Infineon Technologies CY7C1318KV18-250BZC
- Part No.:
- CY7C1318KV18-250BZC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-LBGA
- Datasheet:
-
CY7C1318KV18-250BZC.pdf
- Description:
- IC SRAM 18MBIT PAR 165FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,438
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CY7C1318KV18-250BZC from Cypress Semiconductor is a 18-Mbit (1M × 18) DDR II synchronous SRAM with two-word burst architecture, 250 MHz maximum clock frequency, 1.8 V core supply, and HSTL I/O compatible with 1.5 V/1.8 V VDDQ. It delivers 900 MB/s peak bandwidth via double-data-rate transfers at 500 Mbps per pin and supports precise timing control using dual input clocks (K/K) and echo clocks (CQ/CQ). Used in high-speed networking buffers and packet processing ASIC interfaces.
For engineers reviewing the CY7C1318KV18-250BZC datasheet, CY7C1318KV18-250BZC pinout, CY7C1318KV18-250BZC application, or CY7C1318KV18-250BZC equivalent, key selection criteria include read latency configuration (1-cycle vs. 1.5-cycle via DOFF), burst-addressing behavior, HSTL drive strength programmability, and FBGA-165 package thermal/mechanical constraints for multi-SRAM memory subsystems.
Technical Context
The device implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternating rising edges of K and K. Read data is registered and driven synchronously on C/C (or K/K in single-clock mode), with echo clocks CQ/CQ phase-aligned to output data for simplified capture at the controller.
It features on-chip PLL for accurate data placement, JTAG 1149.1 test access port, and programmable output impedance via ZQ pin (0.2 × RQ calibration resistor to ground). Write operations use self-timed internal logic, while byte write select (BWS0/BWS1) enables granular 9-bit writes without disturbing adjacent bytes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 18 Mbit (1,048,576 × 18 bits); supports 1M-word × 18-bit addressing with linear burst increment. |
| Max Clock Frequency | 250 MHz (K/K input); defines maximum sustained transaction rate and limits system-level timing margin. |
| Data Rate | 500 Mbps per DQ pin (DDR at 250 MHz); enables 900 MB/s aggregate bandwidth across 18-bit bus. |
| Read Latency | Configurable: 1 cycle (DOFF = LOW) or 1.5 cycles (DOFF = HIGH); directly impacts pipeline depth and controller wait-state logic. |
| Supply Voltages | VDD = 1.8 V ± 0.1 V (core); VDDQ = 1.5 V or 1.8 V (I/O); allows interoperability with 1.5 V or 1.8 V memory controllers. |
| Package | 165-ball FBGA (13 mm × 15 mm × 1.4 mm); provides 0.8 mm ball pitch, thermal performance suitable for multi-SRAM stacks. |
| Operating Temperature | 0 °C to +70 °C (commercial grade); validated for stable operation in ambient-controlled embedded systems. |
Pinout & Package
Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, RoHS-compliant Pb-free option available.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[17:0] | Synchronous bidirectional data bus | 18-bit DDR data path; inputs sampled on K/K rising edges during writes; outputs driven on C/C rising edges during reads with echo-clock alignment. |
| K / K | Positive/negative input clocks | Primary timing references for all synchronous inputs; address and control latched on alternating K/K edges to halve address bus toggle rate. |
| C / C | Positive/negative output data clocks | Deskew-capable clocks for read data; enable board-level flight-time matching across multiple SRAMs in parallel configurations. |
| CQ / CQ | Echo clocks referenced to C/C | Free-running, phase-synchronized copies of C/C; simplify controller data capture by eliminating per-pin skew compensation logic. |
| DOFF | Read latency mode select | Active-HIGH selects 1.5-cycle latency (DDR-II mode); LOW enables 1-cycle latency (DDR-I compatibility). |
| BWS0 / BWS1 | Byte write select (active-low) | Control 9-bit write granularity: BWS0 → DQ[8:0], BWS1 → DQ[17:9]; enables partial-word updates without read-modify-write overhead. |
| ZQ | Output impedance calibration input | Connects to external resistor to ground to calibrate DQ/CQ/CQ driver impedance to 0.2 × RQ; prevents signal integrity degradation on high-speed buses. |
Key Features
| Feature | Design Value |
|---|---|
| Two-word burst addressing | Reduces external address bus toggling by 50% versus non-burst SRAMs, lowering EMI and PCB routing complexity. |
| Programmable HSTL output drive | Adjustable strength via ZQ calibration ensures consistent signal integrity across voltage/temperature/process corners. |
| Dual-clock domain support | Independent K/K for inputs and C/C for outputs decouples controller timing from memory access latency, easing system synchronization. |
| JTAG 1149.1 boundary scan | Enables production-level interconnect testing and in-system debug without requiring additional test fixtures or probes. |
| Self-timed write circuitry | Eliminates need for external write-strobe timing control; guarantees reliable write completion independent of clock skew or jitter. |
Applications
| High-Speed Packet Buffer | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs with strict latency budgets. IC Role / Device Role / Timing Role: Low-latency, burst-access SRAM serving as first-level buffering between MAC and traffic manager; operates at 250 MHz with 1-cycle read latency (DOFF = LOW). Use Value: Enables deterministic 40 ns read access time and eliminates pipeline stalls during back-to-back packet bursts. |
Use Scenario: Frame buffering in carrier-grade optical transport equipment requiring ECC-free, fast-access memory with long MTBF. IC Role / Device Role / Timing Role: Synchronous DDR II SRAM interfacing with FPGA-based framer logic; uses C/C and CQ/CQ for skew-insensitive data capture across 12+ devices. Use Value: Achieves >99.999% uptime via robust HSTL signaling, temperature-stable timing, and JTAG-testable interconnects. |
| Baseband Processing Cache | Industrial Real-Time Controller Buffer |
|
Use Scenario: Temporary storage of OFDM symbol coefficients in LTE/5G baseband processors before FFT/IFFT execution. IC Role / Device Role / Timing Role: Burst-mode SRAM providing 18-bit parallel coefficient access synchronized to DSP clock domain via K/K and C/C. Use Value: Supports 250 MHz sustained throughput required for real-time symbol processing without DMA bottlenecks. |
Use Scenario: Deterministic I/O mapping buffer in PLC motion controllers where jitter must remain below 5 ns. IC Role / Device Role / Timing Role: Low-jitter, self-timed SRAM used for cyclic process data exchange between CPU and fieldbus interface ASIC. Use Value: Guarantees sub-10 ns timing variation across temperature (0–70°C) due to on-chip PLL and matched clock paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102418BLL-250BLI | 18-Mbit (1M × 18), 250 MHz, but uses single-ended LVCMOS I/O (not HSTL); no echo clocks or ZQ calibration. | Lacks DDR-II timing precision; unsuitable for systems requiring CQ/CQ deskew or impedance-matched HSTL buses. | Select only when cost sensitivity outweighs signal integrity requirements and controller lacks echo-clock capture capability. |
| Micron MT45W16MW16BG-250:J | 18-Mbit DDR2 SDRAM (not SRAM); requires refresh, has longer latency (CL3), and different command protocol. | Not drop-in replaceable; incompatible control interface, no burst counter, and higher power under load. | Consider only if system already uses DDR2 SDRAM infrastructure and can tolerate refresh overhead and variable latency. |
Compared with IS61WV102418BLL-250BLI and MT45W16MW16BG-250:J, CY7C1318KV18-250BZC uniquely delivers true synchronous SRAM determinism, HSTL-compatible DDR-II signaling with echo clocks, and programmable impedance-critical for jitter-sensitive, multi-device memory subsystems.
Availability
CY7C1318KV18-250BZC is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, baseband processing caches, and industrial real-time controller buffers requiring stable component supply, long-lifecycle availability, and Pb-free compliance.
Supply support for CY7C1318KV18-250BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for demanding embedded and communications applications, with focus on signal integrity, timing precision, and system-level integration.
CY7C1318KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in networking, wireless infrastructure, and real-time control where asynchronous DRAM latency and refresh overhead are unacceptable.
FAQ
What is the function of the DOFF pin on CY7C1318KV18-250BZC?
The DOFF (Data Output OFF) pin configures read latency mode: when asserted HIGH, it enables 1.5-cycle DDR-II latency for improved timing margin in high-frequency systems; when LOW, it reverts to 1-cycle DDR-I latency for legacy compatibility. This setting is sampled synchronously on the K clock edge and affects all subsequent read operations until changed.
Can CY7C1318KV18-250BZC operate with only K clock (no K) in single-clock mode?
Yes - the device supports single-clock mode where K is tied HIGH and K is used as the sole input clock. In this mode, all synchronous inputs (address, R/W, BWS) are latched on K rising edges, and read data is driven on K/K edges. C/C clocks remain optional but recommended for optimal timing control; CQ/CQ still track K in this configuration.
How does ZQ pin calibration affect signal integrity?
ZQ connects to an external resistor (typically 240 Ω) to ground, enabling on-die calibration of DQ, CQ, and CQ output driver impedance to precisely 0.2 × RQ (e.g., 48 Ω). This matches standard HSTL-18 bus impedance, minimizing reflections and ensuring clean eye diagrams at 500 Mbps per pin - critical for reliable operation above 200 MHz.
Is CY7C1318KV18-250BZC pin-compatible with other speeds in the same family?
No - CY7C1318KV18-250BZC (250 MHz) shares identical pinout and package with -300BZC and -333BZC variants, but timing parameters (setup/hold, access time) differ. Interchangeability requires full timing validation in the target system; substituting a slower speed grade may cause setup violations, while faster grades require controller support for tighter margins.
CY7C1318KV18-250BZC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, DDR II
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-FBGA (13x15)
CY7C1318KV18-250BZC FAQ
1.How can I place an order for CY7C1318KV18-250BZC through Aetrix?
Please submit a Request for Quotation (RFQ) for CY7C1318KV18-250BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CY7C1318KV18-250BZC reliable?
The price and inventory of CY7C1318KV18-250BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1318KV18-250BZC is usually 5 days.
3.What payment methods are accepted for CY7C1318KV18-250BZC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1318KV18-250BZC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CY7C1318KV18-250BZC?
CY7C1318KV18-250BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CY7C1318KV18-250BZC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CY7C1318KV18-250BZC?
For technical support, including CY7C1318KV18-250BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1318KV18-250BZC requirements.
6.How does Aetrix verify that CY7C1318KV18-250BZC is sourced from the original manufacturer or authorized distributors?
All CY7C1318KV18-250BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1318KV18-250BZC meets industry standards.
7.What is the process for return or replacement of CY7C1318KV18-250BZC?
All CY7C1318KV18-250BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1318KV18-250BZC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CY7C1318KV18-250BZC part is unused and in its original packaging.
Return procedure for CY7C1318KV18-250BZC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CY7C1318KV18-250BZC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

