Infineon Technologies CY7C1320CV18-167BZC

Overview

CY7C1320CV18-167BZC from Cypress Semiconductor is a 18-Mbit DDR II SRAM configured as 512K × 36, operating at 167 MHz with 1.8 V core supply and HSTL I/O. It implements 2-word burst addressing, synchronous self-timed writes, and dual echo clocks (CQ/CQ) for precise data capture in high-speed memory subsystems. Used in network packet buffers and baseband processing where deterministic latency and DDR timing integrity are critical.

For engineers reviewing the CY7C1320CV18-167BZC datasheet, CY7C1320CV18-167BZC pinout, CY7C1320CV18-167BZC application, or CY7C1320CV18-167BZC equivalent, key selection criteria include DDR II burst architecture, DLL-enabled 1.5-cycle read latency, 165-ball FPBGA package compatibility, and JTAG 1149.1 test access support for production validation.

Technical Context

This device is a synchronous pipelined SRAM with DDR II interface logic, using two independent input clocks (K/K) for address/data latching and two output clocks (C/C) for data strobing. The internal burst counter increments on A0 to deliver two consecutive 36-bit words per access, reducing external address bus toggling frequency by 50%.

It supports both DLL-on mode (1.5-cycle read latency at 167 MHz) and DLL-off mode (1-cycle latency, DDR I timing), with echo clocks CQ/CQ phase-aligned to C/C to eliminate board-level skew. All synchronous inputs pass through K/K-controlled registers; outputs are registered to C/C (or K/K in single-clock mode).

Key Specifications

Pinout & Package

Package: 165-ball fine-pitch ball grid array (FPBGA), 13 mm × 15 mm × 1.4 mm body height, 0.8 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar DDR II SRAM applications.

Compared with IS45S32800J-167BLI and MT46H32M32LF-6T:F, CY7C1320CV18-167BZC uniquely delivers burst-2 DDR II with integrated echo clocks and selectable DLL mode-enabling simpler controller design, lower system-level timing margin risk, and deterministic latency in hard real-time embedded memory subsystems.

Availability

CY7C1320CV18-167BZC is available at Aetrix Electronics and suitable for network packet buffering, baseband signal processing, and industrial motion control requiring stable component supply, long-lifecycle support, and guaranteed Pb-free manufacturing compliance.

Supply support for CY7C1320CV18-167BZC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for automotive, industrial, and communications markets, with emphasis on reliability and signal integrity.

This device belongs to Cypress's DDR II SRAM product line, engineered specifically for deterministic-latency, high-bandwidth memory interfaces in FPGA- and ASIC-based systems where DDR SDRAM complexity is undesirable.

FAQ

What is the function of the DOFF pin on CY7C1320CV18-167BZC?

The DOFF (DLL Off) pin is an active-low control that disables the internal delay lock loop. When pulled low, the device operates in DDR I timing mode with 1-cycle read latency and relaxed setup/hold requirements. This mode is validated for 167 MHz operation and simplifies timing closure in systems where absolute minimum latency is prioritized over maximum bandwidth.

Can CY7C1320CV18-167BZC operate with only K and K clocks, without C and C?

Yes. In single-clock mode, the device uses K and K for both input latching and output data strobing. Read data is driven on the rising edges of K and K instead of C and C, and echo clocks CQ/CQ are generated relative to K/K. This mode eliminates the need for dedicated output clocks but sacrifices deskew capability across multi-device memory channels.

How does ZQ pin calibration affect signal integrity?

ZQ connects to an external precision resistor (typically 240 Ω) to ground, enabling on-die calibration of DQ and CQ output driver impedance. This achieves ±10% matching to the PCB trace characteristic impedance (e.g., 50 Ω), reducing reflections, overshoot, and timing uncertainty-critical for maintaining eye opening at 334 MT/s data rates.

Is CY7C1320CV18-167BZC pin-compatible with CY7C1318CV18-167BZC?

No. Although both use the same 165-ball FPBGA package, their pinouts differ significantly: CY7C1318CV18-167BZC has DQ[17:0], BWS[1:0], and 20 address lines (A[19:0]), while CY7C1320CV18-167BZC uses DQ[35:0], BWS[3:0], and 19 address lines (A[18:0]). Direct substitution requires PCB redesign and controller firmware updates.