device supports single-clock mode where K and C are tied together, and K and C are tied together. In this configuration, all data transfers use K/K as both input and output timing reference. Echo clocks CQ/CQ remain functional and synchronized to K/K, preserving source-synchronous capture capability without requiring separate C/C routing.

How does the 4-word burst architecture reduce system design complexity?

The 4-word burst reduces address bus toggling frequency by 75% compared to single-word access, cutting routing layers, trace length, and crosstalk risk. It also halves the number of address decode cycles needed per data block, simplifying controller logic and reducing gate count in FPGA-based memory managers interfacing to this SRAM.

What happens to Q[35:0] outputs when RPS is deasserted during an active read burst?

When RPS is deasserted mid-burst, the current read operation completes normally, and Q[35:0] continues driving valid data until the final word of the 4-word sequence is output. On the next rising edge of C after completion, all Q[35:0] pins automatically enter high-impedance (tri-state) mode, preventing bus contention without requiring external control logic.

CY7C1315BV18-200BZXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, QDR II
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1315BV18-200BZXC FAQ

1.How can I place an order for CY7C1315BV18-200BZXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1315BV18-200BZXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1315BV18-200BZXC reliable?

The price and inventory of CY7C1315BV18-200BZXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1315BV18-200BZXC is usually 5 days.

3.What payment methods are accepted for CY7C1315BV18-200BZXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1315BV18-200BZXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CY7C1315BV18-200BZXC?

CY7C1315BV18-200BZXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1315BV18-200BZXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1315BV18-200BZXC?

For technical support, including CY7C1315BV18-200BZXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1315BV18-200BZXC requirements.

6.How does Aetrix verify that CY7C1315BV18-200BZXC is sourced from the original manufacturer or authorized distributors?

All CY7C1315BV18-200BZXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1315BV18-200BZXC meets industry standards.

7.What is the process for return or replacement of CY7C1315BV18-200BZXC?

All CY7C1315BV18-200BZXC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1315BV18-200BZXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1315BV18-200BZXC part is unused and in its original packaging.

Return procedure for CY7C1315BV18-200BZXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1315BV18-200BZXC Tags

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