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Infineon Technologies CY7C1321CV18-167BZC

Part No.:
CY7C1321CV18-167BZC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
165-LBGA
Datasheet:
AetrixCY7C1321CV18-167BZC.pdf
Description:
IC SRAM 18MBIT PAR 165FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,319

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Product details

Overview

CY7C1321CV18 from Cypress Semiconductor is a 18-Mbit synchronous pipelined DDR-II SRAM configured as 512K × 36, operating at up to 300 MHz with 600 Mbps DDR data transfer rate, 1.5-cycle read latency (DLL enabled), and HSTL I/O compatible with 1.8V core supply - deployed in high-bandwidth packet buffering for telecom line cards and network switches.

For engineers reviewing the CY7C1321CV18 datasheet, CY7C1321CV18 pinout, CY7C1321CV18 application, or CY7C1321CV18 equivalent, key selection criteria include burst depth (4-word), byte write select support (BWS[3:0]), echo clock timing (CQ/CQ), DLL-controlled latency mode, and FBGA-165 package compatibility with high-speed PCB layout constraints.

Technical Context

This SRAM implements a synchronous pipelined architecture with dual-clock DDR interface: K/K clocks latch addresses and write data on alternating rising edges, while C/C clocks drive read data with echo clocks CQ/CQ aligned to output timing. Burst counter uses A[1:0] to sequence four 36-bit words per access.

The device supports two operational modes: DLL-enabled DDR-II mode (1.5-cycle read latency, up to 300 MHz) and DLL-disabled DDR-I mode (1-cycle latency, max 167 MHz). Write operations use on-chip self-timed control, and impedance matching is managed via ZQ pin referenced to external resistor.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (512K × 36 organization)
Max Clock Frequency 300 MHz (K/K input), enabling 600 Mbps DDR data rate
Read Latency 1.5 cycles with DLL enabled; 1 cycle with DOFF = LOW
I/O Standard HSTL Class I inputs/outputs, VDDQ = 1.8V, VREF-biased
Burst Length Fixed 4-word burst, sequential addressing via internal counter
Write Select Four active-low byte write enables (BWS[3:0]) for 36-bit data granularity
Package 165-ball FBGA (13 mm × 15 mm × 1.4 mm), RoHS-compliant

Pinout & Package

Package: 165-ball Fine-Pitch Ball Grid Array (FBGA), 13 mm × 15 mm footprint, 1.4 mm height, 0.8 mm ball pitch, JEDEC MO-245 compliant.

Pin/Terminal Circuit Role Design Meaning
DQ[35:0] Synchronous bidirectional data bus 36-bit DDR data I/O; sampled on K/K rising edges for writes, driven on C/C rising edges for reads; tri-stated when deselected
K / K Primary input clocks Rising edges capture address, R/W, BWS, LD; define all synchronous timing references for command initiation
C / C Output data clocks Deskew-capable complementary clocks driving Q outputs; enable board-level flight-time compensation across multiple SRAMs
CQ / CQ Echo clocks Free-running, phase-aligned copies of C/C; simplify controller-side data capture without additional routing delay matching
BWS[3:0] Byte write select inputs Independent active-low enables for each 9-bit byte within 36-bit word; preserve unselected bytes during partial writes
LD Load strobe Active-low signal defining start of burst transaction; latches address and R/W state for full 4-word sequence
ZQ Impedance calibration reference Connects to external resistor to ground (RQ); sets output driver impedance to 0.2 × RQ for HSTL bus termination matching
DOFF DLL disable control Active-low pin forcing DDR-I timing mode (1-cycle latency); required for operation at ≤167 MHz without DLL lock

Key Features

Feature Design Value
DDR-II architecture with DLL Enables precise 1.5-cycle read latency and stable 300 MHz operation via on-die delay lock loop
Four independent byte write enables Allows granular 9-bit updates within 36-bit word without read-modify-write overhead
Echo clock outputs (CQ/CQ) Eliminates need for controller-side deskew logic by delivering phase-matched clock copies with data
HSTL Class I I/O with variable drive Supports impedance tuning via ZQ and adjustable output strength for signal integrity across varied trace lengths
JTAG 1149.1 test port Enables boundary-scan testing and system-level diagnostics without dedicated test pads

Applications

Telecom Packet Buffering High-Speed Switch Fabric Memory

Use Scenario: Line card memory for storing incoming/outgoing Ethernet or SONET frames before switching or processing.

IC Role / Device Role / Timing Role: High-throughput, low-latency shared buffer supporting 4-word burst reads/writes synchronized to switch fabric clock domain.

Use Value: 36-bit bus width matches common switch ASIC data paths; 600 Mbps DDR bandwidth sustains multi-gigabit line rates without bottlenecks.

Use Scenario: Buffering between ingress and egress ports in modular Layer 2/L3 enterprise switches.

IC Role / Device Role / Timing Role: Synchronous pipelined SRAM acting as central crossbar memory with deterministic 1.5-cycle read latency under DLL mode.

Use Value: Echo clocks (CQ/CQ) align data capture timing across multiple parallel SRAMs, reducing controller timing margin requirements.

Network Processor Co-Processor Memory Test Equipment Pattern Memory

Use Scenario: Offloading packet classification, deep packet inspection, or flow table lookups from main NPU core.

IC Role / Device Role / Timing Role: Dedicated burst-access memory mapped to NPU's high-speed bus, using BWS[3:0] for partial rule updates.

Use Value: Byte-selectable writes avoid full-word overwrites during dynamic rule insertion, preserving concurrent lookup integrity.

Use Scenario: Storing stimulus/response patterns in automated test equipment (ATE) for semiconductor validation.

IC Role / Device Role / Timing Role: Deterministic latency memory interfaced to pattern generator logic with strict setup/hold timing control.

Use Value: DLL-off mode (1-cycle latency at 167 MHz) provides guaranteed timing margins for reproducible test vector execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1319CV18 1M × 18 organization (18-bit bus), same 165-BGA package and DDR-II architecture Lower data width suits 18-bit datapaths (e.g., legacy DSP interfaces); reduced density requires more devices for same capacity Select when system bus width is 18-bit and 9-Mbit capacity suffices; avoids 36-bit routing complexity
IS61WV102436BLL-15BLI 1024K × 36 QDR-II SRAM, 150 MHz, no DLL, separate read/write ports QDR architecture eliminates read/write contention but lacks echo clocks and burst flexibility of DDR-II Prefer for applications requiring simultaneous read/write (e.g., FIFO-like behavior) where DLL-free timing simplifies design

Compared with CY7C1319CV18, CY7C1321CV18 delivers double the effective bandwidth per device via 36-bit bus width and maintains tighter timing control through DLL and echo clocks; versus IS61WV102436BLL-15BLI, it trades QDR concurrency for lower latency DDR burst access and integrated impedance calibration.

Availability

CY7C1321CV18 is available at Aetrix Electronics and suitable for telecom infrastructure, high-speed switch fabric, network processor co-processing, and ATE pattern memory applications requiring stable component supply and long-term industrial availability.

Supply support for CY7C1321CV18 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for networking, automotive, and industrial systems, with emphasis on signal integrity and timing precision.

CY7C1321CV18 belongs to Cypress's DDR-II synchronous SRAM product line, engineered specifically for deterministic-latency, high-throughput buffering in packet-switched infrastructure where burst efficiency and clock deskew are critical.

FAQ

What is the minimum supported clock frequency for CY7C1321CV18?

The device has no specified minimum clock frequency. It operates down to DC in DLL-enabled mode, and functional operation is guaranteed across the full industrial temperature range (–40°C to +85°C) at any frequency up to 300 MHz. Timing parameters scale linearly with clock period, allowing flexible low-frequency use in power-sensitive applications.

How does the ZQ pin affect signal integrity in a multi-SRAM system?

ZQ calibrates output driver impedance to match the system data bus characteristic impedance (typically 50 Ω). With a 250 Ω resistor to ground, outputs are tuned to 50 Ω (0.2 × 250 Ω), minimizing reflections and ensuring clean eye diagrams across all 36 DQ lines - especially critical when multiple CY7C1321CV18 devices share a common bus.

Can CY7C1321CV18 operate without connecting C and C clocks?

Yes. When C and C are unconnected or tied to VDDQ/VSS, the device defaults to single-clock mode using K and K for both input sampling and output driving. In this mode, CQ and CQ become copies of K and K, and timing reverts to DDR-I specifications with 1-cycle latency - verified up to 167 MHz per the selection guide.

What happens to BWS[3:0] during a read operation?

BWS[3:0] are ignored during read operations. These inputs are sampled only on rising edges of K/K during write cycles and have no effect on read data output, address decoding, or burst sequencing. They remain don't-care inputs during read transactions and may be left unconnected or held static.

CY7C1321CV18-167BZC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
165-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, DDR II
Memory Size:
18Mbit
Memory Organization:
512K x 36
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-FBGA (13x15)

CY7C1321CV18-167BZC FAQ

1.How can I place an order for CY7C1321CV18-167BZC through Aetrix?

Please submit a Request for Quotation (RFQ) for CY7C1321CV18-167BZC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CY7C1321CV18-167BZC reliable?

The price and inventory of CY7C1321CV18-167BZC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CY7C1321CV18-167BZC is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CY7C1321CV18-167BZC transactions.

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CY7C1321CV18-167BZC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CY7C1321CV18-167BZC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CY7C1321CV18-167BZC?

For technical support, including CY7C1321CV18-167BZC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CY7C1321CV18-167BZC requirements.

6.How does Aetrix verify that CY7C1321CV18-167BZC is sourced from the original manufacturer or authorized distributors?

All CY7C1321CV18-167BZC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CY7C1321CV18-167BZC meets industry standards.

7.What is the process for return or replacement of CY7C1321CV18-167BZC?

All CY7C1321CV18-167BZC units undergo pre-shipment inspection (PSI). If there is an issue with CY7C1321CV18-167BZC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CY7C1321CV18-167BZC part is unused and in its original packaging.

Return procedure for CY7C1321CV18-167BZC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CY7C1321CV18-167BZC Tags

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