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Infineon Technologies CY7C1318BV18-200BZI

Part No.:
CY7C1318BV18-200BZI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1318BV18-200BZI.pdf
Description:
IC SRAM 18MBIT PARALLEL 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,062

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Product details

Overview

CY7C1318BV18 from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous pipelined DDR-II SRAM with 300 MHz clock support, 2-word burst architecture, and HSTL I/O compatible with 1.8V core supply. It delivers 600 Mbps data transfer via double-data-rate interface and integrates echo clocks (CQ/CQ) for precise high-speed data capture in networking packet buffers and baseband memory subsystems.

For engineers reviewing the CY7C1318BV18 datasheet, CY7C1318BV18 pinout, CY7C1318BV18 application, or CY7C1318BV18 equivalent, key selection criteria include DDR-II timing alignment, 165-ball FBGA (13 × 15 × 1.4 mm) mechanical fit, 18-bit data width matching, DLL-enabled data placement accuracy, and HSTL-18 output drive compliance.

Technical Context

This device implements a synchronous pipelined architecture where all address, control, and data inputs are registered on rising edges of complementary K/K clocks. Read and write operations execute as 2-word bursts, with internal burst counter driven by A0 for sequential 18-bit word access across the 1M × 18 array.

Output timing is synchronized to C/C clocks, while echo clocks CQ/CQ-phase-aligned to C/C-enable source-synchronous data capture at the controller. The integrated Delay Lock Loop (DLL) eliminates clock skew between data and echo clocks, and ZQ pin supports dynamic output impedance calibration to match 50 Ω system buses.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density18 Mbit (1,048,576 × 18 bits), enabling compact high-bandwidth buffer storage without external width expansion.
Maximum Clock Frequency200 MHz K/K input clock, supporting sustained 400 MT/s effective throughput with DDR interface.
Data InterfaceDouble Data Rate (DDR) with C/C output clocks and CQ/CQ echo clocks - eliminates need for board-level trace length matching.
I/O StandardHSTL Class I (1.8V VDDQ), with variable drive strength and expanded output voltage range (1.4V–VDDQ) for noise margin optimization.
Power Supply1.8V core (VDD) and 1.8V I/O (VDDQ), enabling direct integration into low-voltage FPGA/ASIC memory interfaces.
Package165-ball Fine-Pitch BGA (13 mm × 15 mm × 1.4 mm), RoHS-compliant with 0.8 mm ball pitch for high-density PCB routing.
Timing ControlOn-chip Delay Lock Loop (DLL) aligns CQ/CQ edges to data valid window, reducing setup/hold margin requirements at 200 MHz operation.

Pinout & Package

Delivered in a 165-ball FBGA package (13 × 15 × 1.4 mm) with 0.8 mm ball pitch. Pin assignments follow JEDEC MO-245AC standard and support HSTL-18 signaling with dedicated echo clock outputs and impedance calibration interface.

Pin/TerminalCircuit RoleDesign Meaning
DQ[17:0]Synchronous bidirectional data bus18-bit DDR data path latched on K/K for writes and driven on C/C (or K/K) for reads; automatically tri-stated when deselected.
K / KComplementary input clocksRising edges latch all synchronous inputs (address, R/W, LD, BWS); define burst initiation and write sampling timing.
C / CComplementary output clocksControl read data edge alignment; used with CQ/CQ to deskew flight time mismatches across multiple SRAMs on same bus.
CQ / CQEcho clocks referenced to C/CFree-running, phase-aligned copies of C/C - simplify controller data capture without per-device delay tuning.
BWS[1:0]Byte write select (active LOW)Enable selective 9-bit byte writes: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; preserves unselected bytes during partial writes.
A[19:0]Multiplexed address inputs20-bit address bus; A0 drives internal burst counter for sequential 18-bit word access within each 2-word burst.
ZQOutput impedance calibration referenceConnects to external 50 Ω resistor to ground to calibrate DQ/CQ output drivers to 50 Ω ±10%, ensuring signal integrity on stub-loaded buses.
DOFFDLL disable controlActive-LOW pin to bypass Delay Lock Loop - used only in legacy timing modes; disables DLL-based data alignment.

Key Features

FeatureDesign Value
2-word DDR burst architectureReduces address bus toggling frequency by 50% versus single-word access, lowering EMI and simplifying controller address generation logic.
Integrated Delay Lock Loop (DLL)Aligns CQ/CQ edges to center of data valid window at 200 MHz, relaxing PCB trace length matching requirements by up to 150 ps.
HSTL-18 I/O with ZQ calibrationEnables impedance-matched 50 Ω drive into parallel-terminated buses, supporting >15 cm trace lengths at 400 MT/s without signal integrity degradation.
165-ball FBGA mechanical footprintStandardized package shared across CY7C13xxBV18 family - allows drop-in replacement between 1M×18 and 512K×36 variants in same PCB layout.
JTAG 1149.1 test access portSupports boundary scan testing of SRAM interconnects and enables in-system verification of clock/data path timing margins.

Applications

Telecom Packet BufferingBaseband Signal Processing

Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line cards before classification or forwarding.

IC Role / Device Role / Timing Role: High-throughput, low-latency burst-access memory buffer interfaced to network processor's DDR memory controller.

Use Value: 2-word burst + echo clocks enable deterministic 200 MHz read/write cycles with <1 ns jitter tolerance, meeting ITU-T G.8262 PRC holdover timing requirements.

Use Scenario: Holding intermediate FFT/IFFT results and filter coefficients in 4G/LTE femtocell baseband units.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as coefficient RAM and sample buffer for multi-channel digital downconverters.

Use Value: DLL-aligned CQ/CQ outputs eliminate per-SRAM deskew circuitry, reducing FPGA pin count by 4 and PCB layer count by 1 in dual-SRAM configurations.

Industrial Motion Controller MemoryTest Equipment Pattern Memory

Use Scenario: Storing real-time servo position profiles and encoder feedback history in CNC motion controllers.

IC Role / Device Role / Timing Role: Deterministic latency memory mapped to microcontroller's external bus interface with burst-aligned address sequencing.

Use Value: 1.8V HSTL I/O ensures compatibility with modern ARM Cortex-R real-time MCUs and reduces power by 35% vs. 3.3V QDR SRAM alternatives.

Use Scenario: Holding high-speed digital stimulus/response patterns in automated test equipment (ATE) channel cards.

IC Role / Device Role / Timing Role: Burst-mode pattern store synchronized to ATE timing generator using K/K and C/C clock domains.

Use Value: ZQ-calibrated outputs maintain <5% eye height variation across 32-channel parallel test setups, improving pattern fidelity at 400 MT/s.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1320BV18Same DDR-II architecture, 512K × 36 organization (18 Mbit), 19-bit address bus, BWS[3:0] for 36-bit byte writes.Requires wider 36-bit data bus and different burst addressing; suited for systems needing higher per-cycle data width over depth.Select when system data path is 32+ bits and burst efficiency favors 36-bit over 18-bit transfers.
IS42S16160J-6BLISDRAM (not SRAM), 256Mbit, 16M × 16, 166 MHz clock, no DLL or echo clocks, asynchronous refresh required.Lacks deterministic latency and DDR-II timing precision; unsuitable for real-time buffering where sub-ns jitter matters.Consider only for cost-sensitive non-real-time applications where refresh overhead and variable latency are acceptable.

Compared with CY7C1320BV18, CY7C1318BV18 offers deeper 1M-word depth at 18-bit width - better for sequential streaming with limited bus width. Versus IS42S16160J-6BLI, it provides zero-refresh, fixed-latency operation essential for deterministic real-time systems.

Availability

CY7C1318BV18 is available at Aetrix Electronics and suitable for telecom packet buffering, baseband signal processing, and industrial motion controller designs requiring stable component supply and long-term obsolescence management.

Supply support for CY7C1318BV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets.

The CY7C13xxBV18 DDR-II SRAM product line targets deterministic-latency, high-bandwidth buffering in FPGA- and ASIC-based systems where DDR SDRAM's refresh overhead and variable access timing are unacceptable.

FAQ

What is the function of the DOFF pin on CY7C1318BV18?

The DOFF (DLL Turn Off) pin is an active-LOW control that disables the internal Delay Lock Loop. When grounded, the DLL is bypassed and output timing reverts to fixed-delay paths referenced directly to K/K clocks. This mode increases data-to-clock skew by up to 300 ps and is intended only for backward compatibility or specific timing validation scenarios-not for normal operation.

Can CY7C1318BV18 operate with only K and K clocks, without C and C?

Yes. In single-clock mode, CY7C1318BV18 uses K and K for both input registration and output data timing. Read data is driven on rising edges of K/K instead of C/C, and CQ/CQ are generated relative to K/K. This mode simplifies clock distribution but sacrifices the flight-time deskewing capability provided by independent C/C clocks.

How does ZQ pin calibration affect signal integrity?

ZQ calibration adjusts the output driver impedance of DQ, CQ, and CQ pins to match the system data bus characteristic impedance (typically 50 Ω). Using a 50 Ω resistor from ZQ to ground sets output impedance to 10 Ω (0.2 × 50 Ω), minimizing reflections and maintaining >75% eye height at 400 MT/s on 10 cm FR4 traces - critical for multi-drop DDR bus reliability.

What is the role of BWS[1:0] in CY7C1318BV18 write operations?

BWS[1:0] are active-LOW byte write select signals controlling 9-bit segments of the 18-bit DQ bus: BWS0 enables writes to DQ[8:0], BWS1 to DQ[17:9]. When either is HIGH, the corresponding 9-bit byte remains unchanged during the write cycle. This enables partial updates without read-modify-write sequences - essential for efficient coefficient table updates in DSP applications.

CY7C1318BV18-200BZI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1318BV18-200BZI FAQ

1.How can I place an order for CY7C1318BV18-200BZI through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1318BV18-200BZI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of CY7C1318BV18-200BZI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1318BV18-200BZI is usually 5 days.

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CY7C1318BV18-200BZI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1318BV18-200BZI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1318BV18-200BZI?

For technical support, including CY7C1318BV18-200BZI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1318BV18-200BZI requirements.

6.How does Aetrix verify that CY7C1318BV18-200BZI is sourced from the original manufacturer or authorized distributors?

All CY7C1318BV18-200BZI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1318BV18-200BZI meets industry standards.

7.What is the process for return or replacement of CY7C1318BV18-200BZI?

All CY7C1318BV18-200BZI units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1318BV18-200BZI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1318BV18-200BZI part is unused and in its original packaging.

Return procedure for CY7C1318BV18-200BZI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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