Infineon Technologies CY7C1318KV18-250BZI

Overview

CY7C1318KV18 from Cypress Semiconductor is a 18-Mbit (1M × 18) DDR II synchronous SRAM with two-word burst architecture, 333-MHz clock support, 1.8 V core supply, and HSTL I/O compatible with 1.5 V/1.8 V VDDQ. It delivers 666 MHz effective data rate via double-data-rate transfers synchronized to K/K and C/C clocks, and is used in high-bandwidth networking buffers and packet-processing ASIC/FPGA interfaces.

For engineers reviewing the CY7C1318KV18 datasheet, CY7C1318KV18 pinout, CY7C1318KV18 application, or CY7C1318KV18 equivalent, key selection criteria include DDR-II read latency (1.5 cycles with DOFF HIGH), echo clock–assisted data capture (CQ/CQ), programmable output impedance via ZQ, and FBGA-165 package compatibility with high-density PCB layouts.

Technical Context

The device implements a synchronous pipelined architecture with internal burst counter driven by A0, latching addresses on alternate rising edges of K and K. Read data is registered and driven on rising edges of C and C (or K and K in single-clock mode), enabling precise timing alignment across multi-device memory subsystems.

It integrates a PLL for accurate data placement, JTAG 1149.1 test access, and variable-drive HSTL output buffers supporting 1.4 V–VDDQ swing. The DOFF pin selects between DDR-II mode (1.5-cycle read latency) and DDR-I–compatible mode (1-cycle latency), allowing system-level timing flexibility without hardware change.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body height, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Compared with AS7C3318B-250BIN and IS45S18180J-25BLI, CY7C1318KV18 uniquely combines true SRAM determinism, DDR-II bandwidth, echo-clock–assisted capture, and programmable impedance - making it optimal for latency-critical, high-speed embedded buffering where timing predictability is non-negotiable.

Availability

CY7C1318KV18 is available at Aetrix Electronics and suitable for networking packet buffers, FPGA co-processor caches, and telecom baseband memory requiring stable component supply, long-lifecycle support, and Pb-free compliance.

Supply support for CY7C1318KV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on signal integrity and timing-critical applications.

CY7C1318KV18 belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth buffering in FPGA- and ASIC-based systems where DDR SDRAM unpredictability is unacceptable.

FAQ

What is the function of the DOFF pin on CY7C1318KV18?

The DOFF pin selects the device's read latency mode: when asserted HIGH, it enables DDR-II operation with 1.5-cycle read latency; when LOW, it reverts to DDR-I–compatible 1-cycle latency. This is a static configuration pin-no dynamic switching during operation-and directly affects timing budget allocation in the memory controller.

Can CY7C1318KV18 operate without external C and C clocks?

Yes-it supports single-clock mode using only K and K for both input registration and output driving. In this mode, C and C are unused, and CQ/CQ are generated relative to K/K. However, echo-clock–assisted data capture and board-level deskew benefits are forfeited, limiting maximum reliable operating frequency in multi-device systems.

How is output impedance calibrated using the ZQ pin?

ZQ connects to an external precision resistor (RQ) tied to ground; the device measures RQ and sets DQ/CQ output driver strength to 0.2 × RQ. This calibrates termination to match PCB trace impedance (typically 50 Ω), minimizing reflections. ZQ must never be left floating or tied to GND-connecting to VDDQ enables minimum-impedance mode.

Is CY7C1318KV18 pin-compatible with CY7C1320KV18?

No-they share the same 165-ball FBGA footprint but differ electrically and functionally: CY7C1318KV18 is 1M × 18 (18-bit data bus), while CY7C1320KV18 is 512K × 36 (36-bit bus) with four BWS inputs and different address count (20 vs. 19). Pin functions like DQ[35:0] vs. DQ[17:0] and BWS[3:0] vs. BWS[1:0] are incompatible; PCB redesign is required for substitution.