Infineon Technologies CY7C1320KV18-333BZXC

Overview

CY7C1320KV18-333BZXC from Cypress Semiconductor is a 18-Mbit DDR II synchronous SRAM configured as 512K × 36, operating at 333 MHz with double-data-rate (666 MT/s) I/O, 1.8 V core supply, HSTL-compatible interfaces, and integrated echo clocks (CQ/CQ) for precise high-speed data capture in networking and telecom buffer applications.

For engineers reviewing the CY7C1320KV18-333BZXC datasheet, CY7C1320KV18-333BZXC pinout, CY7C1320KV18-333BZXC application, or CY7C1320KV18-333BZXC equivalent, key selection considerations include its two-word burst architecture, DOFF-configurable 1-cycle vs. 1.5-cycle read latency, dual-clock domain timing (K/K and C/C), and 165-ball FBGA package compatibility with high-density memory subsystems.

Technical Context

The CY7C1320KV18 implements a synchronous pipelined SRAM core with DDR II architecture, using separate rising-edge-triggered K/K clocks for address/control/data input registration and C/C clocks for output data timing. Its burst counter increments A0 to deliver two consecutive 36-bit words per access.

It supports both dual-clock mode (with independent C/C and CQ/CQ for flight-time deskewing) and single-clock mode (using K/K for outputs), and features on-chip PLL for accurate data placement, JTAG 1149.1 test access, and programmable ZQ impedance calibration referenced to external resistor or VDDQ.

Key Specifications

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm × 1.4 mm body, RoHS-compliant, with 0.8 mm ball pitch.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed synchronous SRAM applications.

Compared with AS7C331024B-20BIN and IS61WV102432BLL-10TLI, CY7C1320KV18-333BZXC delivers 2.2× higher effective bandwidth via DDR, eliminates external clock deskew components through CQ/CQ, and supports impedance tuning for signal integrity - making it uniquely suited for next-generation telecom and high-end industrial buffers.

Availability

CY7C1320KV18-333BZXC is available at Aetrix Electronics and suitable for telecom line cards, network packet buffers, baseband processing units, and industrial real-time controllers requiring stable component supply, long-lifecycle support, and verified DDR-II timing compliance.

Supply support for CY7C1320KV18-333BZXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CY7C1320KV18 belongs to Cypress's DDR II SRAM product line, designed specifically for high-bandwidth, low-latency buffering in infrastructure equipment where deterministic timing, signal integrity, and multi-device synchronization are critical.

FAQ

What is the function of the DOFF pin on CY7C1320KV18-333BZXC?

The DOFF (Data Output OFF) pin configures read latency: when asserted HIGH, it enables DDR-II mode with 1.5-cycle latency for improved timing margin in high-speed systems; when LOW, it reverts to DDR-I mode with 1-cycle latency for backward compatibility. This setting directly affects the timing relationship between C/C and data valid windows, and must be held stable during operation.

Can CY7C1320KV18-333BZXC operate without external C and C clocks?

Yes - the device supports single-clock mode where K and K serve as both input and output clocks. In this mode, CQ and CQ are generated relative to K/K instead of C/C, and data is driven on K/K rising edges. However, echo clock precision and flight-time deskew benefits are lost, limiting maximum reliable speed to ~250 MHz in complex layouts.

How does ZQ calibration work on CY7C1320KV18-333BZXC?

ZQ calibration adjusts output driver impedance by comparing internal reference current against an external resistor (RQ) tied between ZQ and GND. The resulting 0.2 × RQ impedance tunes DQ and CQ drive strength to match PCB trace impedance. If ZQ is tied to VDDQ, the device enters minimum-impedance mode (≈20 Ω), suitable for short, well-terminated traces.

Is CY7C1320KV18-333BZXC pin-compatible with CY7C1318KV18-333BZXC?

No - although both share the same 165-ball FBGA package and many signal names, their address widths differ (CY7C1320KV18 uses A[18:0]; CY7C1318KV18 uses A[19:0]), and BWS pin count differs (4 vs. 2). Their DQ bus widths (36-bit vs. 18-bit) and internal array mapping are incompatible, requiring PCB redesign for substitution.