Infineon Technologies CY7C1315JV18-300BZC

Overview

CY7C1315JV18 from Cypress Semiconductor is a 18-Mbit QDR® II SRAM with 512K × 36 organization, designed for high-bandwidth packet buffering in network switches and routers. It supports concurrent read/write operations at 300 MHz (600 MT/s DDR), features separate K/K and C/C clock domains, 1.5-cycle read latency with DLL enabled, and operates on 1.8 V core / 1.4–1.8 V I/O supply.

For engineers reviewing the CY7C1315JV18 datasheet, CY7C1315JV18 pinout, CY7C1315JV18 application, or CY7C1315JV18 equivalent, key selection criteria include burst depth (4-word), byte write select granularity (BWS0–BWS3), echo clock (CQ/CQ) timing support, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

The CY7C1315JV18 implements true dual-port QDR II architecture: independent read and write ports share a multiplexed 17-bit address bus but use separate clock domains-K/K for address/data capture and C/C for output data strobing. Its internal 128K × 36 memory array is organized across four sub-arrays to enable full-depth expansion via RPS/WPS control.

It integrates a Delay Lock Loop (DLL) for precise 1.5-cycle read latency alignment and supports DLL-off mode for QDR I–compatible 1-cycle latency at ≤167 MHz. Echo clocks CQ/CQ are free-running, synchronized to C/C, and used by system controllers for deterministic data capture without flight-time compensation circuitry.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm, RoHS-compliant, with 0.8 mm ball pitch and standard JEDEC MO-245AC footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Compared with AS7C331024B-20BIN and MT47H64M16HR-37E, CY7C1315JV18 uniquely delivers deterministic 1.5-cycle latency, concurrent dual-port operation, and echo-clock–assisted capture - making it irreplaceable in hardware-accelerated packet processing where microsecond-level jitter cannot be tolerated.

Availability

CY7C1315JV18 is available at Aetrix Electronics and suitable for network switch fabric design, telecom line card development, high-speed test instrumentation, and AI accelerator prototyping requiring stable component supply and long-term lifecycle assurance.

Supply support for CY7C1315JV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial applications, with headquarters in San Jose, CA.

CY7C1315JV18 belongs to Cypress's QDR II SRAM product line, engineered specifically for deterministic, high-bandwidth buffering in packet-switched infrastructure where bus turnaround latency and timing jitter must be eliminated.

FAQ

What is the minimum supported operating frequency for CY7C1315JV18?

The device has no specified minimum clock frequency - it operates down to DC (0 Hz) in DLL-off mode, retaining full functionality including burst reads/writes and port select control. However, DLL lock requires ≥100 MHz; below that, DLL remains unlocked and read latency defaults to 1 cycle (QDR I mode).

Can CY7C1315JV18 operate with only a single clock domain (K-only) instead of differential K/K and C/C?

Yes - the device supports single-clock mode where K drives both address/data capture and output data timing; C/C inputs are ignored, and Q[35:0] are clocked by K/K. In this mode, echo clocks CQ/CQ derive from K/K, and DLL remains functional for latency control.

How does ZQ pin calibration affect signal integrity in a multi-SRAM system?

ZQ calibration adjusts all 36 Q[35:0] drivers and both CQ/CQ outputs to match a target 48 Ω impedance (0.2 × 240 Ω). This ensures consistent edge rates and reflection behavior across all devices on the same bus, reducing timing skew and eye closure in point-to-multipoint topologies.

Is JTAG boundary scan supported during normal memory operation?

Yes - TDI, TDO, TCK, and TMS pins operate independently of memory function. Boundary-scan testing can be performed while the device is idle or even during active read/write cycles, provided TMS remains stable during instruction shifts and TCK complies with JTAG timing specs (≤10 MHz recommended).